公开(公告)号：US08357598B2

公开(公告)日：2013-01-22

申请号：US13196133

申请日：2011-08-02

申请人： Tomoyuki Aoki ,  Daiki Yamada

发明人： Tomoyuki Aoki ,  Daiki Yamada

IPC分类号： H01L21/20 ,  H01L21/36

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76826 ,  H01L21/76856 ,  H01L23/5227 ,  H01L24/83 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/13 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2223/6677 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/01012 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2225 ,  H05K1/095 ,  H05K3/02 ,  H01L2224/29075 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention provides an antenna with low resistance and a semiconductor device having an antenna whose communication distance is improved. A fluid containing conductive particles is applied over an object. After curing the fluid containing the conductive particles, the fluid is irradiated with a laser to form an antenna. As a method for applying the fluid containing the conductive particles, screen printing, spin coating, dipping, or a droplet discharging method is used. Further, a solid laser having a wavelength of 1 nm or more and 380 nm or less is used as the laser.

摘要翻译： 本发明提供一种具有低电阻的天线和具有提高通信距离的天线的半导体器件。 含有导电颗粒的流体被施加在物体上。 在固化含有导电颗粒的流体之后，用激光照射流体以形成天线。 作为施加含有导电性粒子的流体的方法，使用丝网印刷，旋涂，浸渍或液滴喷射法。 此外，使用波长为1nm以上且380nm以下的固体激光器作为激光。

公开(公告)号：US07651932B2

公开(公告)日：2010-01-26

申请号：US11433546

申请日：2006-05-15

申请人： Tomoyuki Aoki ,  Daiki Yamada

发明人： Tomoyuki Aoki ,  Daiki Yamada

IPC分类号： H01L21/20 ,  H01L21/36

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76826 ,  H01L21/76856 ,  H01L23/5227 ,  H01L24/83 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/13 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2223/6677 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/01012 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2225 ,  H05K1/095 ,  H05K3/02 ,  H01L2224/29075 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention provides an antenna with low resistance and a semiconductor device having an antenna whose communication distance is improved. A fluid containing conductive particles is applied over an object. After curing the fluid containing the conductive particles, the fluid is irradiated with a laser to form an antenna. As a method for applying the fluid containing the conductive particles, screen printing, spin coating, dipping, or a droplet discharging method is used. Further, a solid laser having a wavelength of 1 nm or more and 380 nm or less is used as the laser.

摘要翻译： 本发明提供一种具有低电阻的天线和具有提高通信距离的天线的半导体器件。 含有导电颗粒的流体被施加在物体上。 在固化含有导电颗粒的流体之后，用激光照射流体以形成天线。 作为施加含有导电性粒子的流体的方法，使用丝网印刷，旋涂，浸渍或液滴喷射法。 此外，使用波长为1nm以上且380nm以下的固体激光器作为激光。

公开(公告)号：US07713836B2

公开(公告)日：2010-05-11

申请号：US11902799

申请日：2007-09-25

申请人： Tomoyuki Aoki ,  Takuya Tsurume ,  Daiki Yamada

发明人： Tomoyuki Aoki ,  Takuya Tsurume ,  Daiki Yamada

IPC分类号： H01L21/30

CPC分类号： H05K3/207 ,  H01L24/97 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/0239 ,  H05K2203/016 ,  H05K2203/0531 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A separation layer is formed over a substrate having a depressed portion, using a silane coupling agent; a conductive layer and an insulating layer that covers the conductive layer are formed in the depressed portion over the separation layer; and a sticky member is attached to the insulating layer, then the conductive layer and the insulating layer are separated from the substrate. Alternatively, after these steps, a flexible substrate is attached to the conductive layer and the insulating layer.

摘要翻译： 使用硅烷偶联剂在具有凹陷部的基板上形成分离层; 覆盖导电层的导电层和绝缘层形成在分离层上的凹陷部分中; 并且将粘性构件附接到绝缘层，然后将导电层和绝缘层与基板分离。 或者，在这些步骤之后，将柔性基板附着到导电层和绝缘层。

公开(公告)号：US20070252181A1

公开(公告)日：2007-11-01

申请号：US11790481

申请日：2007-04-25

申请人： Daiki Yamada ,  Tomoyuki Aoki

发明人： Daiki Yamada ,  Tomoyuki Aoki

IPC分类号： H01L29/76

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0106 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： In order to connect a semiconductor device including an integrated circuit to an external circuit typified by an antenna, the shape of the contact electrode to be formed in the semiconductor device is devised, so that bad connection between the external circuit and the contact electrode is not easily caused and the contact electrode with high reliability is provided. The contact electrode is formed by a screen printing method using a squeegee having a chamfered corner or having a wedge shape. The contact electrode has a peripheral portion and a central portion. The peripheral portion has a tapered portion with its film thickness gradually decreasing from the central portion toward the end portion, and the central portion has a projection portion that continues from the tapered portion.

摘要翻译： 为了将包括集成电路的半导体装置连接到以天线为代表的外部电路，设计形成在半导体装置中的接触电极的形状，使得外部电路与接触电极之间的连接不良 容易引起，并且提供了高可靠性的接触电极。 接触电极通过使用具有倒角或具有楔形的刮板的丝网印刷法形成。 接触电极具有周边部分和中心部分。 周边部分具有其中心部分朝向端部逐渐减小的锥形部分，并且中心部分具有从锥形部分延伸的突出部分。

公开(公告)号：US08999818B2

公开(公告)日：2015-04-07

申请号：US12342153

申请日：2008-12-23

申请人： Hidekazu Takahashi ,  Daiki Yamada ,  Yohei Monma ,  Hiroki Adachi ,  Shunpei Yamazaki

发明人： Hidekazu Takahashi ,  Daiki Yamada ,  Yohei Monma ,  Hiroki Adachi ,  Shunpei Yamazaki

IPC分类号： H01L21/00 ,  H01L27/146 ,  H01L27/12

CPC分类号： H01L27/1214 ,  H01L27/12 ,  H01L27/14687 ,  H01L27/14692

摘要： A semiconductor element is formed on a first surface of the substrate. A resin layer is formed over a second surface of the substrate which is opposite to the first surface of the substrate and on a part of the side surface of the substrate. A step is formed on the side surface of the substrate. The width of the upper section of the substrate with a step is narrower than the lower section of the substrate with a step. Therefore, the substrate can also be a protrusion.

摘要翻译： 半导体元件形成在基板的第一表面上。 在基板的与基板的第一表面相对的第二表面上和基板的侧表面的一部分上形成树脂层。 在基板的侧面上形成台阶。 具有台阶的基板的上部的宽度比基板的下部的台阶窄。 因此，基板也可以是突起。

公开(公告)号：US08324079B2

公开(公告)日：2012-12-04

申请号：US12355069

申请日：2009-01-16

申请人： Hidekazu Takahashi ,  Daiki Yamada ,  Yohei Monma ,  Hiroki Adachi ,  Shunpei Yamazaki

发明人： Hidekazu Takahashi ,  Daiki Yamada ,  Yohei Monma ,  Hiroki Adachi ,  Shunpei Yamazaki

IPC分类号： H01L21/46

CPC分类号： H01L31/0232 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/1277 ,  H01L27/1462 ,  H01L31/02162 ,  H01L2224/11

摘要： A semiconductor device in which the damage such as cracks, chinks, or dents caused by external stress is reduced is provided. In addition, the yield of a semiconductor device having a small thickness is increased. The semiconductor device includes a light-transmitting substrate having a stepped side surface, the width of which in a portion above the step and closer to one surface is smaller than that in a portion below the step, a semiconductor element layer provided over the other surface of the light-transmitting substrate, and a stack of a first light-transmitting resin layer and a second light-transmitting resin layer, which covers the one surface and part of the side surface of the light-transmitting substrate. One of the first light-transmitting resin layer and the second light-transmitting resin layer has a chromatic color.

摘要翻译： 提供了其中由外部应力引起的诸如裂纹，凹陷或凹痕的损伤减小的半导体器件。 此外，具有小厚度的半导体器件的产量增加。 半导体器件包括具有台阶侧表面的透光衬底，其宽度在台阶之上的部分中并且更接近一个表面的透光衬底小于在该阶梯下方的部分的透光衬底;设置在另一表面上的半导体元件层 以及覆盖透光性基板的一侧面和一部分的第一透光性树脂层和第二透光性树脂层的层叠体。 第一透光树脂层和第二透光树脂层中的一个具有彩色。

公开(公告)号：US08049292B2

公开(公告)日：2011-11-01

申请号：US12404376

申请日：2009-03-16

申请人： Hidekazu Takahashi ,  Daiki Yamada ,  Yohei Monma ,  Takahiro Iguchi ,  Hiroki Adachi ,  Shunpei Yamazaki

发明人： Hidekazu Takahashi ,  Daiki Yamada ,  Yohei Monma ,  Takahiro Iguchi ,  Hiroki Adachi ,  Shunpei Yamazaki

IPC分类号： H01L31/048

CPC分类号： H01L27/14625 ,  H01L27/14806 ,  H01L31/075

摘要： A semiconductor device includes a plurality of semiconductor integrated circuits bonded to a structure body in which a fibrous body is impregnated with an organic resin. The plurality of semiconductor integrated circuits are provided at openings formed in the structure body and each include a photoelectric conversion element, a light-transmitting substrate which has stepped sides and in which the width of the projected section on a first surface side is smaller than that of a second surface, a semiconductor integrated circuit portion provided on the second surface of the light-transmitting substrate, and a chromatic color light-transmitting resin layer which covers the first surface and part of side surfaces of the light-transmitting substrate. The plurality of semiconductor integrated circuits include the chromatic color light-transmitting resin layers of different colors.

摘要翻译： 半导体器件包括多个半导体集成电路，该多个半导体集成电路与结构体结合，纤维体浸渍有机树脂。 多个半导体集成电路设置在形成在结构体中的开口处，并且各自包括光电转换元件，具有阶梯侧的透光基板，第一表面侧的突出部的宽度小于 设置在透光基板的第二表面上的半导体集成电路部分和覆盖透光基板的第一表面和侧表面的彩色透光树脂层。 多个半导体集成电路包括不同颜色的彩色透光树脂层。

公开(公告)号：US07824950B2

公开(公告)日：2010-11-02

申请号：US12078196

申请日：2008-03-27

申请人： Yohei Monma ,  Daiki Yamada ,  Hidekazu Takahashi ,  Yuusuke Sugawara ,  Kazuo Nishi

发明人： Yohei Monma ,  Daiki Yamada ,  Hidekazu Takahashi ,  Yuusuke Sugawara ,  Kazuo Nishi

IPC分类号： H01L21/00

CPC分类号： H01L27/14683 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/13 ,  H01L2924/07811 ,  H01L2924/00

摘要： In fabrication of a semiconductor device mounted on a wiring board, a semiconductor circuit portion is formed over a glass substrate. Then, an interposer having connection terminals are bonded to the semiconductor circuit portion. After that, the glass substrate is peeled off from the semiconductor circuit portion, and a mold resin is poured to cover the periphery of the semiconductor circuit portion from a direction of the separation plane. Then, the mold resin is heated under predetermined conditions to be hardened.

摘要翻译： 在安装在布线板上的半导体装置的制造中，在玻璃基板上形成半导体电路部。 然后，具有连接端子的插入件被接​​合到半导体电路部分。 之后，从半导体电路部分剥离玻璃基板，并且从分离面的方向注入模塑树脂以覆盖半导体电路部分的周边。 然后，将模塑树脂在预定条件下加热以硬化。

公开(公告)号：US07994030B2

公开(公告)日：2011-08-09

申请号：US12645511

申请日：2009-12-23

申请人： Tomoyuki Aoki ,  Daiki Yamada

发明人： Tomoyuki Aoki ,  Daiki Yamada

IPC分类号： H01L21/20 ,  H01L21/36

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76826 ,  H01L21/76856 ,  H01L23/5227 ,  H01L24/83 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/13 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2223/6677 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/01012 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2225 ,  H05K1/095 ,  H05K3/02 ,  H01L2224/29075 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention provides an antenna with low resistance and a semiconductor device having an antenna whose communication distance is improved. A fluid containing conductive particles is applied over an object. After curing the fluid containing the conductive particles, the fluid is irradiated with a laser to form an antenna. As a method for applying the fluid containing the conductive particles, screen printing, spin coating, dipping, or a droplet discharging method is used. Further, a solid laser having a wavelength of 1 nm or more and 380 nm or less is used as the laser.

摘要翻译： 本发明提供一种具有低电阻的天线和具有提高通信距离的天线的半导体器件。 含有导电颗粒的流体被施加在物体上。 在固化含有导电颗粒的流体之后，用激光照射流体以形成天线。 作为施加含有导电性粒子的流体的方法，使用丝网印刷，旋涂，浸渍或液滴喷射法。 此外，使用波长为1nm以上且380nm以下的固体激光器作为激光。

公开(公告)号：US20060270175A1

公开(公告)日：2006-11-30

申请号：US11433546

申请日：2006-05-15

申请人： Tomoyuki Aoki ,  Daiki Yamada

发明人： Tomoyuki Aoki ,  Daiki Yamada

IPC分类号： H01L21/20

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76826 ,  H01L21/76856 ,  H01L23/5227 ,  H01L24/83 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/13 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2223/6677 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/01012 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2225 ,  H05K1/095 ,  H05K3/02 ,  H01L2224/29075 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention provides an antenna with low resistance and a semiconductor device having an antenna whose communication distance is improved. A fluid containing conductive particles is applied over an object. After curing the fluid containing the conductive particles, the fluid is irradiated with a laser to form an antenna. As a method for applying the fluid containing the conductive particles, screen printing, spin coating, dipping, or a droplet discharging method is used. Further, a solid laser having a wavelength of 1 nm or more and 380 nm or less is used as the laser.