公开(公告)号：US07789316B2

公开(公告)日：2010-09-07

申请号：US12559202

申请日：2009-09-14

申请人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

发明人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

IPC分类号： G06K19/06

CPC分类号： G06K19/07749 ,  G06K19/027 ,  G06K19/07728 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/3135 ,  H01L2224/16 ,  Y10T29/49146

摘要： An electronic device includes: a base; a conductor pattern formed on the base; a circuit chip electrically connected to the conductor pattern; and a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which has such an internal structure that a plurality of columns extending in the thickness direction of the base are dispersed in a predetermined substrate. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

摘要翻译： 电子设备包括：基座; 形成在基座上的导体图案; 电连接到所述导体图形的电路芯片; 以及加强构件，其设置在所述基座上以围绕所述电路芯片的外形为环状，并且具有这样的内部结构，使得沿所述基座的厚度方向延伸的多个列分散在预定基板中 。 电子装置还包括密封构件，其在覆盖电路芯片的顶部的同时填充加强构件的内部，从而将电路芯片密封在基座上。

公开(公告)号：US08720519B2

公开(公告)日：2014-05-13

申请号：US13117584

申请日：2011-05-27

申请人： Takatoyo Yamakami ,  Hidehiko Kira ,  Takashi Kubota ,  Kiyoshi Oi ,  Kiyoaki Iida ,  Takashi Kurihara

发明人： Takatoyo Yamakami ,  Hidehiko Kira ,  Takashi Kubota ,  Kiyoshi Oi ,  Kiyoaki Iida ,  Takashi Kurihara

IPC分类号： B32B37/02

CPC分类号： H01L24/83 ,  H01L24/75 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81001 ,  H01L2224/83001 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512

摘要： A bonding tool holds a lower chip against a release tape held by a suction force. The bonding tool has an electronic-component suction opening against which the lower chip is held and, surrounding the electronic-component suction opening, a trench that accommodates the release tape. The lower chip is heated, by being pressed against an underfill material and, thus, an area on which an upper chip is mounted is formed in such a manner that the underfill material protrudes out from the lower chip. During the heating, because an expanded part of the release tape, expanded due to heat, is inserted into the trench, no folded line is formed on the upper surface of the underfill material.

摘要翻译： 接合工具将下部芯片保持抵靠由吸力保持的释放带。 接合工具具有电子部件吸入口，下部芯片被保持在该电子元件吸入口周围，并且围绕电子部件吸入口，容纳释放带的沟槽。 下芯片通过压在底部填充材料上被加热，因此，形成上部芯片安装的区域，使得底部填充材料从下部芯片突出。 在加热过程中，由于由于热而膨胀的释放带的扩张部分被插入到沟槽中，所以在底部填充材料的上表面上没有形成折线。

公开(公告)号：US07833831B2

公开(公告)日：2010-11-16

申请号：US11951693

申请日：2007-12-06

申请人： Norio Kainuma ,  Kuniko Ishikawa ,  Hidehiko Kira

发明人： Norio Kainuma ,  Kuniko Ishikawa ,  Hidehiko Kira

IPC分类号： H01L21/00

CPC分类号： B23K1/06 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/742 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H05K3/3478 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0285 ,  H05K2203/0338 ,  H05K2203/1105 ,  Y10T428/12493 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic component is equipped with electrode protrusions that make it possible to mount the electronic component without covering connection pads of a circuit board with solder and to dispose the connection pads of the circuit board with a narrow pitch while preventing electrical shorting of the connection electrodes during mounting. A method of manufacturing an electronic component equipped with connection electrodes, where electrode protrusions are covered with solder, includes a step of heating a solder sheet to a semi-molten state and pressing the electronic component onto the solder sheet to place the electrode protrusions in contact with the solder sheet and a step of retracting the electronic component from a position where the electrode protrusions contact the solder sheet to transfer solder onto outside surfaces of the electrode protrusions that contacted the solder sheet.

摘要翻译： 电子部件配备有电极突起，其可以安装电子部件而不用焊料覆盖电路板的连接焊盘，并且以窄的间距配置电路板的连接焊盘，同时防止连接电极的电短路 安装。 一种制造具有连接电极的电子部件的方法，其中电极突起被焊料覆盖，包括将焊料片加热至半熔融状态并将电子部件压在焊料片上以使电极突起接触的步骤 并且从电极突起与焊料片接触的位置缩回电子部件的步骤，将焊料转移到与焊料片接触的电极突起的外表面上。

公开(公告)号：US06400529B1

公开(公告)日：2002-06-04

申请号：US09528683

申请日：2000-03-20

申请人： Shunji Baba ,  Hidehiko Kira ,  Norio Kainuma ,  Toru Okada

发明人： Shunji Baba ,  Hidehiko Kira ,  Norio Kainuma ,  Toru Okada

IPC分类号： G11B576

CPC分类号： G11B5/4853

摘要： A head assembly has a head slider including a magnetic head and a first electrode, an IC chip supporting the head slider on a principal surface of the IC chip, and a suspension supporting the IC chip, the IC chip comprising a second electrode and a third electrode on the principal surface thereof, the third electrode being connected to the suspension, the second electrode being electrically connected to the first electrode.

摘要翻译： 头组件具有头滑块，其包括磁头和第一电极，IC芯片，其在IC芯片的主表面上支撑磁头滑块，以及支撑IC芯片的悬架，所述IC芯片包括第二电极和第三电极 电极在其主表面上，第三电极连接到悬架，第二电极电连接到第一电极。

公开(公告)号：US06369985B1

公开(公告)日：2002-04-09

申请号：US09507816

申请日：2000-02-22

申请人： Akio Gouo ,  Hidehiko Kira ,  Norio Kainuma ,  Takeshi Ohwe

发明人： Akio Gouo ,  Hidehiko Kira ,  Norio Kainuma ,  Takeshi Ohwe

IPC分类号： G11B548

CPC分类号： G11B5/4853 ,  G11B5/4806 ,  G11B5/486 ,  G11B33/121

摘要： A head slider and head IC are mounted on a head suspension, the head IC being mounted on a head IC mounting surface. One or more through holes are provided on the head IC mounting surface of the head suspension and the head IC is mounted by injecting a bonding agent between the mounting surface and the head IC through the through holes. The bonding agent is evenly distributed beneath the head IC, so that the head suspension is well balanced.

摘要翻译： 头部滑块和头部IC安装在头部悬挂上，头部IC安装在头部IC安装表面上。 一个或多个通孔设置在头悬架的头部IC安装表面上，并且通过通孔在安装表面和头部IC之间注入粘合剂来安装头部IC。 粘合剂均匀地分布在头部IC下面，使得头部悬挂体系平衡良好。

公开(公告)号：US07436062B2

公开(公告)日：2008-10-14

申请号：US10223454

申请日：2002-08-20

申请人： Norio Kainuma ,  Shunji Baba ,  Hidehiko Kira ,  Toru Okada

发明人： Norio Kainuma ,  Shunji Baba ,  Hidehiko Kira ,  Toru Okada

IPC分类号： H01L23/48 ,  H01L23/04

CPC分类号： H01L24/28 ,  H01L21/563 ,  H01L24/13 ,  H01L24/14 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05664

摘要： An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bumps 117 formed on a bottom surface 101a of the chip 101. Signal stud bumps 113 are made of gold while power stud bumps 114, ground stud bumps 115 and dummy stud bumps 116 are all made of a gold-palladium alloy, which are harder than the signal stud bumps 113 and thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip element 100 is mounted, a gap of approximately 30 μm is maintained between the bottom surface 101a of the chip 100 and a top surface of the circuit board 120 on which the semiconductor chip element 100 is mounted.

摘要翻译： 一种用于改善超声波接合并安装在电路板上的半导体芯片元件100的底部填充填充的装置和方法。 半导体芯片元件100包括硅芯片101和形成在芯片101的底表面101a上的一组柱形突起117。 信号柱凸起113由金制成，而电源凸块114，接地柱形凸块115和虚拟凸块凸块116都由金 - 钯合金制成，其比信号柱凸块113更硬，因此在超声波期间不容易变形 治疗。 因此，在安装半导体芯片元件100的状态下，在芯片100的底面101a与半导体芯片元件100的电路基板120的上表面之间保持约30μm的间隙 安装。

公开(公告)号：US07828193B2

公开(公告)日：2010-11-09

申请号：US12000675

申请日：2007-12-14

申请人： Kuniko Ishikawa ,  Norio Kainuma ,  Hidehiko Kira

发明人： Kuniko Ishikawa ,  Norio Kainuma ,  Hidehiko Kira

IPC分类号： B23K31/02

CPC分类号： B23K1/06 ,  H01L21/563 ,  H01L24/28 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/03828 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/75355 ,  H01L2224/8101 ,  H01L2224/81024 ,  H01L2224/81075 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81906 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2203/0285 ,  H05K2203/086 ,  H05K2203/1476 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/8182 ,  H01L2224/29099

摘要： In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps.

摘要翻译： 在将电子部件安装在基板上的方法中，基板和电子部件中的至少一个上的电极端子由焊锡凸块构成。 将基板的电极端子和电子部件的电极端子接触，将超声波振动施加到基板和电子部件中的至少一个，以将电极端子临时接合在一起。 然后用焊剂填充填充衬底和电子部件之间的间隙，并且通过回流焊料凸块来接合衬底和电子部件的电极端子。

公开(公告)号：US20080203138A1

公开(公告)日：2008-08-28

申请号：US12000675

申请日：2007-12-14

申请人： Kuniko Ishikawa ,  Norio Kainuma ,  Hidehiko Kira

发明人： Kuniko Ishikawa ,  Norio Kainuma ,  Hidehiko Kira

IPC分类号： B23K1/06

CPC分类号： B23K1/06 ,  H01L21/563 ,  H01L24/28 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/03828 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/75355 ,  H01L2224/8101 ,  H01L2224/81024 ,  H01L2224/81075 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81906 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2203/0285 ,  H05K2203/086 ,  H05K2203/1476 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/8182 ,  H01L2224/29099

摘要： In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps.

摘要翻译： 在将电子部件安装在基板上的方法中，基板和电子部件中的至少一个上的电极端子由焊锡凸块构成。 将基板的电极端子和电子部件的电极端子接触，将超声波振动施加到基板和电子部件中的至少一个，以将电极端子临时接合在一起。 然后用焊剂填充填充衬底和电子部件之间的间隙，并且通过回流焊料凸块来接合衬底和电子部件的电极端子。

公开(公告)号：US20080206587A1

公开(公告)日：2008-08-28

申请号：US11951693

申请日：2007-12-06

申请人： Norio Kainuma ,  Kuniko Ishikawa ,  Hidehiko Kira

发明人： Norio Kainuma ,  Kuniko Ishikawa ,  Hidehiko Kira

IPC分类号： B32B15/00 ,  B23K31/02 ,  B23K1/20

CPC分类号： B23K1/06 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/742 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H05K3/3478 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0285 ,  H05K2203/0338 ,  H05K2203/1105 ,  Y10T428/12493 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic component is equipped with electrode protrusions that make it possible to mount the electronic component without covering connection pads of a circuit board with solder and to dispose the connection pads of the circuit board with a narrow pitch while preventing electrical shorting of the connection electrodes during mounting. A method of manufacturing an electronic component equipped with connection electrodes, where electrode protrusions are covered with solder, includes a step of heating a solder sheet to a semi-molten state and pressing the electronic component onto the solder sheet to place the electrode protrusions in contact with the solder sheet and a step of retracting the electronic component from a position where the electrode protrusions contact the solder sheet to transfer solder onto outside surfaces of the electrode protrusions that contacted the solder sheet.

摘要翻译： 电子部件配备有电极突起，其可以安装电子部件而不用焊料覆盖电路板的连接焊盘，并且以窄的间距配置电路板的连接焊盘，同时防止连接电极的电短路 安装。 一种制造具有连接电极的电子部件的方法，其中电极突起被焊料覆盖，包括将焊料片加热至半熔融状态并将电子部件压在焊料片上以使电极突起接触的步骤 并且从电极突起与焊料片接触的位置缩回电子部件的步骤，将焊料转移到与焊料片接触的电极突起的外表面上。

公开(公告)号：US06483190B1

公开(公告)日：2002-11-19

申请号：US09618726

申请日：2000-07-18

申请人： Norio Kainuma ,  Shunji Baba ,  Hidehiko Kira ,  Toru Okada

发明人： Norio Kainuma ,  Shunji Baba ,  Hidehiko Kira ,  Toru Okada

IPC分类号： H01L2348

CPC分类号： H01L24/28 ,  H01L21/563 ,  H01L24/13 ,  H01L24/14 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05664

摘要： An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bumps 117 formed on a bottom surface 101a of the chip 101. Signal stud bumps 113 are made of gold while power stud bumps 114, ground stud bumps 115 and dummy stud bumps 116 are all made of a gold-palladium alloy, which are harder than the signal stud bumps 113 and thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip element 100 is mounted, a gap of approximately 30 &mgr;m is maintained between the bottom surface 101a of the chip 100 and a top surface of the circuit board 120 on which the semiconductor chip element 100 is mounted.

摘要翻译： 一种用于改善超声波接合并安装在电路板上的半导体芯片元件100的底部填充填充的装置和方法。 半导体芯片元件100包括硅芯片101和形成在芯片101的底表面101a上的一组柱形突起117.信号柱凸块113由金制成，而电源触头凸块114，接地柱形突起115和虚拟凸块凸块 116均由金 - 钯合金制成，其比信号柱凸块113更硬，因此在超声波处理期间不容易变形。 因此，在安装半导体芯片元件100的状态下，在芯片100的底面101a与安装有半导体芯片元件100的电路基板120的上表面之间保持约30μm的间隙 。