公开(公告)号：US5952719A

公开(公告)日：1999-09-14

申请号：US891446

申请日：1997-07-10

Applicant: Peter W. Robinson ,  Deepak Mahulikar ,  Paul R. Hoffman

Inventor： Peter W. Robinson ,  Deepak Mahulikar ,  Paul R. Hoffman

IPC: H01L23/06 ,  H01L23/08 ,  H01L23/13 ,  H01L23/14 ,  H01L23/24 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H05K1/02 ,  H05K3/30 ,  H01L23/48

CPC classification number: H01L23/13 ,  H01L23/142 ,  H01L23/24 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/49816 ,  H01L24/32 ,  H05K3/305 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/0271 ,  H05K2201/10477 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613

Abstract: The bending of a ball grid array electronic package having a metallic base is reduced minimizing stresses applied to the innermost row of solder balls when the package base is cyclically heated and cooled. Reducing the stresses applied to the solder balls increases the number of thermal cycles before solder ball fracture causes device failure. Among the means disclosed to reduce the bending moment are a bimetallic composite base, an integral stiffener, a centrally disposed cover bonded to an external structure and a package base with a stress accommodating depressed portion.

Abstract translation: 当包装基底被循环加热和冷却时，具有金属基底的球栅阵列电子封装的弯曲减小了最小化施加到最内排焊球的应力。 减少施加到焊球上的应力增加了焊球破裂导致装置故障之前的热循环次数。 公开的用于减小弯矩的手段是双金属复合基座，整体加强件，结合到外部结构的中心布置的盖子和具有应力容纳凹陷部分的封装基座。

公开(公告)号：US5324888A

公开(公告)日：1994-06-28

申请号：US959571

申请日：1992-10-13

Applicant: Derek E. Tyler ,  Deepak Mahulikar ,  Anthony M. Pasqualoni ,  Jeffrey S. Braden ,  Paul R. Hoffman

Inventor： Derek E. Tyler ,  Deepak Mahulikar ,  Anthony M. Pasqualoni ,  Jeffrey S. Braden ,  Paul R. Hoffman

IPC: H01L23/28 ,  H01L23/02 ,  H01L23/057 ,  H01L23/10 ,  H01L23/24 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L24/32 ,  H01L23/057 ,  H01L23/10 ,  H01L23/24 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15747 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181

Abstract: There is provided an electronic package where the package components define a cavity. A semiconductor device and a portion of a leadframe occupy part of the cavity. Substantially the remainder of the cavity is filled with a compliant polymer, such as a silicone gel. Since the cavity is no longer susceptible to gross leak failure, the seal width of adhesives used to assemble the package may be reduced, thereby increasing the area available for mounting the semiconductor device.

Abstract translation: 提供了一种电子封装，其中封装元件限定一个空腔。 半导体器件和引线框架的一部分占据腔的一部分。 基本上，空腔的其余部分填充有柔性聚合物，例如硅凝胶。 由于空腔不再容易发生严重的泄漏故障，所以可以减少用于组装封装的粘合剂的密封宽度，从而增加可用于安装半导体器件的面积。

公开(公告)号：US5320689A

公开(公告)日：1994-06-14

申请号：US24057

申请日：1993-03-01

Applicant: Deepak Mahulikar ,  Brian Mravic

Inventor： Deepak Mahulikar ,  Brian Mravic

IPC: C23C8/80 ,  C23C14/48 ,  C22C9/00

CPC classification number: C23C8/80 ,  C23C14/48 ,  Y10T428/12493 ,  Y10T428/12576 ,  Y10T428/12903

Abstract: There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper alloy with nitrogen, carbon or a nitrogen/carbon mixture at elevated temperatures. The resultant surface layer improves the tribological and mechanical properties of the alloy while maintaining useful electrical conductivity.

Abstract translation: 提供了具有铜合金芯和含有氮化物或碳化物膜的改性表面层的复合铜合金。 或者，改性表面层可以含有氮化碳膜。 该合金通过在高温下使铜合金与氮，碳或氮/碳混合物反应而形成。 所得的表面层改善了合金的摩擦学和机械性能，同时保持有用的导电性。

公开(公告)号：US5213638A

公开(公告)日：1993-05-25

申请号：US828329

申请日：1992-01-30

Applicant: Deepak Mahulikar ,  Brian Mravic

Inventor： Deepak Mahulikar ,  Brian Mravic

IPC: C23C8/80 ,  C23C14/48

CPC classification number: C23C14/48 ,  C23C8/80 ,  Y10T428/12882

Abstract: There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper alloy with nitrogen, carbon or a nitrogen/carbon mixture at elevated temperatures. The resultant surface layer improves the tribological and mechanical properties of the alloy while maintaining useful electrical conductivity.

Abstract translation: 提供了具有铜合金芯和含有氮化物或碳化物膜的改性表面层的复合铜合金。 或者，改性表面层可以含有氮化碳膜。 该合金通过在高温下使铜合金与氮，碳或氮/碳混合物反应而形成。 所得的表面层改善了合金的摩擦学和机械性能，同时保持有用的导电性。

公开(公告)号：US5155299A

公开(公告)日：1992-10-13

申请号：US712797

申请日：1991-06-10

Applicant: Deepak Mahulikar ,  James M. Popplewell

Inventor： Deepak Mahulikar ,  James M. Popplewell

IPC: H01L23/057 ,  H01L23/06 ,  H01L23/10 ,  H01L23/14

CPC classification number: H01L23/057 ,  H01L23/06 ,  H01L23/10 ,  H01L23/142 ,  H01L2224/32225 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/16195 ,  Y10T29/49121

Abstract: The present invention relates to a packagae adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than cooper based packages and better thermal conductivity than plastic based packages.

Abstract translation: 本发明涉及一种适于容纳诸如半导体集成电路的电子设备的包装盒。 封装部件由铝基合金组成。 包装部件的表面的至少一部分被阳极化以增强耐腐蚀性并增加粘结强度。 铝基包装的特征在于比基于铜基的包装更轻的重量和比基于塑料的包装更好的导热性。

公开(公告)号：US5043534A

公开(公告)日：1991-08-27

申请号：US548322

申请日：1990-07-02

Applicant: Deepak Mahulikar ,  Jeffrey S. Braden ,  Stephen P. Noe

Inventor： Deepak Mahulikar ,  Jeffrey S. Braden ,  Stephen P. Noe

IPC: H01L23/00 ,  H01L23/02 ,  H01L23/06 ,  H01L23/10 ,  H01L23/552 ,  H01L23/60

CPC classification number: H01L23/10 ,  H01L23/552 ,  H01L23/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/30107 ,  H01L2924/3025

Abstract: A metal electronic package is provided having improved electromagnetic interference shielding. Metal base and cover components are electrically interconnected to remain at same voltage potential thereby reducing EMI induced mutual inductance. An electrically conductive conduit, such as a contact pin, provides interconnection. If the electronic device is mounted on a chip pad attach, the conductive conduit also connects to the support pads of the chip attach.

Abstract translation: 提供具有改进的电磁干扰屏蔽的金属电子封装。 金属底座和盖组件电互连以保持相同的电压电位，从而减少EMI引起的互感。 诸如接触销的导电导管提供互连。 如果电子设备安装在芯片焊盘上，则导电导管也连接到芯片连接的支撑焊盘。

公开(公告)号：US5020439A

公开(公告)日：1991-06-04

申请号：US347631

申请日：1989-05-05

Applicant: Joseph Winter ,  Deepak Mahulikar ,  Frank N. Mandigo

Inventor： Joseph Winter ,  Deepak Mahulikar ,  Frank N. Mandigo

IPC: F42B12/20 ,  F42B12/44 ,  F42B30/00

CPC classification number: F42B12/204 ,  F42B12/208 ,  F42B12/44 ,  F42B30/003

Abstract: A baseplug for a target-penetrating projectile containing an explosive in which the baseplug is fabricated in two components each preferably fabricated from a powdered pyrophoric material. The powdered pyrophoric material may be zirconium or titanium or alloys thereof which is charged with hydrogen which upon burning of the baseplug is released to increase the fine start capability of the projectile.

Abstract translation: 用于含有爆炸物的靶穿透弹丸的基底塞，其中基底塞制造成两个部件，每个部件优选地由粉末发火材料制成。 粉状发火材料可以是锆或钛或其合成物，其被充入氢气，当释放碱基塞时燃烧，以提高抛射体的精细起始能力。

公开(公告)号：US5015803A

公开(公告)日：1991-05-14

申请号：US359305

申请日：1989-05-31

Applicant: Deepak Mahulikar ,  Jacob Crane ,  Abid A. Khan

Inventor： Deepak Mahulikar ,  Jacob Crane ,  Abid A. Khan

IPC: H01L23/10 ,  H01L23/373 ,  H01L23/433 ,  H01L23/495 ,  H01L33/00

CPC classification number: H01L23/4334 ,  H01L23/10 ,  H01L23/3735 ,  H01L23/49582 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  Y10T428/12569 ,  Y10T428/1275

Abstract: Composite materials for electronic packages are disclosed. The composite materials comprise a core layer and first and second cladding layers. The core and cladding layer compositions and thicknesses are selected to maximize thermal and electrical conductivity and to minimize the coefficient of thermal expansion of the composite. The composite material may be employed to fashion the package base, the leadframe, a heat spreader or combinations thereof. In one embodiment, a portion of the first cladding layer is removed so that an electronic device may be mounted directly to a high thermal conductivity core.

Abstract translation: 公开了用于电子封装的复合材料。 复合材料包括芯层和第一和第二覆层。 选择芯层和包覆层的组成和厚度以使热和电导率最大化并使复合材料的热膨胀系数最小化。 可以使用复合材料来形成封装基座，引线框架，散热器或其组合。 在一个实施例中，去除第一包层的一部分，使得电子器件可以直接安装到高导热性核心。

公开(公告)号：US5013871A

公开(公告)日：1991-05-07

申请号：US461861

申请日：1990-01-08

Applicant: Deepak Mahulikar ,  Jacob Crane ,  Jeffrey S. Braden

Inventor： Deepak Mahulikar ,  Jacob Crane ,  Jeffrey S. Braden

IPC: H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L23/36 ,  H01L23/367 ,  H01L23/42

CPC classification number: H01L24/32 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/42 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/16151 ,  H01L2924/16152

Abstract: A kit for the assembly of an adhesively sealed package designed to encase an electronic device is provided. The kit comprises a metallic base and cover components which are adapted to receive a polymeric adhesive. At least those portions of the base and cover component which will contact the polymeric adhesive are provided with a coating of a second metal or oxide. In one embodiment, first, second and third dry film adhesives are tacked to the base and cover components.

Abstract translation: 提供了用于组装用于封装电子设备的粘合密封包装的套件。 套件包括适于接收聚合物粘合剂的金属基底和覆盖部件。 至少与将接触聚合物粘合剂的基部和覆盖部件的那些部分设置有第二金属或氧化物的涂层。 在一个实施方案中，第一，第二和第三干膜粘合剂粘合到基底和覆盖部件上。

公开(公告)号：US4929516A

公开(公告)日：1990-05-29

申请号：US826808

申请日：1986-02-10

Applicant: Michael J. Pryor ,  Julius C. Fister ,  Narendra N. Singhdeo ,  Deepak Mahulikar ,  Satyam C. Cherukuri

Inventor： Michael J. Pryor ,  Julius C. Fister ,  Narendra N. Singhdeo ,  Deepak Mahulikar ,  Satyam C. Cherukuri

IPC: H01L21/58 ,  H01L21/60 ,  H01L23/373 ,  B32B15/00

CPC classification number: H01L24/32 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/351 ,  Y10T428/12528 ,  Y10T428/12535 ,  Y10T428/12674 ,  Y10T428/12833 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12931

Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component for dissipating thermal stresses is disposed between the substrate and the semiconductor die to dissipate stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed between the substrate and the die with a silver-tin sealing composition. A bonding material may be used alone to bond a die to a substrate and dissipate stresses from thermal cycling.

Abstract translation: 提供了一种用于将半导体管芯附接到衬底的半导体管芯附接系统。 用于耗散热应力的金属缓冲部件设置在基板和半导体管芯之间，以消散由基板和芯片的热循环产生的应力。 用银 - 锡密封组合物将金属缓冲组分密封在基底和模具之间。 可以单独使用接合材料将模具结合到基板上并消散热循环中的应力。