公开(公告)号：US07572349B2

公开(公告)日：2009-08-11

申请号：US12156826

申请日：2008-06-05

申请人： Motoo Takada ,  Ryoichi Koseki ,  Kazuya Takahashi ,  Yoshimitsu Iizuka

发明人： Motoo Takada ,  Ryoichi Koseki ,  Kazuya Takahashi ,  Yoshimitsu Iizuka

IPC分类号： B32B37/00

CPC分类号： G02B27/46 ,  Y10T156/1062 ,  Y10T156/1075 ,  Y10T428/23

摘要： An optical device, such as an optical low-pass filter, and a production method therefor, which prevents damage, and thus maintains optical characteristics are provided. The optical device includes a plurality of optical plates joined together with adhesive. The adhesive is spread to extend to the peripheral edge of the optical plates and to the outer periphery of the principal plane surrounding the plurality of optical plates, thus forming a protective coating.

摘要翻译： 提供了防止损坏并因此保持光学特性的光学装置，例如光学低通滤波器及其制造方法。 光学装置包括用粘合剂连接在一起的多个光学板。 粘合剂被扩散以延伸到光学板的周缘和围绕多个光学板的主平面的外周，从而形成保护涂层。

公开(公告)号：US07317324B2

公开(公告)日：2008-01-08

申请号：US10979245

申请日：2004-11-03

申请人： Hiroshi Watanabe ,  Tatsuji Ikeda ,  Kazuya Takahashi

发明人： Hiroshi Watanabe ,  Tatsuji Ikeda ,  Kazuya Takahashi

IPC分类号： G01R31/26

CPC分类号： G01R31/3004 ,  G01R31/31703 ,  G01R31/3193

摘要： A plurality of resistors is connected to a plurality of output terminals of a semiconductor integrated circuit, respectively, and a predetermined voltage is applied to the plurality of resistors. Also, a predetermined operation pattern signal used to test functions of the semiconductor integrated circuit is input to a plurality of input terminals of the semiconductor integrated circuit. Thus, a total sum of amounts of currents caused to flow through the plurality of resistors, respectively, is measured. The total sum of amounts of currents thus measured is compared with a normal value of a total sum of amounts of currents which are measured in a non-defective sample which is used instead of the semiconductor integrated circuit and is verified in advance to normally operate. It is judged based on the comparison results whether or not the semiconductor integrated circuit is normal. As a result, whether or not the semiconductor integrated circuit is a non-defective or a defective can be simply judged without performing logic simulation and failure simulation.

摘要翻译： 多个电阻器分别连接到半导体集成电路的多个输出端子，并且将预定电压施加到多个电阻器。 此外，用于测试半导体集成电路的功能的预定操作模式信号被输入到半导体集成电路的多个输入端子。 因此，测量分别流过多个电阻器的电流量的总和。 将如此测量的电流量的总和与在代替半导体集成电路的无缺陷样品中测量的电流量的总和的正常值进行比较，并且预先验证正常操作。 根据比较结果判断半导体集成电路是否正常。 结果，可以简单地判断半导体集成电路是否为无缺陷或缺陷，而不执行逻辑仿真和故障模拟。

公开(公告)号：US20070040250A1

公开(公告)日：2007-02-22

申请号：US11589895

申请日：2006-10-31

申请人： Ryoichi Kajiwara ,  Masahiro Koizumi ,  Toshiaki Morita ,  Kazuya Takahashi ,  Munehisa Kishimoto ,  Shigeru Ishii ,  Toshinori Hirashima ,  Yasushi Takahashi ,  Toshiyuki Hata ,  Hiroshi Sato ,  Keiichi Ookawa

发明人： Ryoichi Kajiwara ,  Masahiro Koizumi ,  Toshiaki Morita ,  Kazuya Takahashi ,  Munehisa Kishimoto ,  Shigeru Ishii ,  Toshinori Hirashima ,  Yasushi Takahashi ,  Toshiyuki Hata ,  Hiroshi Sato ,  Keiichi Ookawa

IPC分类号： H01L23/495

CPC分类号： H01L23/49555 ,  H01L21/4814 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/81 ,  H01L24/83 ,  H01L24/84 ,  H01L24/97 ,  H01L29/7833 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/29011 ,  H01L2224/29015 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/73253 ,  H01L2224/75251 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83138 ,  H01L2224/83191 ,  H01L2224/83825 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H05K3/3426 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2224/29139 ,  H01L2924/3512 ,  H01L2224/48 ,  H01L2924/00012

摘要： A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.

公开(公告)号：USD492610S1

公开(公告)日：2004-07-06

申请号：US29181993

申请日：2003-05-19

申请人： Kazuya Takahashi ,  Muneyuki Nagai

设计人： Kazuya Takahashi ,  Muneyuki Nagai

公开(公告)号：USD490007S1

公开(公告)日：2004-05-18

申请号：US29182002

申请日：2003-05-19

申请人： Muneyuki Nagai ,  Kazuya Takahashi

设计人： Muneyuki Nagai ,  Kazuya Takahashi

公开(公告)号：US06227968B1

公开(公告)日：2001-05-08

申请号：US09358335

申请日：1999-07-21

申请人： Toshifumi Suzuki ,  Katsunori Okita ,  Kazuya Takahashi ,  Toru Takeda

发明人： Toshifumi Suzuki ,  Katsunori Okita ,  Kazuya Takahashi ,  Toru Takeda

IPC分类号： A63F1300

CPC分类号： A63F13/814 ,  A63F13/08 ,  A63F13/214 ,  A63F13/218 ,  A63F13/5375 ,  A63F2300/1012 ,  A63F2300/1068 ,  A63F2300/303 ,  A63F2300/63 ,  A63F2300/8005 ,  A63F2300/8047

摘要： Rhythm sensations can be represented in time to music by using the entire body and to create powerfulness and rhythm sensations. Stepping position indication data which is set by a rhythm setting section is read from a stepping position indication data memory, and the stepping position instruction contents are scrolled and displayed on a monitor by a scroll display control section, thereby performing instructions of the stepping position and the stepping operation timing. When the fact that a player steps on a step-on base section in accordance with the display contents of the monitor is detected by a cable switch and this is input from a stepping operation monitor section, a score proportional to the timing deviation is calculated by an amount-of-deviation detection/totaling section, and next, an evaluation is performed by the rhythm setting section. Then, the next stepping position indication data is set according to the evaluation result.

摘要翻译： 节奏感可以通过使用整个身体及时发现音乐，创造出强大和节奏的感觉。 从踏步位置指示数据存储器读取由节奏设定部设定的步进位置指示数据，并且通过滚动显示控制部将步进位置指示内容滚动显示在监视器上，由此执行步进位置和 步进操作时机。 当通过电缆开关检测到玩家按照监视器的显示内容进行踩踏基座的事实，并且从踏步操作监视器部分输入时，与定时偏差成比例的得分通过 偏差检测/合计部分，然后由节奏设定部分执行评估。 然后，根据评价结果来设定下一个步进位置指示数据。

公开(公告)号：USD424257S

公开(公告)日：2000-05-02

申请号：US107422

申请日：1999-07-06

申请人： Masakazu Umeda ,  Kazuya Takahashi

设计人： Masakazu Umeda ,  Kazuya Takahashi

公开(公告)号：US5614328A

公开(公告)日：1997-03-25

申请号：US534330

申请日：1995-09-27

申请人： Satoshi Suzuki ,  Kazuya Takahashi ,  Teruo Kawada ,  Yuuji Suzuki ,  Morimasa Tanimoto

发明人： Satoshi Suzuki ,  Kazuya Takahashi ,  Teruo Kawada ,  Yuuji Suzuki ,  Morimasa Tanimoto

IPC分类号： C25D5/50 ,  B32B15/20

CPC分类号： C25D5/505 ,  Y10S379/912 ,  Y10S428/935 ,  Y10S428/939 ,  Y10T428/12715

摘要： Provided is a method for manufacturing a reflow-plated member, which comprises a process for forming a plated layer of Sn or Sn alloy on the surface of a base material, at least the surface of which is formed of Cu or Cu alloy, by electroplating, and a process for running the base material at a traveling speed equivalent to 80% to 90% of the lowest traveling speed that said plated layer does not melt when the base material is continuously run for reflowing in a heating furnace at a predetermined temperature. The obtained reflow-plated member is excellent in any of properties including solderability, heat resistance, bendability, wear resistance, and corrosion resistance.

摘要翻译： 提供了一种制造回流部件的方法，其包括在基材表面上形成Sn或Sn合金的镀层的工艺，至少其表面由Cu或Cu合金形成，通过电镀 以及当在预定温度下在加热炉中连续运行用于回流的所述镀层不熔化的最低行进速度的80％至90％的行进速度下运行所述基材的工艺。 获得的回流镀层构件在包括可焊性，耐热性，弯曲性，耐磨性和耐腐蚀性的任何特性方面都是优异的。

公开(公告)号：US5431324A

公开(公告)日：1995-07-11

申请号：US8578

申请日：1993-01-22

申请人： Ryoichi Kajiwara ,  Mituo Katou ,  Kazuya Takahashi ,  Minoru Maruta ,  Tokiyuki Seto ,  Kunihiro Tsubosaki

发明人： Ryoichi Kajiwara ,  Mituo Katou ,  Kazuya Takahashi ,  Minoru Maruta ,  Tokiyuki Seto ,  Kunihiro Tsubosaki

IPC分类号： H01L21/607 ,  B23K20/10 ,  H01L21/60

CPC分类号： H01L24/85 ,  B23K20/10 ,  H01L24/78 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/181

摘要： An ultrasonic bonding apparatus comprises an ultrasonic wave controller, a bonding system including a bonding head, a laser oscillator, a laser optics, a vibration monitoring system including a vibrometer, and a mechanism for feeding a result of monitoring back to a bonding condition.

摘要翻译： 超声波接合装置包括超声波控制器，包括接合头，激光振荡器，激光光学元件，包括振动计的振动监测系统的接合系统和用于将监测结果馈送回到接合条件的机构。

公开(公告)号：US4179650A

公开(公告)日：1979-12-18

申请号：US864266

申请日：1977-12-27

申请人： Isao Fukushima ,  Akihiro Asada ,  Kazuya Takahashi

发明人： Isao Fukushima ,  Akihiro Asada ,  Kazuya Takahashi

IPC分类号： H01L29/66 ,  H03G1/00 ,  H03H11/24 ,  H03H11/46 ,  G05F1/48

CPC分类号： H03H11/46 ,  H03G1/0035 ,  H03G1/0082 ,  H03H11/24

摘要： A variable impedance circuit comprises a differential current circuit having a diode and a first transistor connected so as to operate differentially with respect to each other, and a current control circuit for controlling current flowing through the differential current circuit, whereby variation of the operative resistance of the differential current circuit causes variation of impedance thereof. The current control circuit comprises a second transistor having a collector connected with the differential connection of the differential current circuit, and an emitter grounded via a resistor, and a third transistor having a base applied with a control voltage and an emitter connected with the emitter of the second transistor. A fourth transistor is also provided having a collector connected to the base of the second transistor, a base connected to the collector of the third transistor and an emitter applied with source voltage independently from the current flowing through the differential current circuit. The current control circuit is connected with the differential current circuit through only the collector of the second transistor to establish a high impedance of the current control circuit as seen by the differential current circuit.

摘要翻译： 可变阻抗电路包括具有二极管和第一晶体管的差分电流电路，所述第二晶体管被连接成相对于彼此差分地工作;以及电流控制电路，用于控制流过差分电流电路的电流，由此， 差分电流电路导致其阻抗的变化。 电流控制电路包括第二晶体管，其具有与差分电流电路的差分连接的集电极，以及通过电阻器接地的发射极，以及具有施加有控制电压的基极和与发射极连接的发射极的第三晶体管 第二晶体管。 还提供第四晶体管，其具有连接到第二晶体管的基极的集电极，连接到第三晶体管的集电极的基极和独立于流过差分电流电路的电流施加源电压的发射极。 电流控制电路仅通过第二晶体管的集电极与差分电流电路连接，以建立电流控制电路的高阻抗，如差分电流电路所示。