公开(公告)号：US20040069320A1

公开(公告)日：2004-04-15

申请号：US10681553

申请日：2003-10-07

Applicant: Semitool, Inc.

Inventor： Eric J. Bergman

IPC: B08B007/04 ,  B08B007/00 ,  B08B003/00

CPC classification number: H01L21/02054 ,  B08B3/08 ,  B08B7/00 ,  B08B2203/005 ,  B08B2230/01 ,  Y10S134/902 ,  Y10S438/906

Abstract: The invention encompasses methods for cleaning surfaces of wafers or other semiconductor articles. Oxidizing is performed using an oxidation solution which is wetted onto the surface. The oxidation solution can include one or more of: water, ozone, hydrogen chloride, sulfuric acid, or hydrogen peroxide. A rinsing step removes the oxidation solution and inhibits further activity. The rinsed surface is thereafter preferably subjected to a drying step. The surface is exposed to an oxide removal vapor to remove semiconductor oxide therefrom. The oxide removal vapor can include one or more of: acids, such as a hydrogen halide, for example hydrogen fluoride or hydrogen chloride; water; isopropyl alcohol; or ozone. The processes can use centrifugal processing and spraying actions.

公开(公告)号：US20040025901A1

公开(公告)日：2004-02-12

申请号：US10631378

申请日：2003-07-30

Applicant: Semitool, Inc.

Inventor： Eric J. Bergman ,  Jeffrey J. Dennison ,  David P. Surdock

IPC: B08B003/12

CPC classification number: H01L21/67057 ,  B08B3/045 ,  B08B3/12

Abstract: A system and method for processing a workpiece, such as a semiconductor wafer, includes a spray mechanism that rotates around the workpiece while the workpiece rests on a stationary workpiece support in a process chamber. The spray mechanism preferably includes one or more spray arms attached to a motorized rotary union via hollow elbow sections. The rotary union is attached to a fluid supply valve and preferably includes a hollow shaft through which process fluid may travel from the fluid supply valve to the spray arms. The process chamber includes a drain through which process fluid may be removed from the process chamber. A process gas and/or vapor manifold, a sonic transducer, and/or a rinsing liquid manifold may be included in the process chamber for delivering a process gas or vapor, sonic energy, and/or a rinsing liquid into the process chamber in order to enhance processing of the workpiece.

Abstract translation: 用于处理诸如半导体晶片的工件的系统和方法包括在工件搁置在处理室中的固定工件支撑件上的情况下围绕工件旋转的喷射机构。 喷雾机构优选地包括通过空心弯头部分附接到电动旋转联接器的一个或多个喷射臂。 旋转联接器附接到流体供应阀，并且优选地包括中空轴，过程流体可以通过空心轴从流体供应阀行进到喷射臂。 处理室包括排出物，工序流体可以通过该排出物从处理室移除。 处理气体和/或蒸汽歧管，声音换能器和/或冲洗液体歧管可以包括在处理室中，用于将处理气体或蒸气，声能和/或冲洗液体按顺序输送到处理室 以加强工件的加工。

公开(公告)号：US20040020513A1

公开(公告)日：2004-02-05

申请号：US10631376

申请日：2003-07-30

Applicant: Semitool, Inc.

Inventor： Eric J. Bergman

IPC: C23G001/00

CPC classification number: H01L21/6708 ,  B08B3/00 ,  B08B3/02 ,  B08B3/044 ,  B08B3/08 ,  B08B7/00 ,  B08B2203/005 ,  B08B2203/007 ,  B08B2230/01 ,  H01L21/3065 ,  H01L21/6704 ,  H01L21/67051 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K3/3426 ,  Y02P70/613 ,  Y10S134/902 ,  H01L2924/00

Abstract: A method of thinning a silicon wafer in a controllable cost-effective manner with minimal chemical consumption. The wafer is placed into a process chamber, after which ozone gas and HF vapor, are delivered into the process chamber to react with a silicon surface of the wafer. The ozone and HF vapor may be delivered sequentially, or may be mixed with one another before entering the process chamber. The ozone oxidizes the silicon surface of the wafer, while the HF vapor etches the oxidized silicon away from the wafer. The etched oxidized silicon is then removed from the process chamber. As a result, the wafer is thinned, which aids in preventing heat build-up in the wafer, and also makes the wafer easier to handle and cheaper to package. In alternative embodiments, HF may be delivered into the process chamber as an anhydrous gas or in aqueous form.

Abstract translation: 以最小的化学消耗以可控的成本有效的方式稀释硅晶片的方法。 将晶片放置在处理室中，之后将臭氧气体和HF蒸汽输送到处理室中以与晶片的硅表面反应。 可以顺序地输送臭氧和HF蒸气，或者可以在进入处理室之前彼此混合。 臭氧氧化晶片的硅表面，而HF蒸气将氧化的硅蚀刻离开晶片。 然后将蚀刻的氧化硅从处理室中取出。 结果，晶片变薄，这有助于防止晶片中的热积聚，并且还使晶片更容易处理并且更便宜的封装。 在替代实施例中，HF可以作为无水气体或以水的形式被输送到处理室中。

公开(公告)号：US20040013797A1

公开(公告)日：2004-01-22

申请号：US10200072

申请日：2002-07-19

Applicant: Semitool,Inc.

Inventor： Raymon Thompson ,  Gordon Nelson

IPC: B05D003/12

CPC classification number: H01L21/6708 ,  H01L21/67051

Abstract: A machine for processing a flat workpiece or wafer has a head, which spins the wafer between upper and lower weirs in a base. The head is spaced apart from the base by an air gap. A vacuum source attached to an exhaust opening in the base draw air through the air gap, to reduce or eliminate movement of process chemicals into the head. Corrosion of head components by process chemicals is reduced. The disadvantages of having a mechanical seal between the base and the head are also eliminated.

Abstract translation: 用于处理平坦工件或晶片的机器具有头部，其在基部中的上堰和下堰之间旋转晶片。 头部与基座间隔开一个气隙。 附着在底座中的排气口的真空源通过气隙吸引空气，以减少或消除过程化学物质进入头部的运动。 头部组分由工艺化学品腐蚀减少。 也消除了在基座和头部之间具有机械密封的缺点。

公开(公告)号：US20030051973A1

公开(公告)日：2003-03-20

申请号：US10200074

申请日：2002-07-19

Applicant: Semitool, Inc.

Inventor： Jeffry Davis

IPC: B08B003/00

CPC classification number: H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S414/138

Abstract: A workpiece handling and processing system has a interface section for loading wafers from cassettes into carriers. The wafers are lifted out of cassettes by a buffer elevator and moved into a position over an open carrier by a buffer robot. A comb elevator lifts combs entirely through the open cassette, to transfer the wafers from the buffer robot into the carrier. A process robot moves loaded carriers from the interface section to one or more process chambers in a process section. The advantages of processing wafers within a carrier are achieved within a compact space and with high throughput.

Abstract translation: 工件处理和处理系统具有用于将晶片从盒装载到载体中的接口部分。 通过缓冲电梯将晶片从盒中提出并通过缓冲机器人移动到开放载体上的位置。 梳子电梯通过打开的盒子完全提升梳子，将晶片从缓冲机器人传送到载体中。 过程机器人将加载的载体从接口部分移动到处理部分中的一个或多个处理室。 在紧凑的空间内以高产量实现在载体内处理晶片的优点。

公开(公告)号：US20020189652A1

公开(公告)日：2002-12-19

申请号：US10223974

申请日：2002-08-20

Applicant: Semitool, Inc.

Inventor： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

IPC: B08B003/00

CPC classification number: H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

Abstract: A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

Abstract translation: 用于处理半导体晶片或类似物品的方法包括在旋转晶片时旋转晶片并将其施加到晶片的第一侧的步骤。 流体通过离心力在晶片的第一侧上在所有方向上径向向外流动。 当流体从晶片的圆周边缘流出时，其被包含在环形储存器中，使得流体也流到晶片的第二侧的外部环形区域。 开口允许流体从储存器流出。 开口限定分流线的位置，超过该分隔线，流体不会在晶片的第二侧上行进。 用于处理半导体晶片或类似物品的装置包括具有由上下转子形成的处理室的反应器。 晶片支撑在转子之间。 转子由旋转电机旋转。 处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。 流体向外均匀地向各个方向流动。 晶片支架自动提升晶片，从而当转子在加工后彼此分离时，可以通过机器人将其从反应器中移除。

公开(公告)号：US20020185163A1

公开(公告)日：2002-12-12

申请号：US10202074

申请日：2002-07-23

Applicant: Semitool, Inc.

Inventor： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

IPC: B08B003/00

CPC classification number: H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

Abstract: An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

Abstract translation: 用于处理半导体晶片或类似物品的装置包括具有由上下转子形成的处理室的反应器。 晶片支撑在转子之间。 转子由旋转电机旋转。 处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。 流体向外均匀地向各个方向流动。 晶片支架自动提升晶片，从而当转子在加工后彼此分离时，它可以由机器人从反应器中移出。

公开(公告)号：US20020096202A1

公开(公告)日：2002-07-25

申请号：US10108278

申请日：2002-03-26

Applicant: Semitool, Inc.

Inventor： Dan Bexten ,  Jerry Norby

IPC: B08B003/02

CPC classification number: H01L21/67051 ,  B08B3/12 ,  B08B9/0861 ,  B08B9/32 ,  H01L21/6704 ,  Y10S134/902

Abstract: A system and method for cleaning carriers used for handling semiconductor wafers including a box cleaner having a rotor within an enclosure. Box holder assemblies on the rotor include upper and lower hooks for securing boxes to the rotor. A box door holder assembly is also provided on the rotor. The box door holder assembly preferably has a plurality of box door holding positions. Each box door holding position advantageously has a door guide and door hooks for holding a door. The box door holder assembly allows both the boxes and their doors to be cleaned with the centrifugal cleaner, avoiding the need for separate cleaning of the doors. In one configuration, the rotor is provided with an even number of box holder assemblies symmetrically spaced about the rotor and an even number of door holder assemblies symmetrically spaced about the rotor.

Abstract translation: 一种用于清洁用于处理半导体晶片的载体的系统和方法，包括在外壳内具有转子的盒式清洁器。 转子上的箱体组件包括用于将箱固定到转子上的上钩和下钩。 转子上也设有一个箱门组件。 盒门保持器组件优选地具有多个箱门保持位置。 每个箱门保持位置有利地具有用于保持门的门引导件和门钩。 箱门支架组件允许使用离心式清洁器清洁盒子和门，避免了单独清洁门的需要。 在一种构造中，转子设置有偶数个围绕转子对称地间隔开的盒保持器组件和偶数个围绕转子对称地间隔开的门保持器组件。

公开(公告)号：US20020083960A1

公开(公告)日：2002-07-04

申请号：US09907484

申请日：2001-07-16

Applicant: Semitool, Inc.

Inventor： Paul Z. Wirth ,  Steven L. Peace ,  Erik Lund

IPC: C25F001/00 ,  C25F003/30 ,  C25F005/00 ,  B08B006/00

CPC classification number: H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  H01L21/67086 ,  Y10S134/902 ,  Y10S438/906 ,  Y10S438/913

Abstract: A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vertically above the bowl, to a second position where the workpiece is at least partially positioned in the bowl. The bowl has a contour section with a sidewall having a radius of curvature which increases adjacent to a drain outlet in the bowl, to help rapid draining of liquid from the bowl. The head has a load position, where the rotors are spaced apart by a first amount, and a process position, where the rotors are engaged and sealed against each other. For rapid evacuation of fluid, the head also has a fast drain position, where the rotors are moved apart sufficiently to create an annular drain gap. Fluid is rapid evacuated by spinning the rotors with the head rotors slightly apart and unsealed, causing the fluid to flow our quickly under centrifugal force.

Abstract translation: 用于处理工件的系统包括附接到头部升降器的头部。 工件在上转子和下转子之间的头部中被支撑。 底座有一个容纳液体的碗。 头部可由头部升降器从垂直于碗的第一位置移动到第二位置，在该位置，工件至少部分地定位在碗中。 碗具有轮廓部分，其侧壁具有与碗中的排水出口相邻增加的曲率半径，以帮助液体从碗中快速排出。 头部具有负载位置，其中转子间隔开第一量，以及处理位置，其中转子彼此接合并密封。 为了快速排出流体，头部还具有快速的排放位置，其中转子被足够地移动以产生环形的排水间隙。 流体通过旋转转子而迅速抽空，头部转子稍微分开并开封，导致流体在离心力下快速流动。

公开(公告)号：US20020083614A1

公开(公告)日：2002-07-04

申请号：US10097074

申请日：2002-03-12

Applicant: Semitool, Inc.

Inventor： Robert Weaver ,  Ronald Schlagenhaufer

IPC: F26B017/24 ,  F26B017/30 ,  F26B011/02 ,  D06F058/00 ,  G05G001/00 ,  G05G003/00

CPC classification number: H01L21/67313 ,  H01L21/67316 ,  Y10S414/141

Abstract: A rotor that may be used by itself or in a processing machine for processing semiconductor wafers includes two pairs of combs. A lock down mechanism has a lock bar, temporarily engaged and moved by a loading/unloading robot, drives a retainer against the edges of the wafers, to better hold them in place during processing. Contamination via generation of particles is reduced. Combs on the rotor have a resilient strip. The lower edges of the wafers compress slightly into or deflect the resilient strip, when urged into place by the lock down mechanism.

Abstract translation: 可以单独使用或用于处理半导体晶圆的处理机中的转子包括两对梳子。 锁定机构具有通过装载/卸载机器人临时接合和移动的锁定杆，将保持器驱动抵靠晶片的边缘，以在加工期间更好地将其保持在适当位置。 通过产生颗粒的污染减少。 转子上的梳子有一个弹性条。 当被锁定机构推动就位时，晶片的下边缘稍微压入或偏转弹性带。