Abstract:
An optical transmitter comprises a monolithic transmitter photonic integrated circuit (TxPIC) chip that includes an array of modulated sources formed on the PIC chip and having different operating wavelengths approximating a standardized wavelength grid and providing signal outputs of different wavelengths. A wavelength selective combiner is formed on the PIC chip having a wavelength grid passband response approximating the wavelength grid of the standardized wavelength grid. The signal outputs of the modulated sources optically coupled to inputs of the wavelength selective combiner to produce a combined signal output from the combiner. A first wavelength tuning element coupled to each of the modulated sources and a second wavelength tuning element coupled to the wavelength selective combiner. A wavelength monitoring unit is coupled to the wavelength selective combiner to sample the combined signal output. A wavelength control system coupled to the first and second wavelength tuning elements and to said wavelength monitoring unit to receive the sampled combined signal output. The wavelength control system adjusts the respective wavelengths of operation of the modulated sources to approximate or to be chirped to the standardized wavelength grid and for adjusting the optical combiner wavelength grid passband response to approximate the standardized wavelength grid.
Abstract:
The presence or absence and the intensity of refractive index distribution are easily controlled with high reproducibility without depending on the fabricating process accuracy. InGaAs well layers (14a) and (14b), which have a narrow bandgap and a high refractive index, are enclosed by a lower barrier layer (13), an intermediate barrier layer (15), an upper barrier layer (16) and a buried layer (18) of GaAsN-based materials of a wide bandgap. Then, by adjusting the nitrogen crystal mixture ratio of the GaAsN-based materials that constitute the barrier layers (13), (15) and (16) and the buried layer (18), the presence or absence and the intensity of the refractive index distribution are controlled. Thus, the refractive index distribution is easily controlled with high reproducibility without considering the configuration of a diffraction grating (17), a refractive index balance with respect to the buried layer (18) and so on, i.e., without depending on the fabricating process accuracy.
Abstract:
A method is disclosed for optimizing optical channel signal demultiplexing in a monolithic receiver photonic integrated circuit (RXPIC) chip by providing an integrated channel signal demultiplexing with multiple waveguide input verniers provided to an WDM signal demultiplexer. The RxPIC chip may optionally include an integrated amplifier in at least some of the waveguide input verniers. The RxPIC chip may be comprised of, in monolithic form, a plurality of optional semiconductor optical amplifiers (SOAs) at the input of the chip to receive a WDM signal from an optical link which is provided along a plurality of waveguide input verniers to an integrated optical demultiplexer, such as, but not limited to, an arrayed waveguide grating (AWG), as a WDM signal demultiplexer. Thus, optical outputs from the respective semiconductor laser amplifiers are provided as vernier inputs to the optical demultiplexer forming a plurality of input verniers at the input to the optical demultiplexer. One of the vernier inputs to the chip is selected for operation in the RxPIC chip that corresponds to an optimum performance in matching a WDM channel signal wavelength grid of the received WDM signal to a wavelength grid of the on-chip optical demultiplexer.
Abstract:
The present invention is a combination of in-situ etching with a grating mask pattern comprised only of semiconductor material, together with the fabrication of a protective layer beneath the semiconductor grating mask that protects the semiconductor material that readily oxidises. As such the present invention is based on a two-stage process. First the grating pattern is defined in a semiconductor material, wherein this pattern is called the semiconductor grating mask. The semiconductor grating mask sits on top of a layer of protective material, which in turn is on top of the semiconductor material that readily oxidises, wherein the protective layer prevents oxidation of the material below. The semiconductor structure is then moved to a reactor, where, in the second stage, the mask pattern is transferred into the underlying protective layer and the semiconductor material that readily oxidises, by in-situ etching. The grating is then overgrown in the same reactor without exposing the etched grating to the atmosphere. The overgrown material protects the underlying semiconductor material from oxidation when the structure is removed from the reactor.
Abstract:
A photonic device including an array of lasers providing light to an array of electro-absorption modulators, both on a common substrate. In some embodiments the lasers are in a closely spaced array and lase at different wavelengths, providing with associated electro-absorption modulators a compact wavelength selectable laser.
Abstract:
Method and apparatus for utilizing a probe card for testing in-wafer photonic integrated circuits (PICs) comprising a plurality of in-wafer photonic integrated circuit (PIC) die formed in the surface of a semiconductor wafer where each PIC comprises one or more electro-optic components with formed wafer-surface electrical contacts. The probe card has a probe card body with at least one row of downwardly dependent, electrically conductive contact probes. The probe body is transversely translated over the surface of the wafer to a selected in-wafer photonic integrated circuit (PIC) die. Then, the contact probes of the probe card are brought into engagement with surface electrical contacts of the selected photonic integrated circuit (PIC) die for testing the operation of electro-optic components in the selected in-wafer photonic integrated circuit (PIC) die.
Abstract:
An on-chip photodiode is provided in a photonic integrated circuit (PIC) on a semiconductor chip to monitor or check for antireflection qualities of an AR coating applied to the front facet of the semiconductor chip.
Abstract:
A method of increasing the monomolecular recombination and the immunity to noise of a continuously tunable laser is disclosed. A concentration of recombination centers in the range of about 1×1016 cm−3 to about 1×1018 cm−3 in the tuning region of the laser device is achieved by doping the waveguide layer with impurity atoms, by irradiating the waveguide layer with high energy particles or by varying the growth conditions of the waveguide layer to introduce native point defects due to lattice mismatch. This way, the monomolecular recombination is increased and the radiative recombination over low current ranges is reduced. By increasing the monomolecular recombination, the immunity to noise is improved but the tuning efficiency is reduced. Nevertheless, only a minimal effect on the tuning efficiency is noted over high current ranges and, therefore, the overall tuning range is only insignificantly changed.
Abstract translation:公开了增加连续可调激光器的单分子重组和抗噪声的方法。 在激光器件的调谐区域中,在约1×10 16 cm -3至约1×10 18 cm -3范围内的复合中心浓度通过用杂质原子掺杂波导层来实现,通过 用高能粒子照射波导层,或通过改变波导层的生长条件来引入由于晶格失配引起的自然点缺陷。 这样,单分子重组增加,并且在低电流范围内的辐射复合减少。 通过增加单分子重组,提高了对噪声的抗扰性,但调谐效率降低。 然而,在高电流范围内仅注意到对调谐效率的最小影响,因此整体调谐范围只有微不足道的变化。
Abstract:
A laser source or a plurality of laser sources in a photonic integrated circuit (PIC) are provided with an electrical contact that is either segmented or is connected to a series of vernier resistor segments for supply of current to operate the laser source. In either case, at least one segment of the laser contact or at least one vernier resistor segment can be trimmed in order to vary the amount of current supplied to the laser source resulting in a change to its current density and, thus, a change in its operational wavelength while maintaining the current supplied to the laser source constant.
Abstract:
A method of operating an array of integrated laser sources formed as an integrated array on a single substrate in a photonic integrated circuit (PIC) where the laser sources are designed for operation at different targeted emission wavelengths which, in toto, at least approximate a grid of spatial emission wavelengths. A first wavelength tuning element is associated with each laser source and is adjusted over time so that each laser source maintains its targeted emission wavelength. As an alternative, the drive current to each laser source may be initially set so that each laser source operates at its targeted emission wavelength. Thereafter, adjustments to retune the laser sources to their targeted emission wavelengths are accomplished by the first wavelength tuning elements. The outputs of the laser sources may be combined via an optical combiner to produce a single combined output from the PIC. A second wavelength tuning element is associated with the optical combiner so that the passband response or wavelength grid of the optical combiner may be also monitored and adjusted to better approximate the wavelength grid of the laser sources.