公开(公告)号：US10282655B2

公开(公告)日：2019-05-07

申请号：US15650994

申请日：2017-07-17

申请人： Infineon Technologies AG

发明人： Frank Pueschner ,  Siegfried Hoffner ,  Jens Pohl

IPC分类号： G06K19/07 ,  G06K19/077 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00

摘要： A chip card module is provided. The chip card module may include a carrier having a first side and an opposite second side, a chip arranged over the carrier, the chip having a first chip contact, a first and a second antenna contact formed over the first side, a metal-free area formed over the first side between the first antenna contact and the second antenna contact, wherein the metal-free area extends between a first edge portion and a second edge portion of the carrier, and a first chip connection electrically connecting the first chip contact to the first antenna contact, wherein the first chip connection is at least partially arranged over the second side in a region opposite the metal-free area.

公开(公告)号：US10229352B2

公开(公告)日：2019-03-12

申请号：US14549578

申请日：2014-11-21

申请人： Infineon Technologies AG

发明人： Martin Klimke ,  Berndt Gammel ,  Frank Pueschner ,  Peter Stampka

IPC分类号： G06K19/06 ,  H01L29/18 ,  H01L33/00 ,  G06K19/073 ,  G06K19/077

摘要： One embodiment describes a chip arrangement having a chip carrier; a chip which is arranged in or on the chip carrier; a light sensor arrangement; a transparent layer which covers the light sensor arrangement, the light sensor arrangement being set up to determine a light pattern of light received by the light sensor arrangement from outside the chip arrangement through the transparent layer; and a test circuit which is set up to check whether the light pattern matches a reference light pattern and to output a signal on the basis of the result of the check.

公开(公告)号：US10198684B2

公开(公告)日：2019-02-05

申请号：US14719374

申请日：2015-05-22

申请人： INFINEON TECHNOLOGIES AG

发明人： Frank Pueschner ,  Alfred Haimerl ,  Jens Pohl ,  Wolfgang Schindler

IPC分类号： H01L21/56 ,  G06K19/077 ,  H01L23/498 ,  H01L23/00

摘要： A smart card module includes a substrate having a first main surface and a second main surface, which is opposite the first main surface. The substrate has a plurality of plated-through holes, which extend through the substrate from the first main surface to the second main surface. The smart card module further includes a chip over the first main surface of the substrate, a first metal structure over the second main surface of the substrate, electrically insulating material, which covers the first metal structure, and a second metal structure over the electrically insulating material, wherein the second metal structure is electrically insulated from the first metal structure by the electrically insulating material. The chip is connected to the first metal structure by at least one first plated-through hole. The chip is connected to the second metal structure by at least one second plated-through hole.

公开(公告)号：US09672459B2

公开(公告)日：2017-06-06

申请号：US14771240

申请日：2014-02-27

申请人： Infineon Technologies AG ,  Bundesdruckerei GmbH

发明人： Frank Pueschner ,  Joerg Fischer ,  Juergen Hoegerl ,  Peter Stampka ,  Markus Tietke ,  Stefan Troelenberg

IPC分类号： G06K19/00 ,  G06K19/077 ,  G06K19/073

CPC分类号： G06K19/07705 ,  G06K19/07309 ,  G06K19/07722 ,  G06K19/07749 ,  G06K19/07754

摘要： In various embodiments, a chip card module is provided that can have: a chip card module support; a wiring structure that is arranged on the chip card module support; an integrated circuit that is arranged on the chip card module support and is electrically coupled to the wiring structure; a chip card module antenna that is arranged on the chip card module support and is electrically coupled to the wiring structure, and a lighting device that is arranged on the chip card module support and is electrically coupled to the wiring structure.

公开(公告)号：US09548248B2

公开(公告)日：2017-01-17

申请号：US14453639

申请日：2014-08-07

申请人： Infineon Technologies AG

发明人： Frank Pueschner ,  Bernhard Schaetzler ,  Franz Gabler

IPC分类号： H01L21/82 ,  H01L21/302 ,  H01L21/304 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L21/82 ,  H01L21/302 ,  H01L21/561 ,  H01L23/3114 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to various embodiments, a method of processing a substrate may include: forming a plurality of trenches into a substrate between two chip structures in the substrate, the trenches defining at least one pillar between the two chip structures and a sidewall on each of said two chip structures; disposing an auxiliary carrier on the substrate to hold the chip structures and the at least one pillar; at least partially filling the trenches with encapsulation material to cover the at least one pillar and the sidewalls, thereby at least partially encapsulating the chip structures; removing a portion of the encapsulation material to expose at least a portion of the at least one pillar; and at least partially removing the at least one pillar.

摘要翻译： 根据各种实施例，处理衬底的方法可以包括：在衬底中的两个芯片结构之间形成多个沟槽到衬底中，所述沟槽限定两个芯片结构之间的至少一个柱和在所述两个芯片结构中的每一个上的侧壁 芯片结构; 在所述基板上设置辅助载体以保持所述芯片结构和所述至少一个支柱; 至少部分地用封装材料填充沟槽以覆盖所述至少一个柱和侧壁，从而至少部分地封装所述芯片结构; 去除所述封装材料的一部分以暴露所述至少一个支柱的至少一部分; 并且至少部分地去除所述至少一个支柱。

公开(公告)号：US09533473B2

公开(公告)日：2017-01-03

申请号：US14243970

申请日：2014-04-03

申请人： Infineon Technologies AG

发明人： Siegfried Hoffner ,  Mohammed Reza Hussein ,  Frank Pueschner ,  Thomas Spoettl

IPC分类号： B32B27/08 ,  B32B27/36 ,  B32B37/24 ,  B32B27/30 ,  B32B27/32 ,  B32B3/26 ,  B32B7/12 ,  B32B37/12 ,  B32B27/20 ,  B32B37/14

CPC分类号： B32B27/08 ,  B32B3/26 ,  B32B7/12 ,  B32B27/20 ,  B32B27/304 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/365 ,  B32B37/12 ,  B32B37/142 ,  B32B37/24 ,  B32B2037/243 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2264/105 ,  B32B2307/202 ,  B32B2329/04 ,  B32B2379/08 ,  B32B2425/00 ,  Y10T156/10 ,  Y10T428/24998

摘要： A chip card substrate is provided that includes a first polymer layer including a first polymer material. The chip card substrate further includes an intermediate layer disposed over the first polymer layer and including polyolefin including a plurality of micro pores, an adhesive layer disposed over the intermediate layer and including an adhesive, and a second polymer layer disposed over the adhesive layer and including a second polymer material different from the first polymer material.

摘要翻译： 提供了包括第一聚合物层的芯片卡基材，该第一聚合物层包括第一聚合物材料。 芯片卡基板还包括设置在第一聚合物层上并包括包含多个微孔的聚烯烃的中间层，设置在中间层上方并包括粘合剂的粘合剂层和设置在粘合剂层上的第二聚合物层，并且包括 与第一聚合物材料不同的第二聚合物材料。

公开(公告)号：US20160111787A1

公开(公告)日：2016-04-21

申请号：US14519166

申请日：2014-10-21

申请人： Infineon Technologies AG

发明人： Petteri Palm ,  Martin Buchsbaum ,  Josef Gruber ,  Juergen Hoelzl ,  Frank Pueschner ,  Peter Stampka

IPC分类号： H01Q7/08

CPC分类号： H01Q7/08 ,  H01Q1/243 ,  H01Q21/24

摘要： According to one embodiment, a hybrid antenna is described comprising a plurality of windings wherein each winding comprises a loop antenna portion arranged in a plane and a ferrite antenna portion arranged at least partially outside of the plane.

摘要翻译： 根据一个实施例，描述了包括多个绕组的混合天线，其中每个绕组包括布置在平面中的环形天线部分和至少部分地布置在平面外部的铁氧体天线部分。

公开(公告)号：US20150317553A1

公开(公告)日：2015-11-05

申请号：US14697664

申请日：2015-04-28

申请人： Infineon Technologies AG

发明人： Frank Pueschner ,  Thomas Spoettl ,  Jens Pohl ,  Gottfried Beer

IPC分类号： G06K19/077 ,  H01L25/00 ,  G06K19/07

CPC分类号： G06K19/07705 ,  G06K19/0716 ,  G06K19/077 ,  G06K19/07749 ,  G06K19/07754 ,  H01L21/48 ,  H01L23/488 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16238

摘要： In various embodiments, a smart card module is provided. The smart card module includes a carrier having a first main surface and a second main surface opposite the first main surface. The carrier has at least one plated-through hole. The smart card module further includes a contact array arranged above the first main surface of the carrier and having a plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts is electrically connected to the plated-through hole. The smart card module further includes a chip arranged above the second main surface. The chip is electrically coupled to at least one electrical contact of the plurality of electrical contacts by the plated-through hole. The smart card module further includes at least one optoelectronic component arranged above the second main surface and electrically conductively connected to the chip.

摘要翻译： 在各种实施例中，提供智能卡模块。 智能卡模块包括具有第一主表面和与第一主表面相对的第二主表面的载体。 载体具有至少一个电镀通孔。 智能卡模块还包括布置在载体的第一主表面上方并具有多个电触点的接触阵列。 多个电触点中的至少一个电接触电连接到电镀通孔。 智能卡模块还包括布置在第二主表面上方的芯片。 芯片通过电镀通孔与多个电触点的至少一个电接触电耦合。 所述智能卡模块还包括布置在所述第二主表面上方并与所述芯片导电连接的至少一个光电子部件。

公开(公告)号：US09135549B2

公开(公告)日：2015-09-15

申请号：US14287265

申请日：2014-05-27

申请人： Infineon Technologies AG

发明人： Juergen Hoegerl ,  Frank Pueschner ,  Peter Stampka

IPC分类号： G06K19/00 ,  G06K19/06 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  G06K19/077 ,  H01L23/538

CPC分类号： G06K19/07707 ,  G06K19/07749 ,  G06K19/07775 ,  H01L23/5386 ,  H01L23/5388 ,  H01L2224/16225 ,  H01L2924/12044 ,  H01L2924/00

摘要： A smart card module includes a carrier; a chip arrangement arranged over a first side of the carrier; and an antenna arranged over a second side of the carrier, wherein the second side of the carrier is opposite the first side of the carrier. The antenna is electrically conductively connected to the chip arrangement in order to transmit electrical signals. The smart card module further includes a display module arranged over the first side of the carrier; and at least one electrical line structure arranged on the first side of the carrier, which electrical line structure electrically conductively connects the chip arrangement and the display module to one another.

摘要翻译： 智能卡模块包括载体; 布置在所述载体的第一侧上的芯片布置; 以及布置在所述载体的第二侧上的天线，其中所述载体的第二侧与所述载体的第一侧相对。 天线导电地连接到芯片布置，以便传输电信号。 智能卡模块还包括布置在载体的第一侧上的显示模块; 以及布置在所述载体的第一侧上的至少一个电线结构，所述电线结构将所述芯片布置和所述显示模块彼此导电地连接。

公开(公告)号：US20140239474A1

公开(公告)日：2014-08-28

申请号：US13779832

申请日：2013-02-28

申请人： INFINEON TECHNOLOGIES AG

发明人： Frank Pueschner ,  Juergen Hoegerl ,  Roman Hollweck ,  Peter Scherl

IPC分类号： H01L23/00 ,  H01L21/50

CPC分类号： H01L23/562 ,  G06K19/07747 ,  G06K19/07749 ,  H01L21/50 ,  H01L23/3121 ,  H01L24/19 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014

摘要： In various embodiments a chip arrangement is provided, wherein the chip arrangement may include a chip and at least one foil attached to at least one side of the chip.

摘要翻译： 在各种实施例中，提供了芯片布置，其中芯片布置可以包括芯片和附接到芯片的至少一侧的至少一个箔片。