公开(公告)号：US06664616B2

公开(公告)日：2003-12-16

申请号：US09308620

申请日：1999-07-20

申请人： Kunihiro Tsubosaki ,  Toshio Miyamoto

发明人： Kunihiro Tsubosaki ,  Toshio Miyamoto

IPC分类号： H01L23495

CPC分类号： H01L23/49572 ,  H01L21/565 ,  H01L23/49816 ,  H01L23/49861 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/16245 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05144

摘要： A semiconductor chip 2 is disposed within a device hole as formed in a tape base material 1a of a tape carrier 1, which chip is smaller in thickness than the tape base material 1a, and then sealing is performed using a seal resin 3 to permit both the principal surface and back surface of such semiconductor chip 2 to be coated therewith. And, the position of the semiconductor chip 2 in a direction along the thickness of the tape base 1a is set to correspond to a stress neutral plane of the TCP as a whole.

摘要翻译： 半导体芯片2设置在形成在带载体1的带基材1a中的器件孔内，该带基材1a的厚度小于带基材1a，然后使用密封树脂3进行密封以允许两者 这样的半导体芯片2的主表面和背面将被涂覆。 并且，半导体芯片2沿着带基1a的厚度的方向的位置被设置为与TCP的应力中性平面整体相对应。

公开(公告)号：US06630731B2

公开(公告)日：2003-10-07

申请号：US10050951

申请日：2002-01-22

申请人： Toshio Miyamoto ,  Asao Nishimura ,  Koki Noguchi ,  Satoshi Michishita ,  Masashi Horiguchi ,  Masaharu Kubo ,  Kazuyoshi Shiba

发明人： Toshio Miyamoto ,  Asao Nishimura ,  Koki Noguchi ,  Satoshi Michishita ,  Masashi Horiguchi ,  Masaharu Kubo ,  Kazuyoshi Shiba

IPC分类号： H01L25065

CPC分类号： H01L24/50 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/10897 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/16245 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12033 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

公开(公告)号：US06589855B2

公开(公告)日：2003-07-08

申请号：US09991750

申请日：2001-11-26

申请人： Toshio Miyamoto ,  Kunihiro Tsubosaki ,  Mitsuo Usami

发明人： Toshio Miyamoto ,  Kunihiro Tsubosaki ,  Mitsuo Usami

IPC分类号： H01L21301

CPC分类号： H01L21/6835 ,  G06K19/077 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07783 ,  H01L23/49855 ,  H01L23/5388 ,  H01L24/27 ,  H01L24/28 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/81903 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/3512

摘要： The semiconductor wafer is made thin without any cracks and warp under good workability. The semiconductor wafer thinning process includes the first step of preparing a carrier 1 formed of a base 1a and a suction pad 1b provided on one surface of the base 1a or formed of a base film with an adhesive, the second step of bonding a semiconductor wafer to the carrier 1 in such a manner that a rear surface of the semiconductor wafer 2 with no circuit elements formed therein is opposite to the carrier to form a wafer composite 10, and the third step of holding the carrier of the wafer composite 10 with its semiconductor wafer 2 side up and spin-coating an etchant on the rear surface of the semiconductor wafer 2 thereby to make the semiconductor wafer 2 thin.

公开(公告)号：US06492719B2

公开(公告)日：2002-12-10

申请号：US09984089

申请日：2001-10-26

申请人： Toshio Miyamoto ,  Asao Nishimura ,  Koki Noguchi ,  Satoshi Michishita ,  Masashi Horiguchi ,  Masaharu Kubo ,  Kazuyoshi Shiba

发明人： Toshio Miyamoto ,  Asao Nishimura ,  Koki Noguchi ,  Satoshi Michishita ,  Masashi Horiguchi ,  Masaharu Kubo ,  Kazuyoshi Shiba

IPC分类号： H01L25065

CPC分类号： H01L24/50 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/10897 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/16245 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12033 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

公开(公告)号：US06423941B1

公开(公告)日：2002-07-23

申请号：US09379355

申请日：1999-08-23

申请人： Kenji Kanari ,  Masahiro Goto ,  Masami Takeda ,  Toshio Miyamoto ,  Masahiko Suzumi

发明人： Kenji Kanari ,  Masahiro Goto ,  Masami Takeda ,  Toshio Miyamoto ,  Masahiko Suzumi

IPC分类号： H05B100

CPC分类号： G03G15/2064

摘要： The present invention relates to an image heating apparatus in which an image on a recording material is heated by heat from a heater via a film, and the film contacts a surface of the heater opposite to a surface thereof on which heat generating members are provided.

摘要翻译： 本发明涉及一种图像加热装置，其中记录材料上的图像通过加热器经由膜被加热而加热，并且该膜与加热器的与设置有发热元件的表面相反的表面接触。

公开(公告)号：US06335565B1

公开(公告)日：2002-01-01

申请号：US09319044

申请日：1999-07-30

申请人： Toshio Miyamoto ,  Asao Nishimura ,  Koki Noguchi ,  Satoshi Michishita ,  Masashi Horiguchi ,  Masaharu Kubo ,  Kazuyoshi Shiba

发明人： Toshio Miyamoto ,  Asao Nishimura ,  Koki Noguchi ,  Satoshi Michishita ,  Masashi Horiguchi ,  Masaharu Kubo ,  Kazuyoshi Shiba

IPC分类号： H01L25065

CPC分类号： H01L23/49816 ,  H01L23/49572 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/10814 ,  H01L27/10894 ,  H01L27/118 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01055 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2224/0401

摘要： Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

公开(公告)号：US06298213B1

公开(公告)日：2001-10-02

申请号：US09181037

申请日：1998-10-28

申请人： Toshio Miyamoto ,  Masahiro Goto ,  Satoru Izawa ,  Masahiko Suzumi

发明人： Toshio Miyamoto ,  Masahiro Goto ,  Satoru Izawa ,  Masahiko Suzumi

IPC分类号： G03G1520

CPC分类号： G03G15/2003

摘要： An image forming apparatus has an image forming unit for forming an image on a recording material and a fixing unit for fixing the image to the recording material by nipping and conveying the recording material, the fixing unit including a heater which does not generate heat during a standby period in which a printing operation can be started. The heater generates heat for a predetermined period after the start of power supply to the apparatus and then the apparatus is rendered capable of the printing operation.

摘要翻译： 图像形成装置具有用于在记录材料上形成图像的图像形成单元和用于通过夹持和传送记录材料将图像定影到记录材料的定影单元，所述定影单元包括在 可以开始打印操作的待机时间段。 在开始向设备供电之后，加热器产生预定时间的热量，然后使设备能够进行打印操作。

公开(公告)号：US5715498A

公开(公告)日：1998-02-03

申请号：US525100

申请日：1995-09-08

申请人： Akihiko Takeuchi ,  Koichi Tanigawa ,  Toshio Miyamoto ,  Kazuaki Ono

发明人： Akihiko Takeuchi ,  Koichi Tanigawa ,  Toshio Miyamoto ,  Kazuaki Ono

IPC分类号： G03G15/01 ,  H04N1/047 ,  H04N1/113 ,  H04N1/12 ,  H04N1/50

CPC分类号： H04N1/047 ,  G03G15/0194 ,  H04N1/506 ,  G03G2215/0119 ,  H04N1/1135 ,  H04N1/12 ,  H04N2201/04729 ,  H04N2201/04789

摘要： A color image forming apparatus is provided with a number of image stations respectively corresponding to different color components and adapted to form images of respectively corresponding color components in succession and in superposed manner on a recording medium transported through the a number of image stations. The apparatus has memories for storing image data of respective color components to be supplied to the image stations, detectors for detecting aberration in registration of the images of respective color components formed by the image stations, and a controller for controlling the write-in positions of the image data of respective color components into the memories, based on the output of the detector.

摘要翻译： 彩色图像形成装置设置有分别对应于不同颜色分量的多个图像站，并且适于在分别通过多个图像站传输的记录介质上依次形式并且叠加形成分别对应的颜色分量的图像。 该装置具有用于存储要提供给图像站的各个颜色分量的图像数据的存储器，用于检测由图像站形成的各个颜色分量的图像的登记中的像差的检测器，以及用于控制图像站的写入位置的控制器 基于检测器的输出将各颜色分量的图像数据输入到存储器中。

公开(公告)号：US5419625A

公开(公告)日：1995-05-30

申请号：US172808

申请日：1993-12-27

申请人： Keiji Iwase ,  Toshio Miyamoto ,  Takayo Yamamoto ,  Takaya Ohta

发明人： Keiji Iwase ,  Toshio Miyamoto ,  Takayo Yamamoto ,  Takaya Ohta

IPC分类号： B60T8/32 ,  B60T8/36 ,  B60T8/42 ,  B60T17/04 ,  B62L1/00

CPC分类号： B60T17/04 ,  B60T8/3225 ,  B60T8/3685 ,  B60T8/4275 ,  B62L1/00

摘要： An antiskid braking device for a motorcycle includes a single pump unit which is used to repressurize braking mechanisms of front and rear wheels of the motorcycle and mounted almost in a central portion of a body frame of the motorcycle and a master cylinder of the front wheel. Middle portions of front wheel brake pipes connecting the pump unit to the braking mechanisms are formed of metallic pipes, both ends of the metallic pipes are connected to the braking mechanisms, the master cylinder and the pump unit through flexible brake hoses, and the metallic pipes are arranged along an inside face of a pair of bilateral tank rails of the body frame extending rearward from a head pipe of the motorcycle. The pump unit is mounted so as to extend in a longitudinal dimension thereof along a longitudinal direction of the motorcycle and a brake pipe port section faces front and rear directions of the body of the motorcycle.

摘要翻译： 用于摩托车的防滑制动装置包括单个泵单元，其用于对摩托车的前轮和后轮的制动机构进行再加压，并且几乎安装在摩托车的车身框架的中心部分和前轮的主缸中。 将泵单元连接到制动机构的前轮制动管的中部由金属管形成，金属管的两端通过挠性制动软管连接到制动机构，主缸和泵单元，金属管 沿着从摩托车的头管向后延伸的主体框架的一对双侧槽轨的内侧面配置。 泵单元沿着摩托车的纵向方向在其纵向尺寸上延伸，并且制动管口端口部分面向摩托车的主体的前后方向。

公开(公告)号：US5406888A

公开(公告)日：1995-04-18

申请号：US133758

申请日：1993-10-07

申请人： Hiroyuki Sugiyama ,  Toshio Miyamoto ,  Norio Hirose

发明人： Hiroyuki Sugiyama ,  Toshio Miyamoto ,  Norio Hirose

IPC分类号： B41F27/12 ,  B41L29/12 ,  B41L31/00 ,  B41F27/06 ,  B41L29/16

CPC分类号： B41F27/1206 ,  B41L29/12 ,  B41L31/00

摘要： A plate replacing apparatus for a printing press having plate lockup devices for fixing the two ends of a plate located in a gap of the circumferential surface of a plate cylinder and wound around the circumferential surface includes an old plate holding mechanism and a new plate holding mechanism. The old plate holding mechanism receives and holds an old plate removed upon release of the plate lockup devices and pivotal movement of the plate cylinder. The new plate holding mechanism removes the old plate and feeds a new plate to the plate cylinder.

摘要翻译： 一种用于印刷机的板更换装置，具有用于固定位于印版滚筒的圆周表面的间隙中的板的两端并卷绕在周面上的板锁定装置，包括：旧板保持机构和新的板保持机构 。 旧的板保持机构在释放板锁定装置和印版滚筒的枢转运动时接收并保持旧板。 新的板保持机构移除旧板并将新的板馈送到印版滚筒。