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公开(公告)号：US20190246496A1
公开(公告)日：2019-08-08
申请号：US16269194
申请日：2019-02-06
申请人： IBIDEN CO., LTD.
发明人： Youhong WU
CPC分类号： H05K1/0298 , H01L24/11 , H01L24/14 , H05K3/4644 , H05K2201/095
摘要： A printed wiring board includes a base insulating layer, a conductor layer including first and second pads, a solder resist layer covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump including base plating layer in the first opening and top plating layer on the first base layer, and a second bump including base plating layer in the second opening and top plating layer on the base layer. The second opening has smaller diameter than the first opening, and the second bump has smaller diameter than the first bump. The first base layer has flat upper surface or first recess having depth of 20 μm or less in upper central portion. The second base layer has flat upper surface, raised portion in upper central portion, or second recess shallower than the first recess in the upper central portion.
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公开(公告)号：US20190198446A1
公开(公告)日：2019-06-27
申请号：US16232144
申请日：2018-12-26
申请人： IBIDEN CO., LTD.
发明人： Yoji SAWADA
IPC分类号： H01L23/538 , H01L25/18 , H01L23/498 , H01L23/00
CPC分类号： H01L23/5386 , H01L23/49827 , H01L23/49838 , H01L24/16 , H01L25/18 , H01L2224/16145 , H01L2224/16227 , H01L2224/16238
摘要： A printed wiring board includes a core substrate, and a build-up layer formed on the substrate. The substrate includes core material, third conductor layer, fourth conductor layer, and through-hole conductors. The build-up layer is formed on the core material and third conductor layer and includes insulating layers, first conductor layers, and via conductors. The build-up layer has central area and outer peripheral area such that the via conductors include central area via conductors and outer peripheral area via conductors, diameter of central area via conductor is smaller than diameter of outer peripheral area via conductor, the outermost first conductor layer includes first pads to mount first electronic component and second pads to mount second electronic component, the first and second pads are connected to each other via the central via conductors, and the lowermost insulating layer does not have the via conductors in the central area of the build-up layer.
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公开(公告)号：US10314166B2
公开(公告)日：2019-06-04
申请号：US14996298
申请日：2016-01-15
申请人： IBIDEN CO., LTD.
发明人： Nobuhisa Kuroda , Hirofumi Futamura
IPC分类号： H05K1/02 , H01L23/498 , H01L21/48 , H01L23/538
摘要： A printed wiring board for mounting a semiconductor element includes an insulating substrate, a first conductor structure on first side of the substrate, and a second conductor structure on second side of the substrate. The substrate has a first area and a second area outside the first area such that when a semiconductor element is mounted on the first side, the first area is directly below the element, the first structure has a first area conductor structure in the first area and a second area conductor structure in the second area, and the first structure is formed such that first ratio is set greater than second ratio, where the first ratio is obtained by dividing volume of the first area structure by area of the first area structure, and the second ratio is obtained by dividing volume of the second area structure by area of the second area structure.
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公开(公告)号：US20190143313A1
公开(公告)日：2019-05-16
申请号：US16245258
申请日：2019-01-11
发明人： Shinnosuke GOTO , Kenta NOMURA , Takumi TOJO , Takeru YOSHIDA , Hiromasa SUZUKI
摘要： The present invention relates to a honeycomb structured body including a honeycomb fired body in which multiple through-holes are arranged longitudinally in parallel with one another with a partition wall therebetween, wherein the honeycomb fired body is an extrudate containing ceria-zirconia composite oxide particles, θ-alumina particles, γ-alumina, and α-alumina fibers, and the honeycomb fired body has a porosity of 55 to 70%.
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公开(公告)号：US20190124768A1
公开(公告)日：2019-04-25
申请号：US16167850
申请日：2018-10-23
申请人： IBIDEN CO., LTD.
摘要： A printed wiring board includes a core substrate and first and second build-up layers. The substrate includes a core layer, through-hole conductors formed in through holes such that each through hole has first opening tapering from first toward second surface of the core layer, and second opening tapering from second toward first surface of the core layer, and first and second through-hole lands directly connected to the through-hole conductors. Each build-up layer includes an insulating layer, via conductors, via lands, an outermost insulating layer, an outermost conductor layer, and outermost via conductors. Each of the through-hole lands, via lands and outermost conductor layers includes a metal foil, a seed layer and an electrolytic plating film. The foils have mat surfaces such that the mat surfaces of the via lands has ten-point average roughness smaller than ten-point average roughness of the mat surfaces of the through-hole lands and outermost conductor layers.
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公开(公告)号：US20190124766A1
公开(公告)日：2019-04-25
申请号：US16166392
申请日：2018-10-22
申请人： IBIDEN CO., LTD.
CPC分类号： H05K1/115 , H05K1/0298 , H05K1/16 , H05K3/4644 , H05K2201/09227 , H05K2201/09727 , H05K2201/09827 , H05K2203/107 , H05K2203/1572
摘要： A printed wiring board includes: a core substrate having a core layer and first and second conductor layers; a first build-up layer including a first insulating layer, an inner first conductor layer, an outermost first insulating layer, and an outermost first conductor layer; and a second build-up layer including a second insulating layer, an inner second conductor layer, an outermost second insulating layer, and an outermost second conductor layer. Each conductor layer includes metal foil, seed layer, and electrolytic plating film, t1/T1, t2/T2, u1/U1 and u2/U2 are smaller than 1, and s1/S1 and s2/S2 are larger than 1, where t1, t2, u1, u2, s1 and s2 are electrolytic plating film thicknesses of the first and second and outermost and inner first and second conductor layers, T1, T2, U1 , U2, S1 and S2 are metal foil thicknesses of the first and second and outermost and inner first and second conductor layers.
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公开(公告)号：US10271430B2
公开(公告)日：2019-04-23
申请号：US15682721
申请日：2017-08-22
申请人： IBIDEN CO., LTD.
发明人： Teruyuki Ishihara , Hiroyuki Ban , Haiying Mei
IPC分类号： H05K1/11 , H05K1/02 , H05K1/03 , H05K1/18 , H05K3/02 , H05K3/06 , H05K3/46 , H05K3/40 , H05K3/24 , H05K3/28 , H05K3/34
摘要： A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and first via conductors on second surface side of the laminate, and a solder resist layer interposed between the plate and the laminate and having openings formed such that the openings are exposing the first pads. The laminate has first surface on the first surface side and second surface on the second surface side on the opposite side and includes a first resin insulating layer forming the second surface of the laminate, and the first conductors are formed through the first insulating layer such that the first vias are tapering from the first surface side toward the second surface side of the laminate and have end surfaces recessed from the second surface of the laminate on the second surface side of the laminate.
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公开(公告)号：US20190093599A1
公开(公告)日：2019-03-28
申请号：US16051803
申请日：2018-08-01
申请人： Toshio MURATA , Yoshihiro KOGA
发明人： Toshio MURATA , Yoshihiro KOGA
IPC分类号： F02G5/02
摘要： An exhaust heat recovery unit, includes: a heat exchanger that is provided inside an exhaust pipe through which exhaust gas flows, the heat exchange being formed from silicon carbide, and the heat exchanger performing heat exchange between the exhaust gas and a heat medium; and a retention member that is provided at the periphery of the heat exchanger, is formed of a ceramic sheet or an expandable graphite sheet, and is sandwiched between the exhaust pipe and the heat exchanger, thereby retaining the heat exchanger in the exhaust pipe.
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公开(公告)号：US10194569B2
公开(公告)日：2019-01-29
申请号：US15782275
申请日：2017-10-12
申请人： IBIDEN CO., LTD.
摘要： A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The ceiling portion includes a resin material and a reinforcing material, and the cap member is formed such that the side wall portion and the ceiling portion are forming an accommodation space to accommodate an electronic component.
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公开(公告)号：US20180374630A1
公开(公告)日：2018-12-27
申请号：US16019591
申请日：2018-06-27
申请人： IBIDEN CO., LTD.
摘要： A coil includes a resin substrate, a first coil structure formed on a first surface of the resin substrate, a second coil structure formed on a second surface of the resin substrate on the opposite side with respect to the first surface such that the second coil structure is formed at a position corresponding to the first coil structure, a third coil structure formed on the second surface such that the third coil structure is positioned adjacent to the second coil structure, and a fourth coil structure formed on the first surface such that the fourth coil structure is formed at a position corresponding to the third coil structure. The resin substrate is folded such that the second coil structure and the third coil structure oppose each other.
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