Abstract:
In a non-volatile memory device having an array of non-volatile storage elements, control information received via one or more control input nodes indicates, at different times, that (i) data signals representative of data to be stored within the array of non-volatile storage elements are to be received via a plurality of input/output (I/O) nodes of the non-volatile memory device, and (ii) data signals representative of data read from the array of non-volatile storage elements are to be output via the plurality of I/O nodes. First termination elements are switchably coupled to and decoupled from the I/O nodes based at least in part on the control information, and second termination elements are switchably coupled to and decoupled from the one or more control input nodes based at least in part on the control information.
Abstract:
A receiver is equipped with an adaptive phase-offset controller and associated timing-calibration circuitry that together shift the timing for a data sampler and a digital equalizer. The sample and equalizer timing is shifted to a position with less residual inter-symbol interference (ISI) energy relative to the current symbol. The shifted position may be calculated using a measure of signal quality, such as a receiver bit-error rate or a comparison of filter-tap values, to optimize the timing of data recovery.
Abstract:
On-die termination circuitry within a non-volatile memory device applies a first termination resistance to an I/O node in response to a data storage command indicating that a data signal conveyed on a bidirectional signaling line is to be received within the non-volatile memory device via the I/O node, and applies a second termination resistance to the I/O node in response to information indicating that another memory device is to output a data signal onto the bidirectional signaling line.
Abstract:
A memory controller and/or memory device control termination of a communication link in order to achieve power savings while reducing or eliminating unwanted reflections in the channel. Following transmission of data over the communication channel, termination is left enabled for a programmable time period beginning immediately following completion of the transmission. The time period is sufficiently long to allow the unwanted reflections to be absorbed by the termination. Following the time period, the termination is disabled for power savings.
Abstract:
A system has a plurality of memory devices arranged in a fly-by topology, each having on-die termination (ODT) circuitry for connecting to an address and control (RQ) bus. The ODT circuitry of each memory device includes a set of one or more control registers for controlling on-die termination of one or more signal lines of the RQ bus. A first memory device includes a first set of one or more control registers storing a first ODT value, for controlling termination of one or more signal lines of the RQ bus by the ODT circuitry of the first memory device, and a second memory device includes a second set of one or more control registers storing a second ODT value different from the first ODT value, for controlling termination of one or more signal lines of the RQ bus by the ODT circuitry of the second memory device.
Abstract:
Described is a communication system in a first integrated circuit (IC) communicates with a second IC via single-ended communication channels. A bidirectional reference channel extends between the first and second ICs and is terminated on both ends. The termination impedances at each end of the reference channel support different modes for communicating signals in different directions. The termination impedances for the reference channel can be optimized for each signaling direction.
Abstract:
In an asymmetrically terminated communication system, the power consumed to transmit a particular bit value is adjusted based on whether the bit being output is the second, third, fourth, etc. consecutive bit with the same value after a transition to output the particular bit value. The adjustment of the power consumed to transmit the two or more consecutive bits with the same value may be made by adjusting the driver strength during the second, or subsequent, consecutive bits with the same value. The adjustment of the power consumed is performed on the bit value that consumes the most DC power and the other value is typically not adjusted.
Abstract:
A memory controller is disclosed. The memory controller is configured to be connected to one or more memory devices via an address and control (RQ) bus. Each of the memory devices have on-die termination (ODT) circuitry connected to a subset of signal lines of the RQ bus, and the memory controller is operable to selectively disable the ODT circuitry in at least one memory device of the one or more memory devices.
Abstract:
A structure for delivering power is described. In some embodiments, the structure can include conductors disposed on two or more layers. Specifically, the structure can include a first set of interdigitated conductors disposed on a first layer and oriented substantially along an expected direction of current flow. At least one conductor in the first set of interdigitated conductors may be maintained at a first voltage, and at least one conductor in the first set of interdigitated conductors may be maintained at a second voltage, wherein the second voltage is different from the first voltage. The structure may further include a conducting structure disposed on a second layer, wherein the second layer is different from the first layer, and wherein at least one conductor in the conducting structure is maintained at the first voltage.
Abstract:
A memory device includes a set of inputs, and a first register that includes a first register field to store a value for enabling application of one of a plurality of command/address (CA) on-die termination (ODT) impedance values to first inputs that receive the CA signals; a second register field to store a value for enabling application of one of a plurality of chip select (CS) ODT impedance values to a second input that receives the CS signal; and a third register field to store a value for enabling application of a clock (CK) ODT impedance value to third inputs that receive the CK signal. The memory device also includes second and third registers to store values for selecting one of the plurality of CA ODT impedance values and one of the plurality of CS ODT impedance values for application to the first inputs and second input, respectively.