公开(公告)号：US09064634B2

公开(公告)日：2015-06-23

申请号：US13817964

申请日：2011-08-23

Applicant: Tatsuya Nakamura

Inventor： Tatsuya Nakamura

IPC: H05K7/14 ,  H01L23/48 ,  H01G4/248 ,  H01G4/228 ,  H01G2/10 ,  H01R3/00 ,  H01G2/06 ,  H01G9/08 ,  H01G9/12 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01G2/10 ,  H01G2/06 ,  H01G9/08 ,  H01G9/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651

Abstract: A capacitor holder comprising a body part formed in a shape into which a tip end of a capacitor can be fitted; and a lead part which is fixed to the body part and can be soldered to a predetermined fitting location. The body part has an opening through which the tip end of the capacitor is exposed, and an end surface abutment portion which abuts a tip end surface of the capacitor in a vicinity of a pressure valve, when the tip end of the capacitor is fitted into the body part. The lead part is fixed to the body part at a position opposite to the capacitor with respect to a reference plane, which is a plane includes the tip end surface of the capacitor abutting the end surface abutment portion.

Abstract translation: 一种电容器保持器，包括形成为能够安装电容器的尖端的形状的主体部分; 以及引导部，其固定到主体部并且可以被焊接到预定的配合位置。 主体部分具有露出电容器的前端的开口，以及当电容器的前端装配到电容器的前端时与端子表面抵接部分邻接电容器的顶端表面 身体部位。 引线部分相对于参考平面固定在与电容器相对的位置处的主体部分，该基准面是包括抵靠端表面抵接部分的电容器的末端表面的平面。

公开(公告)号：US20150144385A1

公开(公告)日：2015-05-28

申请号：US14407405

申请日：2013-06-21

Applicant: KYOCERA Corporation

Inventor： Yoshio Ohashi ,  Kunihide Shikata

IPC: H05K1/18 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K1/181 ,  C04B37/025 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/55 ,  C04B2237/59 ,  C04B2237/86 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/10462 ,  H05K2201/2063 ,  Y02P70/611 ,  H01L2924/00014

Abstract: The circuit board includes a ceramic sintered body and a metal wiring layer provided on at least one primary surface thereof with a glass layer interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface of the ceramic sintered body is viewed, the ratio of the length of an interface between the glass layer and the metal wiring layer to a length of the glass layer in a direction along the primary surface is 1.25 to 1.80.

Abstract translation: 电路基板包括陶瓷烧结体和在其至少一个主表面上设置有玻璃层的金属布线层，并且当观察到垂直于陶瓷烧结体的主表面的电路板的横截面时， 玻璃层和金属布线层之间的界面的长度与沿着主表面的方向上的玻璃层的长度的比率为1.25至1.80。

公开(公告)号：US08913399B2

公开(公告)日：2014-12-16

申请号：US13533698

申请日：2012-06-26

Applicant: Gil Ju Jin ,  Jung Lim Park ,  Jae Yk Kim

Inventor： Gil Ju Jin ,  Jung Lim Park ,  Jae Yk Kim

IPC: H05K7/00 ,  B06B1/06 ,  H05K3/30 ,  H05K1/18 ,  A61B8/00

CPC classification number: A61B8/4494 ,  A61B8/00 ,  A61B8/4461 ,  A61B8/4483 ,  B06B1/0622 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/055 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10083 ,  H05K2201/10462 ,  Y02P70/613

Abstract: Disclosed herein are a printed circuit board (PCB) and a probe including the same. The probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract translation: 这里公开了印刷电路板（PCB）和包括该电路板的探针。 探头包括换能器，具有经由面对面接触与换能器接触的图案部分的PCB以及将换能器接合到PCB的图案部分的接合构件。 PCB的接合部分设置有图案部分以增加接合部分的接合面积，并且允许接合部件不仅接触接合部分的金属层，而且接触其电绝缘部分，从而改善接合 传感器和PCB之间的力。 结果，换能器可以可靠地结合到PCB，使得可以防止换能器的性能由于PCB和换能器之间的不良连接而劣化。

公开(公告)号：US20120300424A1

公开(公告)日：2012-11-29

申请号：US13577447

申请日：2010-11-16

Applicant: Fei Lv ,  Hu Ge ,  Jie Song

Inventor： Fei Lv ,  Hu Ge ,  Jie Song

IPC: H05K7/00 ,  H05K3/00

CPC classification number: H05K3/3426 ,  H03H9/1007 ,  H05K3/3494 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10462 ,  Y02P70/613 ,  Y10T29/49124

Abstract: The disclosure discloses a crystal device without an external package, which comprises: a crystal body (21) and two pins (22), wherein the crystal body (21) is a cylindrical body port of a crystal with the external package (15) and redundant pins (12, 13) being removed, and is arranged on a Printed Circuit Board (PCB) horizontally. The two pins (22) are connected to a bottom end of the crystal body (21). Extension parts of the two pins (22) are inclined towards the PCB, and become horizontal when they reach the PCB and are welded to the PCB, and a spacing between the two pins (22) increases gradually. The disclosure also discloses a method for manufacturing a crystal device without a package. The device and method can reduce the cost and make the welding more convenient.

Abstract translation: 本发明公开了一种没有外部封装的晶体器件，其包括：晶体（21）和两个引脚（22），其中晶体（21）是具有外部封装（15）的晶体的圆柱形主体端口，以及 冗余引脚（12,13）被去除，并且被水平布置在印刷电路板（PCB）上。 两个销（22）连接到晶体（21）的底端。 两个销（22）的延伸部分朝向PCB倾斜，并且当它们到达PCB并且被焊接到PCB时变得水平，并且两个销（22）之间的间隔逐渐增加。 本公开还公开了一种用于制造没有封装的晶体器件的方法。 该装置和方法可以降低成本，使焊接更方便。

公开(公告)号：US20120026698A1

公开(公告)日：2012-02-02

申请号：US12847276

申请日：2010-07-30

Applicant: Chun-Kong CHAN ,  Chi Ching CHEN

Inventor： Chun-Kong CHAN ,  Chi Ching CHEN

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H05K1/0231 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10462 ,  H05K2201/10757 ,  H05K2201/2018

Abstract: An integrated circuit board includes a bridging filtering capacitor, a bypass capacitor, a thermistor, and a varistor. The integrated circuit board further includes an electrolytic capacitor set having a plurality of electrolytic capacitors, which are arranged in parallel and adjacent to each other, and a mounting frame for grouping the electrolytic capacitors. The present invention uses the above elements to reduce the vertical height, the horizontal width, and the occupied area. Therefore, the overall dimension of the circuit board can be reduced to make the electronic devices smaller, especially for thin electronic devices such as LCD TVs and screens.

Abstract translation: 集成电路板包括桥接滤波电容器，旁路电容器，热敏电阻器和变阻器。 集成电路板还包括具有彼此平行并相邻布置的多个电解电容器的电解电容器组和用于分组电解电容器的安装框架。 本发明使用上述元件来减小垂直高度，水平宽度和占用面积。 因此，可以减小电路板的整体尺寸，使电子装置更小，特别是对于液晶电视和屏幕等薄型电子设备。

公开(公告)号：US08013683B2

公开(公告)日：2011-09-06

申请号：US12584192

申请日：2009-09-01

Applicant: Junichi Arai

Inventor： Junichi Arai

IPC: H03L1/00

CPC classification number: H03L1/04 ,  H05K1/0206 ,  H05K1/0212 ,  H05K2201/09781 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2203/165

Abstract: A constant-temperature type crystal oscillator includes: a crystal unit that is installed on one principal surface of a circuit substrate, and chip resistors, which function as heating elements, and which are installed on the other principal surface of the circuit substrate so as to face a principal surface of the crystal unit, the chip resistors heating up the crystal unit to keep an operational temperature of the crystal unit constant. A heating metal film facing the principal surface of the crystal unit is provided on the one principal surface of the circuit substrate. A heat conducting material is interposed between the principal surface of the crystal unit and the heating metal film to perform thermal coupling therebetween. The heating metal film is thermally coupled to electrode terminals of the chip resistors via a plurality of electrode through holes.

Abstract translation: 恒温型晶体振荡器包括：安装在电路基板的一个主表面上的晶体单元和用作加热元件的片式电阻器，并且安装在电路基板的另一个主表面上，以便 面对晶体单元的主表面，芯片电阻加热晶体单元以保持晶体单元的工作温度恒定。 在电路基板的一个主表面上设置面对晶体单元的主表面的加热金属膜。 导热材料插入在晶体单元的主表面和加热金属膜之间，以在它们之间进行热耦合。 加热金属膜通过多个电极通孔热耦合到芯片电阻器的电极端子。

公开(公告)号：US07470984B2

公开(公告)日：2008-12-30

申请号：US11388536

申请日：2006-03-23

Applicant: Yin Men Lai ,  Benjamin Selvaraj ,  Gangadevi Payedathaly

Inventor： Yin Men Lai ,  Benjamin Selvaraj ,  Gangadevi Payedathaly

IPC: H01L23/12 ,  H01L29/00

CPC classification number: H05K3/3442 ,  H01C1/02 ,  H01C1/148 ,  H01C7/001 ,  H05K2201/10462 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: Embodiments of the present invention provide an apparatus, a system, and a method, and include a generally rectilinear body having a first surface and a second surface. The second surface is substantially perpendicular to the first surface. An electrically operative element is disposed on the first surface, and has opposite ends. Spaced apart terminations are disposed on the second surface, and are electrically coupled with the opposite ends of the electrically operative element. The terminations are designed to be coupled with a substrate.

Abstract translation: 本发明的实施例提供了一种装置，系统和方法，并且包括具有第一表面和第二表面的大致直线的主体。 第二表面基本上垂直于第一表面。 电操作元件设置在第一表面上，并具有相对端。 间隔开的终端设置在第二表面上，并且与电操作元件的相对端电耦合。 端子被设计成与衬底耦合。

公开(公告)号：US20080285246A1

公开(公告)日：2008-11-20

申请号：US12117126

申请日：2008-05-08

Applicant: Yoshihiro KAWAMURA

Inventor： Yoshihiro KAWAMURA

IPC: H05K7/02

CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/10015 ,  H05K2201/10462 ,  H05K2201/10598 ,  H05K2201/2036 ,  H05K2203/0191 ,  H05K2203/0588 ,  Y10T29/43 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A resist 7 of a predetermined thickness is formed on a printed circuit board 1 except electrode-opposing portions 1a (FIG. 1A), and a silk screen printed layer 9 of a predetermined thickness is formed on the resist 7 (FIG. 1B). Thereafter, a concave portion 2b of a film capacitor 2 is bonded to the silk screen printed layer 9 by an adhesive double coated tape 6 of a predetermined thickness in such a manner that electrode portions 2a of the film capacitor 2 are opposed respectively to the electrode-opposing portions 1a of the printed circuit board 1 (FIG. 1D). Here, the sum of the thicknesses of the resist 7, silk screen printed layer 9 and adhesive double coated tape 6 is not smaller than a concave-convex height difference L1 of the film capacitor 2, and with this arrangement the electrode portions 2a of the film capacitor 2 are prevented from interfering with the printed circuit board 1. An adhesive is not used, and therefore a problem with respect to environment-affecting substances is solved, and at the same time difficulty involved in the control of a bonding strength can be overcome.

Abstract translation: 除了电极对置部分1a（图1A）之外，在印刷电路板1上形成预定厚度的抗蚀剂7，并且在抗蚀剂7上形成预定厚度的丝网印刷层9（图1 B）。 此后，通过具有预定厚度的粘合剂双面胶带6将薄膜电容器2的凹部2b与丝网印刷层9接合，使得薄膜电容器2的电极部分2a分别相对于 印刷电路板1的电极对置部分1a（图1D）。 这里，抗蚀剂7，丝网印刷层9和粘合剂双面胶带6的厚度的总和不小于膜电容器2的凹凸高度差L 1，并且通过这种布置，电极部分2a 可以防止薄膜电容器2干扰印刷电路板1。 不使用粘合剂，因此解决了对环境影响物质的问题，同时可以克服粘合强度的控制困难。

公开(公告)号：US20080224786A1

公开(公告)日：2008-09-18

申请号：US12075589

申请日：2008-03-12

Applicant: James L. Stolpman ,  Thomas A. Knecht ,  Jerry L. Shirar

Inventor： James L. Stolpman ,  Thomas A. Knecht ,  Jerry L. Shirar

IPC: H03B5/04 ,  H03L1/04

CPC classification number: H03B5/04 ,  H03B5/36 ,  H03L1/04 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/3405 ,  H05K3/3436 ,  H05K3/403 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10651

Abstract: An oscillator assembly includes an oscillator circuit that is configured to generate a frequency signal. A temperature compensation circuit is in communication with the oscillator circuit and adapted to adjust the frequency signal in response to changes in temperature. The oscillator and temperature compensation circuits are located within an oven. A heater and a temperature sensor in communication with the heater are also both located in the oven. The temperature sensor is adapted to directly control the heater in response to changes in temperature. In one embodiment, the oscillator components are mounted to a ball grid array substrate which, in turn, is mounted on a printed circuit board. In this embodiment, a resonator overlies the ball grid array substrate and a lid covers and defines an oven and enclosure for the resonator and the ball grid array substrate. The oscillator and temperature compensation circuit are defined on the ball grid array substrate.

Abstract translation: 振荡器组件包括被配置为产生频率信号的振荡器电路。 温度补偿电路与振荡器电路通信，并且适于根据温度变化调整频率信号。 振荡器和温度补偿电路位于烤箱内。 与加热器连通的加热器和温度传感器也都位于烤箱中。 温度传感器适用于根据温度变化直接控制加热器。 在一个实施例中，振荡器部件被安装到球栅阵列基板，该栅格阵列基板又安装在印刷电路板上。 在该实施例中，谐振器覆盖在球栅阵列基板上，并且盖覆盖并限定用于谐振器和球栅阵列基板的烤箱和外壳。 振荡器和温度补偿电路定义在球栅阵列基板上。

公开(公告)号：US20070249188A1

公开(公告)日：2007-10-25

申请号：US10588142

申请日：2004-11-30

Applicant: Wolfgang Mueller ,  Thomas Uhland ,  Dirk Schmidt ,  Ibrahim Degirmenci ,  Frank Distler

Inventor： Wolfgang Mueller ,  Thomas Uhland ,  Dirk Schmidt ,  Ibrahim Degirmenci ,  Frank Distler

IPC: H05K1/18 ,  H01R13/46

CPC classification number: H05K3/301 ,  H05K1/18 ,  H05K3/0061 ,  H05K5/0056 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/2045

Abstract: A device for the shakeproof accommodation of electrical special components and/or electrical circuits, particularly in a development as a second component set in a control unit, is made up of a carrier, onto which a circuit substrate, having special components fastened to it, is mounted in an electrically insulated manner over a partial surface, preferably by adhesion

Abstract translation: 用于特殊组件和/或电路的防震容纳装置，特别是作为设置在控制单元中的第二组件的开发中的装置由载体组成，其上具有紧固到其上的特殊部件的电路基板， 优选通过粘附而以部分表面以电绝缘方式安装