公开(公告)号：US11107945B2

公开(公告)日：2021-08-31

申请号：US15820930

申请日：2017-11-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Alexander Linkov ,  Frank Singer ,  Matthias Bruckschloegl ,  Siegfried Herrmann ,  Jürgen Moosburger ,  Thomas Schwarz

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/48 ,  H01L33/38 ,  H01L33/62

Abstract: A component includes a light emitting semiconductor chip, wherein the semiconductor chip includes a layer arrangement including a plurality of layers, the p-conducting layer and the n-conducting layer adjoin one another in an active zone, a first electrical contact is configured on the p-conducting side of the layer arrangement at a first side of the semiconductor chip, a second electrical contact is configured on the n-conducting side of the layer arrangement at a second side of the semiconductor chip, the second side being situated opposite the first side of the semiconductor chip, the first side of the semiconductor chip transitions into the second side via an end side, the semiconductor chip is secured by the end side on a substrate, the substrate includes a first and second further electrical contact, and the further electrical contacts electrically conductively connect to the electrical contacts of the semiconductor chip.

公开(公告)号：US20190326269A1

公开(公告)日：2019-10-24

申请号：US16467480

申请日：2017-12-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62 ,  H01L33/64 ,  G09F9/302

Abstract: A video- wall module is disclosed. In an embodiment a video-wall module includes a printed-circuit board, a plurality of light-emitting diode chips arranged at the printed-circuit board, a circuit chip fixed to the printed-circuit board, wherein the circuit chip is connected with electrical connections of the light-emitting diode chips in order to electrically actuate the light-emitting diode chips and a housing for the circuit chip at least partially formed by the printed circuit board, wherein the light-emitting diode chips are divided into a first area and a first edge area surrounding the first area, and wherein the light-emitting diode chips in the first area comprise a smaller radiation wavelength than the light-emitting diode chips in the first edge area on average at the same temperature.

公开(公告)号：US20190157339A1

公开(公告)日：2019-05-23

申请号：US16098283

申请日：2017-05-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Peter Brick ,  Matthias Sabathil ,  Frank Singer ,  Thomas Schwarz

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/58 ,  H01L33/62

Abstract: An optical assembly and a display device are disclosed. In an embodiment an optical assembly includes a common carrier, a plurality of first chip groups, each first chip group comprising at least two similar luminescence diode chips, a plurality of second chip groups, each second chip group comprising at least two similar luminescence diode chips, wherein the first and second chip groups are arranged planar along a regular grid of first unit cells on a main surface of the common carrier and an optical element arranged downstream of the first and second chip groups with respect to a main radiation direction, wherein the luminescence diode chips of the different chip groups are configured to emit electromagnetic radiation of different wavelength characteristics.

公开(公告)号：US10205071B2

公开(公告)日：2019-02-12

申请号：US15577045

申请日：2016-05-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Andreas Biebersdorf ,  Dirk Becker ,  Bernd Barchmann ,  Björn Hoxhold ,  Philipp Schlosser ,  Andreas Waldschik

IPC: H01L33/60 ,  H01L33/62 ,  H01L25/075 ,  H01L33/48 ,  H01L33/64 ,  H01L33/00

Abstract: A method of producing optoelectronic semiconductor components includes providing a carrier with a carrier underside and a carrier top. The carrier has a metallic core material and at least on the carrier top a metal layer. A dielectric mirror is applied to the core material. At least two holes are formed through the carrier. A ceramic layer with a thickness of at most 150 μm at least on the carrier underside and in the holes is produced. The ceramic layer includes the core material as a component. Metallic contact layers are applied to at least subregions of the ceramic layer on the carrier underside and in the holes so that the carrier top electrically connects to the carrier underside through the holes. At least one radiation-emitting semiconductor chip is applied to the carrier top and the semiconductor chip is electronically bonded to the contact layers.

公开(公告)号：US20180219135A1

公开(公告)日：2018-08-02

申请号：US15747188

申请日：2016-07-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Christian Leirer ,  Thomas Schwarz ,  Lutz Höppel

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/44 ,  H01L33/30

CPC classification number: H01L33/486 ,  H01L33/30 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/11 ,  H01L2933/0025 ,  H01L2933/0066

Abstract: A component having a metal carrier and a method for producing a component are disclosed. In an embodiment the component includes a carrier having a metallic carrier layer, an insulating layer and a first through-contact extending in a vertical direction throughout the carrier layer, wherein the through-contact is electrically isolated from the carrier layer via the insulating layer. The component further includes a semiconductor body and a wiring structure arranged in the vertical direction between the carrier and the semiconductor body at least places and electrically contacting the semiconductor body, wherein the wiring structure has a first connection area and a second connection area, wherein the connection areas adjoin the carrier and are assigned to different electrical polarities of the component, wherein the first through-contact is in electrical contact with one of the connection areas, and wherein the component is configured to be externally electrically connectable via the carrier.

公开(公告)号：US09945526B2

公开(公告)日：2018-04-17

申请号：US14764032

申请日：2014-01-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Frank Singer ,  Thomas Schwarz

IPC: F21S8/10 ,  H01L25/075 ,  F21V29/70 ,  F21V23/00 ,  H01L33/62 ,  H01L33/64

CPC classification number: F21S41/143 ,  F21S41/192 ,  F21S45/47 ,  F21V23/002 ,  F21V29/70 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/4554

Abstract: An optoelectronic lighting module (100) is provided having at least two optoelectronic semiconductor chips (10) with a radiation outlet surface (11) and an electrically non-conductive back side (12) facing away from the radiation outlet surface,—a cooling body (20) with a cooling body top side (21) and a cooling body bottom side (22) facing away from the cooling body top side (21),—two contact strips (30) with a contact top side (31) and a contact bottom side (32) facing away from the contact top side (31), wherein—the optoelectronic semiconductor chips (10) are arranged with the electrically non-conductive back side (12) on the cooling body top side (21),—each optoelectronic semiconductor chip (10) comprises two electric contact points (13) formed in the direction of the radiation outlet surface (11), and—the optoelectronic semiconductor chips (10) are connected in series via the electric contact points (13).

公开(公告)号：US09935250B2

公开(公告)日：2018-04-03

申请号：US14782698

申请日：2014-04-03

Applicant: OSRAM Opto Semiconductors Gmbh

Inventor： Frank Singer ,  Jürgen Moosburger ,  Thomas Schwarz

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip embodied as a volume emitter, wherein the optoelectronic semiconductor chip is embedded into an optically transparent molded body, a soldering contact is arranged at an underside of the molded body, a bonding wire forms an electrically conductive connection between an electrical contact area of the optoelectronic semiconductor chip and the soldering contact, and the bonding wire is embedded into the molded body.

公开(公告)号：US09837591B2

公开(公告)日：2017-12-05

申请号：US14888770

申请日：2014-05-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer ,  Alexander Linkov ,  Stefan Illek ,  Wolfgang Mönch

IPC: H01L33/60 ,  H01L33/58 ,  H01L33/48 ,  H01L33/62 ,  H01L33/54 ,  H01L33/46 ,  H01L23/00 ,  H01L33/00 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/24 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/46 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A radiation-emitting semiconductor device includes at least one semiconductor chip having a semiconductor layer sequence having an active region that produces radiation; a mounting surface on which at least one electrical contact for external contacting of the semiconductor chip is formed, wherein the mounting surface runs parallel to a main extension plane of the semiconductor layer sequence; a radiation exit surface running at an angle to or perpendicularly to the mounting surface; a radiation-guiding layer arranged in a beam path between the semiconductor chip and the radiation exit surface; and a reflector body adjacent to the radiation-guiding layer in regions and in a top view of the semiconductor device covers the semiconductor chip.

公开(公告)号：US09786824B2

公开(公告)日：2017-10-10

申请号：US14769198

申请日：2014-01-15

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Illek ,  Hans-Jürgen Lugauer ,  Jürgen Moosburger ,  Thomas Schwarz ,  Tansen Varghese

IPC: H01L33/54 ,  H01L33/00 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/54 ,  H01L33/005 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method can be used for producing an optoelectronic component. An optoelectronic semiconductor chip has a front face and a rear face. A sacrificial layer is applied to the rear face. A molded body is formed the optoelectronic semiconductor chip being at least partially embedded in the molded body. The sacrificial layer is removed.

公开(公告)号：US20160380172A1

公开(公告)日：2016-12-29

申请号：US15039861

申请日：2014-11-25

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Michael Brandl ,  Stefan Groetsch ,  Tobias Gebuhr ,  Michael Zitzlsperger ,  Thomas Schwarz

IPC: H01L33/62 ,  F21S8/10 ,  H01L25/075

CPC classification number: H01L33/62 ,  F21S41/141 ,  F21S43/14 ,  H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2933/0033 ,  H01L2924/00014

Abstract: Various embodiments may relate to a component arrangement with at least two electrical components arranged next to one another in a product configuration. Each of the electrical components have at least two electrical terminal contacts and the components arranged next to one another are mechanically connected to one another by an adhesive arranged between the components, and the component arrangement is designed for the individual components of the component arrangement to be applied together to a circuit carrier.

Abstract translation: 各种实施例可以涉及具有在产品配置中彼此相邻布置的至少两个电气部件的部件布置。 每个电气部件具有至少两个电气端子触点，并且彼此相邻布置的部件通过布置在部件之间的粘合剂彼此机械连接，并且部件布置被设计用于部件布置的各个部件为 一起应用于电路载体。