公开(公告)号：US5043534A

公开(公告)日：1991-08-27

申请号：US548322

申请日：1990-07-02

Applicant: Deepak Mahulikar ,  Jeffrey S. Braden ,  Stephen P. Noe

Inventor： Deepak Mahulikar ,  Jeffrey S. Braden ,  Stephen P. Noe

IPC: H01L23/00 ,  H01L23/02 ,  H01L23/06 ,  H01L23/10 ,  H01L23/552 ,  H01L23/60

CPC classification number: H01L23/10 ,  H01L23/552 ,  H01L23/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/30107 ,  H01L2924/3025

Abstract: A metal electronic package is provided having improved electromagnetic interference shielding. Metal base and cover components are electrically interconnected to remain at same voltage potential thereby reducing EMI induced mutual inductance. An electrically conductive conduit, such as a contact pin, provides interconnection. If the electronic device is mounted on a chip pad attach, the conductive conduit also connects to the support pads of the chip attach.

Abstract translation: 提供具有改进的电磁干扰屏蔽的金属电子封装。 金属底座和盖组件电互连以保持相同的电压电位，从而减少EMI引起的互感。 诸如接触销的导电导管提供互连。 如果电子设备安装在芯片焊盘上，则导电导管也连接到芯片连接的支撑焊盘。

公开(公告)号：US5020439A

公开(公告)日：1991-06-04

申请号：US347631

申请日：1989-05-05

Applicant: Joseph Winter ,  Deepak Mahulikar ,  Frank N. Mandigo

Inventor： Joseph Winter ,  Deepak Mahulikar ,  Frank N. Mandigo

IPC: F42B12/20 ,  F42B12/44 ,  F42B30/00

CPC classification number: F42B12/204 ,  F42B12/208 ,  F42B12/44 ,  F42B30/003

Abstract: A baseplug for a target-penetrating projectile containing an explosive in which the baseplug is fabricated in two components each preferably fabricated from a powdered pyrophoric material. The powdered pyrophoric material may be zirconium or titanium or alloys thereof which is charged with hydrogen which upon burning of the baseplug is released to increase the fine start capability of the projectile.

Abstract translation: 用于含有爆炸物的靶穿透弹丸的基底塞，其中基底塞制造成两个部件，每个部件优选地由粉末发火材料制成。 粉状发火材料可以是锆或钛或其合成物，其被充入氢气，当释放碱基塞时燃烧，以提高抛射体的精细起始能力。

公开(公告)号：US5015803A

公开(公告)日：1991-05-14

申请号：US359305

申请日：1989-05-31

Applicant: Deepak Mahulikar ,  Jacob Crane ,  Abid A. Khan

Inventor： Deepak Mahulikar ,  Jacob Crane ,  Abid A. Khan

IPC: H01L23/10 ,  H01L23/373 ,  H01L23/433 ,  H01L23/495 ,  H01L33/00

CPC classification number: H01L23/4334 ,  H01L23/10 ,  H01L23/3735 ,  H01L23/49582 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  Y10T428/12569 ,  Y10T428/1275

Abstract: Composite materials for electronic packages are disclosed. The composite materials comprise a core layer and first and second cladding layers. The core and cladding layer compositions and thicknesses are selected to maximize thermal and electrical conductivity and to minimize the coefficient of thermal expansion of the composite. The composite material may be employed to fashion the package base, the leadframe, a heat spreader or combinations thereof. In one embodiment, a portion of the first cladding layer is removed so that an electronic device may be mounted directly to a high thermal conductivity core.

Abstract translation: 公开了用于电子封装的复合材料。 复合材料包括芯层和第一和第二覆层。 选择芯层和包覆层的组成和厚度以使热和电导率最大化并使复合材料的热膨胀系数最小化。 可以使用复合材料来形成封装基座，引线框架，散热器或其组合。 在一个实施例中，去除第一包层的一部分，使得电子器件可以直接安装到高导热性核心。

公开(公告)号：US5013871A

公开(公告)日：1991-05-07

申请号：US461861

申请日：1990-01-08

Applicant: Deepak Mahulikar ,  Jacob Crane ,  Jeffrey S. Braden

Inventor： Deepak Mahulikar ,  Jacob Crane ,  Jeffrey S. Braden

IPC: H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L23/36 ,  H01L23/367 ,  H01L23/42

CPC classification number: H01L24/32 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/42 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/16151 ,  H01L2924/16152

Abstract: A kit for the assembly of an adhesively sealed package designed to encase an electronic device is provided. The kit comprises a metallic base and cover components which are adapted to receive a polymeric adhesive. At least those portions of the base and cover component which will contact the polymeric adhesive are provided with a coating of a second metal or oxide. In one embodiment, first, second and third dry film adhesives are tacked to the base and cover components.

Abstract translation: 提供了用于组装用于封装电子设备的粘合密封包装的套件。 套件包括适于接收聚合物粘合剂的金属基底和覆盖部件。 至少与将接触聚合物粘合剂的基部和覆盖部件的那些部分设置有第二金属或氧化物的涂层。 在一个实施方案中，第一，第二和第三干膜粘合剂粘合到基底和覆盖部件上。

公开(公告)号：US4929516A

公开(公告)日：1990-05-29

申请号：US826808

申请日：1986-02-10

Applicant: Michael J. Pryor ,  Julius C. Fister ,  Narendra N. Singhdeo ,  Deepak Mahulikar ,  Satyam C. Cherukuri

Inventor： Michael J. Pryor ,  Julius C. Fister ,  Narendra N. Singhdeo ,  Deepak Mahulikar ,  Satyam C. Cherukuri

IPC: H01L21/58 ,  H01L21/60 ,  H01L23/373 ,  B32B15/00

CPC classification number: H01L24/32 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/351 ,  Y10T428/12528 ,  Y10T428/12535 ,  Y10T428/12674 ,  Y10T428/12833 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12931

Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component for dissipating thermal stresses is disposed between the substrate and the semiconductor die to dissipate stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed between the substrate and the die with a silver-tin sealing composition. A bonding material may be used alone to bond a die to a substrate and dissipate stresses from thermal cycling.

Abstract translation: 提供了一种用于将半导体管芯附接到衬底的半导体管芯附接系统。 用于耗散热应力的金属缓冲部件设置在基板和半导体管芯之间，以消散由基板和芯片的热循环产生的应力。 用银 - 锡密封组合物将金属缓冲组分密封在基底和模具之间。 可以单独使用接合材料将模具结合到基板上并消散热循环中的应力。

公开(公告)号：US4888449A

公开(公告)日：1989-12-19

申请号：US140859

申请日：1988-01-04

Applicant: Jacob Crane ,  Barry C. Johnson ,  Deepak Mahulikar ,  Sheldon H. Butt

Inventor： Jacob Crane ,  Barry C. Johnson ,  Deepak Mahulikar ,  Sheldon H. Butt

IPC: H01L23/057 ,  H01L23/06 ,  H01L23/10 ,  H01L23/14 ,  H01L23/367

CPC classification number: H01L23/057 ,  H01L23/06 ,  H01L23/10 ,  H01L23/142 ,  H01L23/3675 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  Y10T29/49121

Abstract: A semiconductor package for an electrical component which has a metal or metal alloy leadframe with first and second surface, which leadframe is adapted to have an electrical component connected thereto. The leadframe is bonded by means of a polymer to a copper or copper alloy base member. The leadframe is also bonded by means of a polymer to a copper or copper alloy cap member. The cap and base members have coated to their inside surfaces a metal or metal alloy. The coating improves the polymer bond between the leadframe and the base and cap members. The surface area of the base member is increased to transfer more heat from the silicon chip in the semiconductor package and to reduce the thermal stresses between the silicon chip and the base member.

Abstract translation: 一种用于电气部件的半导体封装件，其具有带有第一和第二表面的金属或金属合金引线框架，该引线框架适于具有连接到其上的电气部件。 引线框通过聚合物粘合到铜或铜合金基底上。 引线框也通过聚合物粘合到铜或铜合金盖构件上。 帽和基部构件已经在其内表面涂覆有金属或金属合金。 涂层改善了引线框架与底座和盖件之间的聚合物粘结。 增加基体部件的表面积，以从半导体封装中的硅芯片传递更多的热量，并且减小硅芯片和基底部件之间的热应力。

公开(公告)号：US4883778A

公开(公告)日：1989-11-28

申请号：US924959

申请日：1986-10-30

Applicant: Narendra N. SinghDeo ,  Deepak Mahulikar ,  Sheldon H. Butt

Inventor： Narendra N. SinghDeo ,  Deepak Mahulikar ,  Sheldon H. Butt

IPC: A61F2/00 ,  A61F2/30 ,  A61F2/36 ,  C03C14/00 ,  H05K1/03

CPC classification number: A61F2/30965 ,  C03C14/004 ,  A61F2/367 ,  A61F2002/3631 ,  A61F2002/368 ,  A61F2002/3682 ,  A61F2310/00203 ,  C03C2214/04 ,  C03C2214/08 ,  H01L2924/01078 ,  H01L2924/09701 ,  H05K1/0306

Abstract: The present invention is directed to an engineering ceramic product formed of a ceramic-glass-metal composite being strong, durable, formable into complex shapes and having good improved thermal conductivity.

Abstract translation: 本发明涉及由陶瓷 - 玻璃 - 金属复合材料形成的工程陶瓷产品，该陶瓷玻璃 - 金属复合材料坚固耐用，可形成复杂形状并具有良好的改善的导热性。

公开(公告)号：US4882212A

公开(公告)日：1989-11-21

申请号：US924970

申请日：1986-10-30

Applicant: Narendra N. SinghDeo ,  Deepak Mahulikar ,  Sheldon H. Butt

Inventor： Narendra N. SinghDeo ,  Deepak Mahulikar ,  Sheldon H. Butt

IPC: A61F2/00 ,  A61F2/30 ,  A61F2/36 ,  C03C14/00 ,  H01L23/10 ,  H01L23/15 ,  H01L23/367 ,  H01L23/498 ,  H05K1/03

CPC classification number: H01L23/15 ,  A61F2/30965 ,  C03C14/004 ,  H01L23/10 ,  H01L23/3677 ,  H01L23/49805 ,  H01L23/49861 ,  A61F2/367 ,  A61F2002/3631 ,  A61F2002/368 ,  A61F2002/3682 ,  A61F2310/00203 ,  C03C2214/04 ,  C03C2214/08 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3025 ,  H05K1/0306 ,  Y10S428/901 ,  Y10T428/239 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/259

Abstract: The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.

Abstract translation: 本发明涉及形成用于容纳半导体器件的部件的部件和工艺。 这些部件由独特的陶瓷 - 玻璃 - 金属复合材料制成，陶瓷颗粒，金属颗粒和玻璃基体，所述陶瓷和金属颗粒遍布整个分散。 金属元件可以嵌入到材料中，以简化诸如半导体封装的器件的制造。

公开(公告)号：US4799973A

公开(公告)日：1989-01-24

申请号：US596182

申请日：1984-04-02

Applicant: Deepak Mahulikar ,  Eugene Shapiro

Inventor： Deepak Mahulikar ,  Eugene Shapiro

IPC: C22F1/08 ,  B32B15/20

CPC classification number: C22F1/08 ,  Y10T428/1291

Abstract: The present invention relates to a process for maintaining the fine grain size of and providing excellent bend formability, hot ductility and strength properties to a copper-nickel-manganese alloy to be exposed to elevated temperatures. The process of the present invention includes a final cold working step during which the material to be fabricated into a desired article and/or exposed to the elevated temperatures has its thickness reduced by about 4% to about 30%, preferably from about 5% to about 25%. The alloys described herein have particular utility in brazed articles or assemblies.

Abstract translation: 本发明涉及一种保持高温下铜 - 镍 - 锰合金的细晶粒尺寸并提供优异的弯曲成形性，热延展性和强度性能的方法。 本发明的方法包括最终的冷加工步骤，在该最终冷加工步骤中，要制造成所需制品的材料和/或暴露于升高的温度下，其厚度减小约4％至约30％，优选约5％至约5％ 约25％。 本文所述的合金在钎焊制品或组件中具有特别的用途。

公开(公告)号：US4748136A

公开(公告)日：1988-05-31

申请号：US924968

申请日：1986-10-30

Applicant: Deepak Mahulikar ,  Narendra N. SinghDeo

Inventor： Deepak Mahulikar ,  Narendra N. SinghDeo

IPC: A61F2/00 ,  A61F2/30 ,  A61F2/36 ,  C03C14/00 ,  H05K1/03

CPC classification number: C03C14/004 ,  A61F2/30965 ,  A61F2/367 ,  A61F2002/3631 ,  A61F2002/368 ,  A61F2002/3682 ,  A61F2310/00203 ,  C03C2214/04 ,  C03C2214/08 ,  H01L2924/01078 ,  H01L2924/09701 ,  H05K1/0306

Abstract: The present invention is directed to a composite and process of forming the composite comprising metallic particles for enhancing the flow characteristics of said composite, a glass for adhering the composite together and the balance essentially ceramic particles. The composite has a matrix comprising the glass with the ceramic and metallic particles dispersed therein. The metallic particles are preferably present in the composite at a volume percentage so as to be discontinuously dispersed throughout.

Abstract translation: 本发明涉及一种形成复合材料的复合材料和方法，所述复合材料包括用于增强所述复合材料的流动特性的金属颗粒，用于将复合材料粘合在一起的玻璃和其余的基本上为陶瓷颗粒。 该复合材料具有包含分散有陶瓷和金属颗粒的玻璃的基体。 金属颗粒优选以体积百分比存在于复合材料中，以便不连续地分散在整个组合物中。