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公开(公告)号：US10954544B2
公开(公告)日：2021-03-23
申请号：US16691737
申请日：2019-11-22
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Hariklia Deligianni , Bruce B. Doris , Steven J. Holmes , Qinghuang Lin , Roy R. Yu
IPC: C12Q1/00 , G01N27/327 , G01N33/94
Abstract: Embodiments of the present invention are directed to a semiconductor device. A non-limiting example of the semiconductor device includes a semiconductor substrate. The semiconductor device also includes a plurality of metal nanopillars formed on the substrate. The semiconductor device also includes an amperometric sensor associated with one of the plurality of nanopillars, wherein the amperometric sensor is selective to an enzyme-active neurotransmitter. The semiconductor device also includes a resistivity sensor associated with a pair of nanopillars, wherein the resistivity sensor is selective to an analyte.
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公开(公告)号：US10926079B2
公开(公告)日：2021-02-23
申请号：US16573533
申请日：2019-09-17
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Steven J. Holmes , Qinghuang Lin , Emily R. Kinser , Nathan P. Marchack , Roy R. Yu
Abstract: A nanodevice includes an array of metal nanorods formed on a substrate. An electropolymerized electrical conductor is formed over tops of a portion of the nanorods to form a reservoir between the electropolymerized conductor and the substrate. The electropolymerized conductor includes pores that open or close responsively to electrical signals applied to the nanorods. A cell loading region is disposed in proximity of the reservoir, and the cell loading region is configured to receive stem cells. A neurotrophic dispensing material is loaded in the reservoir to be dispersed in accordance with open pores to affect growth of the stem cells when in vivo.
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公开(公告)号：US20190146245A1
公开(公告)日：2019-05-16
申请号：US16213419
申请日：2018-12-07
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Emily R. Kinser , John U. Knickerbocker , Roy R. Yu
Abstract: Lenses and methods for adjusting the focus of a lens include dividing multiple light sensors in a lens into four quadrants. A position of the lens relative to occlusion along a top and bottom edge of the lens is determined based on numbers of bits in respective bit sequences from light sensors in respective regions of the lens. An optimal focal length for the lens is determined based on the position of the lens. The focal length of the lens is adjusted to match the optimal focal length.
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公开(公告)号：US10168550B2
公开(公告)日：2019-01-01
申请号：US15131411
申请日：2016-04-18
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Emily R. Kinser , John U. Knickerbocker , Roy R. Yu
Abstract: Methods of forming a lens include forming components on a lower substrate. The components are sealed on the lower substrate with a sealing layer. An upper substrate is formed over the sealing layer. The lower substrate is polished to a lower lens curvature.
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公开(公告)号：US20180340100A1
公开(公告)日：2018-11-29
申请号：US16004028
申请日：2018-06-08
Applicant: James L. Hedrick , Robert Dennis Miller , Deborah Ann Neumayer , Sampath Purushothaman , Mary E. Rothwell , Willi Volksen , Roy R. Yu , INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James L. Hedrick , Robert Dennis Miller , Deborah Ann Neumayer , Sampath Purushothaman , Mary E. Rothwell , Willi Volksen , Roy R. Yu
IPC: C09J9/00 , H01L25/00 , C09J11/04 , H01L23/00 , H01L23/48 , H01L21/768 , H01L21/683 , C09J183/04 , C09J179/08 , C09J179/04 , C09J11/06 , H01L25/065 , C08K7/24 , C08K5/548 , C08K5/5465 , C08K5/544 , C08K5/5425 , B82Y40/00 , B82Y30/00 , C08K3/04
Abstract: The present invention related to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.
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Patent Agency Ranking
公开(公告)号：US20180339154A1
公开(公告)日：2018-11-29
申请号：US15602343
申请日：2017-05-23
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Hariklia Deligianni , Bruce B. Doris , Steven J. Holmes , Emily R. Kinser , Qinghuang Lin , Roy R. Yu
IPC: A61N1/36 , H01L21/3213 , H01L21/283 , H01L23/58 , A61N1/05 , A61B5/145 , A61B5/00 , A61B5/06
Abstract: A sensing and treatment device includes an array of metal nanorod electrodes formed on a substrate, the array including first electrodes for sensing, and second electrodes for electrical pulsation. A data processing system is configured to monitor a parameter using the first electrodes and to activate the electrical pulsation in the second electrodes in accordance with a reading of the parameter.
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公开(公告)号：US10011098B2
公开(公告)日：2018-07-03
申请号：US14856967
申请日：2015-09-17
Applicant: International Business Machines Corporation
Inventor： Roy R. Yu , Wilfried Haensch
IPC: H01L23/498 , H01L25/00 , H01L25/065 , B32B37/02 , H01L23/473 , H01L23/00 , H01L25/18 , H01L23/48 , B32B37/12 , B32B38/18 , H01L29/06
CPC classification number: B32B37/02 , B32B37/12 , B32B38/1841 , B32B2309/105 , B32B2310/0843 , B32B2457/14 , H01L23/473 , H01L23/481 , H01L23/49827 , H01L24/09 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/96 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L29/0657 , H01L2224/0401 , H01L2224/05144 , H01L2224/05147 , H01L2224/06181 , H01L2224/08145 , H01L2224/13147 , H01L2224/16147 , H01L2224/26135 , H01L2224/291 , H01L2224/29147 , H01L2224/2919 , H01L2224/32145 , H01L2224/73253 , H01L2224/81191 , H01L2224/83005 , H01L2224/8314 , H01L2224/83141 , H01L2224/9202 , H01L2224/94 , H01L2224/96 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2225/06544 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2225/06589 , H01L2225/06593 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1032 , H01L2924/10329 , H01L2924/1204 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2924/15153 , H01L2224/83 , H01L2924/00014 , H01L2224/03 , H01L2224/11 , H01L2224/81 , H01L2924/00
Abstract: A 4D device comprises a 2D multi-core logic and a 3D memory stack connected through the memory stack sidewall using a fine pitch T&J connection. The 3D memory in the stack is thinned from the original wafer thickness to no remaining Si. A tounge and groove device at the memory wafer top and bottom surfaces allows an accurate stack alignment. The memory stack also has micro-channels on the backside to allow fluid cooling. The memory stack is further diced at the fixed clock-cycle distance and is flipped on its side and re-assembled on to a template into a pseudo-wafer format. The top side wall of the assembly is polished and built with BEOL to fan-out and use the T&J fine pitch connection to join to the 2D logic wafer. The other side of the memory stack is polished, fanned-out, and bumped with C4 solder. The invention also comprises a process for manufacturing the device. In another aspect, the invention comprises a 4D process and device for over 50× greater than 2D memory density per die and an ultra high density memory.
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公开(公告)号：US20170356851A1
公开(公告)日：2017-12-14
申请号：US15177829
申请日：2016-06-09
Applicant: International Business Machines Corporation
Inventor： Emily R. Kinser , Roy R. Yu
IPC: G01N21/65
CPC classification number: G01N21/658 , G01J3/02 , G01J3/18 , G01J3/44 , G01N21/65
Abstract: Surface enhanced Raman spectroscopy is employed to obtain chemical data with respect to cells while electrophysiological data relating to cell membranes is obtained using the patch clamp technique. A SERS-facilitating assembly is coupled to a micropipette and is used in conjunction with a monochromatic light source for generating scattered light. Surface enhanced Raman spectroscopy is employed to obtain the chemical data. Electrophysiological data is obtained using the same micropipette to perform the patch clamp technique.
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公开(公告)号：US20150024549A1
公开(公告)日：2015-01-22
申请号：US13947543
申请日：2013-07-22
Applicant: International Business Machines Corporation
Inventor： Evan G. Colgan , Steven A. Cordes , Daniel C. Edelstein , Vijayeshwar D. Khanna , Kenneth Latzko , Qinghuang Lin , Peter J. Sorce , Sri M. Sri-Jayantha , Robert L. Wisnieff , Roy R. Yu
IPC: H01L21/50
CPC classification number: H01L21/50 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2225/06513 , H01L2225/06593 , H01L2924/0002 , H01L2924/10156 , H01L2924/00
Abstract: The present disclosure relates to methods and devices for manufacturing a three-dimensional chip package. A method includes forming a linear groove on an alignment rail, attaching an alignment rod to the linear groove, forming alignment channels on a plurality of integrated circuit chips, and aligning the plurality of integrated circuit chips by stacking the plurality of integrated circuit chips along the alignment rail. Another method includes forming an alignment ridge on an alignment rail, forming alignment channels on a plurality of integrated circuit chips, and aligning the plurality of integrated circuit chips by stacking the plurality of integrated circuit chips along the alignment rail.
Abstract translation: 本公开涉及用于制造三维芯片封装的方法和装置。 一种方法包括在对准导轨上形成直线槽，将对准杆连接到线性槽，在多个集成电路芯片上形成对准通道，并通过将多个集成电路芯片沿着 对准导轨 另一种方法包括在对准导轨上形成对准脊，在多个集成电路芯片上形成对准通道，并且通过沿对准导轨堆叠多个集成电路芯片来对准多个集成电路芯片。
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公开(公告)号：US20250087629A1
公开(公告)日：2025-03-13
申请号：US18367807
申请日：2023-09-13
Applicant: International Business Machines Corporation
Inventor： Roy R. Yu , Katsuyuki Sakuma , Ravi K. Bonam , Nicholas Alexander Polomoff , Martin Desrochers , Aakrati Jain , Sathyanarayanan Raghavan
IPC: H01L23/00 , H01L21/78 , H01L23/544
Abstract: A structure comprising: a metal free zone within at least one level of the structure; and a fill pattern that is not staggered along a first direction and that is not staggered along a second direction.
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