公开(公告)号：US5797931A

公开(公告)日：1998-08-25

申请号：US620364

申请日：1996-03-22

申请人： Shiro Bito ,  Isami Hirao ,  Kazuhiko Oozeki ,  Minoru Tsuruta ,  Akito Mukaizawa ,  Akio Nakada ,  Tsuyoshi Tsukagoshi ,  Shuichi Kimura ,  Toshihiko Suzuta ,  Seiji Kuramoto ,  Naoki Uchiyama

发明人： Shiro Bito ,  Isami Hirao ,  Kazuhiko Oozeki ,  Minoru Tsuruta ,  Akito Mukaizawa ,  Akio Nakada ,  Tsuyoshi Tsukagoshi ,  Shuichi Kimura ,  Toshihiko Suzuta ,  Seiji Kuramoto ,  Naoki Uchiyama

IPC分类号： A61B17/064 ,  A61B17/068 ,  A61B17/08 ,  A61B17/10 ,  A61B17/12 ,  A61B17/122 ,  A61B17/128 ,  A61B17/04

CPC分类号： A61B17/1285 ,  A61B17/08 ,  A61B17/122 ,  A61B17/064 ,  A61B17/0684 ,  A61B17/10 ,  A61B17/12 ,  A61B2017/0641

摘要： A surgical instrument for fastening together opposing portions of a body organ. The instrument comprises a first support for supporting the first opposing portion of the body organ, a second support opposing the first support, for supporting the second opposing portion of the body organ, and a displacement-preventing member connected to the first or second support for preventing the supports from displacing relative to each other. The member comprises a pin protruding from one of the supports and a hole formed in the other of the supports. The pin is made of thermoplastic resin. When heated, the pin is softened and deformed, whereby the first and second supports are secured to each other, fastening together the opposing portions of the body organ.

摘要翻译： 一种用于将身体器官的相对部分紧固在一起的手术器械。 仪器包括用于支撑身体器官的第一相对部分的第一支撑件，与第一支撑件相对的用于支撑身体器官的第二相对部分的第二支撑件，以及连接到第一或第二支撑件的位移防止构件， 防止支撑件相对于彼此移位。 该构件包括从支撑件之一突出的销和形成在另一个支撑件中的孔。 销由热塑性树脂制成。 当加热时，销被软化和变形，由此第一和第二支撑件彼此固定，将身体器官的相对部分紧固在一起。

公开(公告)号：US5273027A

公开(公告)日：1993-12-28

申请号：US589945

申请日：1990-09-28

申请人： Naomi Sekino ,  Koji Fujio ,  Koichiro Ishiwara ,  Naoki Uchiyama ,  Kenji Noda ,  Seiji Iwasaki ,  Shuichi Takayama ,  Tsuyoshi Tsukagoshi ,  Koji Koda

发明人： Naomi Sekino ,  Koji Fujio ,  Koichiro Ishiwara ,  Naoki Uchiyama ,  Kenji Noda ,  Seiji Iwasaki ,  Shuichi Takayama ,  Tsuyoshi Tsukagoshi ,  Koji Koda

IPC分类号： A61B17/22 ,  A61B17/225 ,  A61B19/00 ,  A61M1/00 ,  A61N7/00 ,  A61B17/00 ,  A61B8/00

CPC分类号： A61N7/00 ,  A61B17/22 ,  A61B8/4209 ,  A61B2017/22082 ,  A61B2090/064 ,  A61B2217/005 ,  A61B8/4218

摘要： In the method and dissolving therapeutic apparatus for dissolving a coagulation within a living body, a medicinal liquid for dissolving the coagulation within the living body is injected into the living body, the injected medicinal liquid is left within the living body for a predetermined time and the fluid within the living body containing the coagulation dissolved by the medicinal liquid and the medicinal liquid is substantially all discharged out of the living body. A series of steps including at least respective injecting, leaving and discharging steps is repeated. Preferably, vibrating waves are radiated toward the coagulation during the leaving step.

摘要翻译： 在将生物体内的凝固溶解的方法和溶解治疗装置中，将生物体内凝固的溶解用药液注入生物体内，将注入的药液留在生物体内规定时间， 含有由药液溶解的凝固物的生物体内的液体和药液基本上全部从生物体排出。 重复包括至少相应的注射，离开和放电步骤的一系列步骤。 优选地，在离开步骤期间，振动波朝着凝结物辐射。

公开(公告)号：US5078144A

公开(公告)日：1992-01-07

申请号：US366162

申请日：1989-06-14

申请人： Naomi Sekino ,  Shuichi Takayama ,  Masakazu Gotanda ,  Koichiro Ishihara ,  Naoki Uchiyama ,  Nobuhiko Watanabe ,  Masaaki Nakazawa ,  Tsuguhisa Sasai ,  Tsutomu Okada ,  Takeo Haneda ,  Masaaki Hayashi

发明人： Naomi Sekino ,  Shuichi Takayama ,  Masakazu Gotanda ,  Koichiro Ishihara ,  Naoki Uchiyama ,  Nobuhiko Watanabe ,  Masaaki Nakazawa ,  Tsuguhisa Sasai ,  Tsutomu Okada ,  Takeo Haneda ,  Masaaki Hayashi

IPC分类号： A61B8/08 ,  A61B17/00 ,  A61B17/22 ,  A61B17/225 ,  A61B17/34 ,  A61B19/00 ,  A61M5/42 ,  A61M37/00

CPC分类号： A61B17/2251 ,  A61B17/2256 ,  A61B8/0833 ,  A61B8/0841 ,  A61B8/4209 ,  A61B8/4218 ,  A61M37/0092 ,  A61M5/427 ,  A61B17/3403 ,  A61B2017/00106 ,  A61B2017/00115 ,  A61B2017/22072 ,  A61B2017/22084 ,  A61B2017/22088 ,  A61B2090/064

摘要： An ultrasonic treatment system for conducting treatment by converging ultrasonic waves which are generated outside of a body to a part to be treated in the body comprising an ultrasonic wave generator for generating the ultrasonic waves to be converged to the part to be treated; and an insertion tube connected to the ultrasonic wave generator for guiding an instrument, such as a syringe, employed to introduce and/or return a treatment material to the body.

摘要翻译： 一种超声波处理系统，用于通过将在身体外部产生的超声波聚焦到所述体内的被处理部分进行处理，所述超声波发生器用于产生超声波以收敛到待处理的部分; 以及连接到超声波发生器的插入管，用于引导用于将治疗材料引入和/或返回到身体的诸如注射器的器械。

公开(公告)号：US4512950A

公开(公告)日：1985-04-23

申请号：US552038

申请日：1983-10-31

申请人： Naoyuki Hosoda ,  Naoki Uchiyama ,  Ryusuke Kawanaka

发明人： Naoyuki Hosoda ,  Naoki Uchiyama ,  Ryusuke Kawanaka

IPC分类号： C22C11/00 ,  B23K35/26 ,  C22C13/00 ,  C22C28/00 ,  H01L21/52 ,  H01L21/58 ,  H01L23/02 ,  H01L23/10 ,  H01L23/14 ,  H01L23/488

CPC分类号： B23K35/262 ,  B23K35/268 ,  H01L23/488 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/16195

摘要： A soft solder of Pb alloy for semiconductor devices that contains 1 to 65 wt % of Sn or In or both, the balance being Pb and incidental impurities which include less than 50 ppb of radioisotopes and the count of radioactive alpha-particles being not more than 0.5 CPH/cm.sup.2. The solder exhibits high adhesive strength and good wettability. The properties of this material may be further improved by addition of 1 to 10 wt % of Ag.

摘要翻译： PCT No.PCT / JP83 / 00065 Sec。 371日期：1983年10月31日 102（e）1983年10月31日日期PCT提交1983年3月2日PCT公布。 公开号WO83 / 03163 日期：1983年9月15日。用于半导体器件的Pb合金软焊料，其含有1至65重量％的Sn或In或两者，其余为Pb和包括少于50ppb的放射性同位素的附带杂质和放射性计数 α粒子不超过0.5CPH / cm 2。 焊料显示出高粘合强度和良好的润湿性。 通过添加1〜10重量％的Ag可以进一步提高该材料的性能。

公开(公告)号：US08933369B2

公开(公告)日：2015-01-13

申请号：US12900754

申请日：2010-10-08

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC分类号： B23K26/00 ,  C03C23/00 ,  B23K26/03 ,  B23K26/04 ,  B23K26/06 ,  B23K26/073 ,  B23K26/08 ,  B23K26/36 ,  B23K26/40 ,  B28D5/00 ,  C03B33/023 ,  C03B33/08 ,  C03B33/10 ,  G02F1/1368

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

摘要翻译： 一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上 在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域 由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合 即使形成了修改区域。

公开(公告)号：US08519511B2

公开(公告)日：2013-08-27

申请号：US13618699

申请日：2012-09-14

申请人： Yoshimaro Fujii ,  Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama

发明人： Yoshimaro Fujii ,  Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama

IPC分类号： H01L29/06

CPC分类号： H01L21/78 ,  B23K26/0057 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B23K2203/50 ,  B28D5/00 ,  B28D5/0011 ,  H01L21/268 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/6836 ,  H01L21/76894 ,  H01L23/544 ,  H01L23/562 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2223/5446 ,  H01L2924/00 ,  H01L2924/0002

摘要： A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.

公开(公告)号：US20130015167A1

公开(公告)日：2013-01-17

申请号：US13618637

申请日：2012-09-14

申请人： Yoshimaro Fujii ,  Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama

发明人： Yoshimaro Fujii ,  Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama

IPC分类号： B23K26/08 ,  H01L21/02

CPC分类号： H01L21/78 ,  B23K26/0057 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B23K2203/50 ,  B28D5/00 ,  B28D5/0011 ,  H01L21/268 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/6836 ,  H01L21/76894 ,  H01L23/544 ,  H01L23/562 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2223/5446 ,  H01L2924/00 ,  H01L2924/0002

摘要： A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.

公开(公告)号：US08322474B2

公开(公告)日：2012-12-04

申请号：US12668614

申请日：2008-07-04

申请人： Naoki Uchiyama

发明人： Naoki Uchiyama

IPC分类号： B60W20/00

CPC分类号： B60L7/24 ,  B60L11/005 ,  Y02T10/7022 ,  Y10T477/38

摘要： When a drive wheel (3) of a vehicle is driven by a motor generator (10) that operates as a motor, electric power is supplied from a storage battery (20) to the motor generator (10). When the drive wheel (3) is braked by the motor generator (10) that operates as a generator, electric power is supplied from the motor generator (10) to the storage battery (20), and a first thermoelectric conversion element (11) is supplied with electric power from the motor generator (10) to cool the motor generator (10).

摘要翻译： 当车辆的驱动轮（3）由作为电动机工作的电动发电机（10）驱动时，电力从蓄电池（20）供给到电动发电机（10）。 当驱动轮（3）由作为发电机动作的电动发电机（10）制动时，从电动发电机（10）向蓄电池（20）供给电力，第一热电转换元件（11） 被供给来自电动发电机（10）的电力以冷却电动发电机（10）。

公开(公告)号：US08314622B2

公开(公告)日：2012-11-20

申请号：US12668231

申请日：2008-07-03

申请人： Naoki Uchiyama

发明人： Naoki Uchiyama

IPC分类号： G01R27/08

CPC分类号： H01M8/1067 ,  G01N27/302 ,  H01M8/04089 ,  H01M8/04197 ,  H01M2300/0082

摘要： A detection membrane (11) is joined to a first surface (10a) of an electrolyte membrane (10), and hydrogen gas is supplied to a second surface (10b) thereof. If the electrolyte membrane has a defect (10c), hydrogen gas leaks to the first surface, resulting in a change in electric resistance of the detection membrane near the defect. The defect is recognized by this change. FA hydrogen electrode (14) is joined to the second surface, and an electric circuit (17) is connected between the detection membrane and the hydrogen electrode. Hydrogen gas supplied to a space facing the hydrogen electrode is ionized at the hydrogen electrode, and hydrogen ions permeates through the electrolyte membrane and hydrogenates the detection membrane. Whether or not hydrogen ion conductivity is uniform is examined by measuring electric resistance of the detection membrane, which varies depending on the amount of hydrogen ions, for each of regions.

摘要翻译： 检测膜（11）与电解质膜（10）的第一面（10a）接合，向其第二面（10b）供给氢气。 如果电解质膜具有缺陷（10c），则氢气泄漏到第一表面，导致检测膜在缺陷附近的电阻变化。 该变化可以认识到缺陷。 FA氢电极（14）连接到第二表面，并且电路（17）连接在检测膜和氢电极之间。 供给到氢电极的空间的氢气在氢电极被离子化，氢离子透过电解质膜，使检测膜氢化。 通过测量每个区域的检测膜的电阻（其取决于氢离子的量而变化）来检查氢离子传导性是否均匀。

公开(公告)号：US08268704B2

公开(公告)日：2012-09-18

申请号：US10507321

申请日：2003-03-06

申请人： Yoshimaro Fujii ,  Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama

发明人： Yoshimaro Fujii ,  Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  B23K26/0057 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B23K2203/50 ,  B28D5/00 ,  B28D5/0011 ,  H01L21/268 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/6836 ,  H01L21/76894 ,  H01L23/544 ,  H01L23/562 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2223/5446 ,  H01L2924/00 ,  H01L2924/0002

摘要： A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.

摘要翻译： 一种衬底分割方法，其可以在防止发生破裂和破裂的同时使衬底细分割。 该基板分割方法包括以下步骤：将具有形成有功能元件19的正面3的半导体基板1照射在基板内，同时将聚光点定位在基板内，从而形成包含熔融处理区域的改质区域 在半导体衬底1内进行多光子吸收，并且使包含熔融处理区域的改性区域形成切割起点区域; 在形成用于切割的起点区域的步骤之后，研磨半导体衬底1的后表面21，使得半导体衬底1达到预定厚度。