公开(公告)号：US11830967B2

公开(公告)日：2023-11-28

申请号：US17304938

申请日：2021-06-28

申请人： NICHIA CORPORATION

发明人： Takeshi Tamura

IPC分类号： H01L33/60 ,  G02F1/13357 ,  H01L33/46 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/50

CPC分类号： H01L33/60 ,  G02F1/133603 ,  G02F1/133611 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  G02F1/133606 ,  H01L2933/0091

摘要： A light emitting module includes a substrate; at least one light emitting device each including: at least one light emitting element each including: a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and electrodes on the lower surface of the semiconductor layered structure; a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, at least one recessed portion being formed in the lower surface of the light-reflecting part; and a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure; an electrically conductive bonding member configured to bond the substrate and the electrodes of each of the at least one light emitting device; and a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least one light emitting device.

公开(公告)号：US20230352641A1

公开(公告)日：2023-11-02

申请号：US18217103

申请日：2023-06-30

申请人： Tianma Advanced Display Technology Institute (Xiamen) Co., Ltd.

发明人： Xiaoli LIU ,  Cao LIU

IPC分类号： H01L33/60 ,  H01L25/16 ,  H01L33/54

CPC分类号： H01L33/60 ,  H01L25/167 ,  H01L33/54 ,  H01L2933/005 ,  H01L2933/0058

摘要： Provided are a display panel, a display device, and a preparation method of a display panel. The display panel includes a substrate, an array layer, light-emitting devices, and a first film layer. The array layer is disposed on the substrate. The light-emitting devices are arranged on a side of the array layer facing away from the substrate. The first film layer is disposed on the side of the array layer facing away from the substrate, the first film layer is provided with at least one groove, and at least part of the at least one groove is located between adjacent light-emitting devices.

公开(公告)号：US20230352638A1

公开(公告)日：2023-11-02

申请号：US18347243

申请日：2023-07-05

申请人： Shanghai Tianma Micro-Electronics Co., Ltd.

发明人： Liqun CHEN ,  Xiaoli LIU

IPC分类号： H01L33/54 ,  H01L33/60 ,  H01L25/075

CPC分类号： H01L33/54 ,  H01L33/60 ,  H01L25/0753

摘要： A display panel includes a substrate, a plurality of light-emitting devices, a first encapsulation layer, and a first dielectric layer. The first encapsulation layer includes a first portion and a second portion at least partially surrounding the first portion. The first dielectric layer is located between the first encapsulation layer and the plurality of light-emitting devices. Along the direction perpendicular to the plane of the display panel, a distance between a surface of the first portion away from at least one light-emitting device of the plurality of light emitting devices and a surface of the third portion away from the at least one light-emitting device is smaller than a distance between a surface of the second portion away from the at least one light-emitting device and a surface of the fourth portion away from the at least one light-emitting device.

公开(公告)号：US20230343758A1

公开(公告)日：2023-10-26

申请号：US18215841

申请日：2023-06-29

申请人： SEOUL SEMICONDUCTOR CO., LTD.

发明人： Masahiko YAMAKAWA ,  Noriaki YAGI ,  Kumpei KOBAYASHI

IPC分类号： H01L25/075 ,  H05B45/20 ,  H05B47/10 ,  H05B47/16 ,  F21S2/00 ,  H01L33/00 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56

CPC分类号： H01L25/0753 ,  H05B45/20 ,  H05B47/10 ,  H05B47/16 ,  F21S2/00 ,  H01L33/00 ,  H01L33/50 ,  H01L33/504 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  F21W2131/405

摘要： A light emitting device including a substrate, a first light emitter to emit light having a first color temperature, and a second light emitter to emit light having a second color temperature, in which the first light emitter has a first converter including first phosphors and a first resin, each first phosphor having different half-value widths, the second light emitter has a second converter including second phosphors and a second resin, each second phosphor having different peak wavelengths, at least one phosphor of the first converter has a half-value width of 33 nm to 110 nm, a distance between peak wavelengths of at least two phosphors of the second converter is 150 nm or less, and at least one phosphor of the first converter has a particle size of 5 um to 50 um.

公开(公告)号：US20230335683A1

公开(公告)日：2023-10-19

申请号：US17928965

申请日：2021-06-03

申请人： VueReal Inc.

发明人： Gholamreza CHAJI

IPC分类号： H01L33/50 ,  H01L33/60 ,  H01L33/00 ,  H01L33/54

CPC分类号： H01L33/502 ,  H01L33/60 ,  H01L33/005 ,  H01L33/54 ,  H01L27/156

摘要： The disclosure is related to creating different functional micro devices by integration of functional tuning materials and to creating encapsulation capsules to protect these materials. The disclosure also relates to a solid state device and a method to convert a color of a light emitting device into another color.

公开(公告)号：US11784292B2

公开(公告)日：2023-10-10

申请号：US17881512

申请日：2022-08-04

申请人： Seoul Viosys Co., Ltd.

发明人： Jong Min Jang ,  Chang Youn Kim

IPC分类号： H01L33/54 ,  H01L33/56 ,  H01L33/08 ,  H01L25/13 ,  H01L33/00 ,  H01L33/62

CPC分类号： H01L33/54 ,  H01L25/13 ,  H01L33/0095 ,  H01L33/08 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/005

摘要： A light emitting device including a printed circuit board having a front surface and a rear surface, at least one light emitting source disposed on the front surface to emit light in a direction away from the printed circuit board, and a molding layer surrounding the light emitting source, in which the light emitting source includes a light emitting structure, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, the molding layer covers an upper surface of the substrate and a fine concavo-convex part is formed on a surface of the molding layer exposed to the outside, and the molding layer has a first thickness to transmit at least a fraction of light emitted from the light emitting source, and includes a filler to change a direction of emitted light.

公开(公告)号：US11784290B2

公开(公告)日：2023-10-10

申请号：US16854967

申请日：2020-04-22

申请人： NICHIA CORPORATION

发明人： Keiichi Maki

IPC分类号： H01L33/38 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  B32B17/10 ,  H01L25/075

CPC分类号： H01L33/54 ,  H01L33/38 ,  H01L33/387 ,  H01L33/56 ,  H01L33/62 ,  B32B17/10036 ,  H01L25/0753 ,  H01L2224/16225 ,  H01L2924/07811 ,  H01L2933/005 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/12041

摘要： A light-emitting device includes a pair of light-transmissive insulator sheets disposed opposite to each other and two types of light-transmissive electroconductive layers disposed on a common one of or separately on one and the other of the pair of light-transmissive insulator sheets, and at least one light-emitting semiconductor each provided with a cathode and an anode which are individually and electrically connected to the two types of the light-transmissive electroconductive layers. The electrical connection and mechanical bonding between the members are improved by a light-transmissive elastomer which is between the pair of light-transmissive insulator sheets. A method in which a light-emitting semiconductor element and a light-transmissive electroconductive member are subjected to vacuum hot-pressing.

公开(公告)号：US20230317883A1

公开(公告)日：2023-10-05

申请号：US18103726

申请日：2023-01-31

申请人： Samsung Display Co., LTD.

发明人： Jong Chan LEE ,  Jin Taek KIM ,  Hyun KIM ,  Jeong Su PARK ,  Sok Ho LEE ,  Woong Hee JEONG ,  Jung Eun HONG

IPC分类号： H01L33/38 ,  H01L33/62 ,  H01L33/54 ,  H01L33/00

CPC分类号： H01L33/382 ,  H01L33/62 ,  H01L33/54 ,  H01L33/005 ,  H01L2933/0016 ,  H01L2933/0066

摘要： A display device comprises a pad electrode disposed on a substrate, a pad electrode upper layer disposed on the pad electrode, a first pad electrode capping layer disposed on the pad electrode upper layer, a second pad electrode capping layer disposed on the first pad electrode capping layer, a protective layer disposed on the second pad electrode capping layer, and a capping layers disposed on the protective layer. The protective layer comprises a polymer resin and scattering particles. The protective layer comprises a first pad opening exposing the second pad electrode capping layer.

公开(公告)号：US11777068B2

公开(公告)日：2023-10-03

申请号：US17885181

申请日：2022-08-10

申请人： ROHM CO., LTD.

发明人： Masahiko Kobayakawa ,  Kazuhiro Mireba ,  Shintaro Yasuda ,  Junichi Itai ,  Taisuke Okada

IPC分类号： H01L33/62 ,  H01L23/495 ,  H01L23/31 ,  H01L23/488 ,  H01L33/48 ,  H01L33/52 ,  H01L25/075 ,  H01L33/64 ,  H01L33/54 ,  H01L23/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L25/16

CPC分类号： H01L33/62 ,  H01L23/31 ,  H01L23/48 ,  H01L23/488 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/49503 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49568 ,  H01L23/49575 ,  H01L25/0753 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/64 ,  H01L33/642 ,  H01L33/647 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

公开(公告)号：US20230282623A1

公开(公告)日：2023-09-07

申请号：US18015371

申请日：2020-08-20

申请人： HCP TECHNOLOGY CO., LTD.

发明人： Zhiqiang HUANG ,  Wuwen PANG ,  Wenrong ZHUANG ,  Ming SUN ,  Jingquan LU

IPC分类号： H01L25/075 ,  H01L33/54 ,  H01L33/44

CPC分类号： H01L25/0753 ,  H01L33/54 ,  H01L33/44 ,  H01L2933/005 ,  H01L2933/0025

摘要： Provided are a display module and a manufacturing method therefor, an LED display panel and an LED display apparatus. The display module includes a board, a pixel unit array, an encapsulation layer and a black ink layer. The board has a front surface and a back surface. The pixel unit array is disposed on the front surface of the board. The encapsulation layer covers the region where the pixel unit array is located. A side surface of the encapsulation layer forms a slope surface at an edge of the front surface of the board. The black ink layer covers the encapsulation layer.