公开(公告)号：US20120263949A1

公开(公告)日：2012-10-18

申请号：US13445548

申请日：2012-04-12

Applicant: Scott W. Wollack ,  Thomas H. Malpass

Inventor： Scott W. Wollack ,  Thomas H. Malpass

IPC: C09J7/02 ,  B32B15/06 ,  B32B27/28 ,  B32B7/12 ,  B32B27/32

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B7/04 ,  B32B7/12 ,  B32B27/12 ,  B32B2262/0269 ,  B32B2307/558 ,  B32B2571/02 ,  C09J7/10 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2205/306 ,  C09J2400/22 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2883 ,  Y10T428/2887 ,  Y10T428/2891 ,  Y10T428/31678

Abstract: The present disclosure relates to a thermoplastic film containing an adhesive layer which is heat activated and adhered to metal sheeting and another layer which is heat activated and adhered to rubber.

Abstract translation: 本发明涉及一种热塑性薄膜，其包含热活化并粘附到金属薄片上的粘合剂层，以及热活化并粘附到橡胶上的另一层。

公开(公告)号：US20120052269A1

公开(公告)日：2012-03-01

申请号：US13240118

申请日：2011-09-22

Applicant: Takashi Hirano ,  Akitsugu Sakaki ,  Naoya Oda

Inventor： Takashi Hirano ,  Akitsugu Sakaki ,  Naoya Oda

IPC: B32B7/10 ,  B32B38/10

CPC classification number: C09J9/02 ,  C09J7/38 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T428/24942 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A film for use in manufacturing semiconductor devices of the present invention includes a bonding layer having a first surface and a second surface, a first adhesive layer bonding to the second surface of the bonding layer and a second adhesive layer bonding to the first adhesive layer at a side opposite to the bonding layer wherein the second adhesive layer has an outer peripheral portion extending beyond an outer peripheral edge of the first adhesive layer. Further, the film is used in dicing a semiconductor wafer in a state that the semiconductor wafer is bonded to the first surface of the bonding layer while a wafer ring is bonded to the outer peripheral portion of the second adhesive layer wherein the bonding force A1 (cN/25 mm) of the first adhesive layer to the bonding layer is smaller than the bonding force A2 (cN/25 mm) of the second adhesive layer to the wafer ring.

Abstract translation: 用于制造本发明的半导体器件的薄膜包括：具有第一表面和第二表面的接合层，接合到接合层的第二表面的第一粘合剂层和与第一粘合剂层接合的第二粘合剂层 与所述接合层相对的一侧，其中所述第二粘合剂层具有延伸超过所述第一粘合剂层的外周边缘的外周部分。 此外，在半导体晶片接合到接合层的第一表面的状态下，将薄膜用于切割半导体晶片，同时将晶片环接合到第二粘合层的外周部分，其中结合力A1（ cN / 25mm）小于第二粘合剂层与晶片环的接合力A2（cN / 25mm）。

公开(公告)号：US08071212B2

公开(公告)日：2011-12-06

申请号：US11630968

申请日：2005-02-22

Applicant: Junichi Kato ,  Minoru Nakahara ,  Shinichi Hashimoto ,  Masanori Maruno ,  Katsumi Horikawa

Inventor： Junichi Kato ,  Minoru Nakahara ,  Shinichi Hashimoto ,  Masanori Maruno ,  Katsumi Horikawa

IPC: B32B7/12

CPC classification number: H05K9/0096 ,  B32B37/24 ,  B32B2037/246 ,  B32B2038/0092 ,  B32B2307/304 ,  B32B2307/418 ,  B32B2307/714 ,  B32B2307/7145 ,  C08K5/0075 ,  C08K5/01 ,  C08K5/29 ,  C08L2666/02 ,  C09J7/29 ,  C09J7/387 ,  C09J151/006 ,  C09J153/02 ,  C09J153/025 ,  C09J2201/36 ,  C09J2400/163 ,  C09J2453/00 ,  G02F2201/50 ,  Y10T428/14 ,  Y10T428/28 ,  Y10T428/2848

Abstract: A self-adhesive film comprises a substrate layer and an adhesive layer on the substrate layer, which comprises a carboxylic acid-modified thermoplastic elastomer, a carboxylic acid-unmodified thermoplastic elastomer, a crosslinking agent and a plasticizer. A self-adhesive functional film comprises a substrate layer, an adhesive layer formed on one side of the substrate layer, and a functional layer on the other side of the substrate layer which has at least one of antireflective, electromagnetic wave blocking, heat ray cutting off, antistatic, anticlauding, antibacterial, deodorizing easy-adhering, antifouling functions and hard coat layer.

Abstract translation: 自粘膜包括基材层和基材层上的粘合剂层，其包含羧酸改性的热塑性弹性体，羧酸未改性的热塑性弹性体，交联剂和增塑剂。 自粘性功能膜包括基材层，形成在基材层一侧的粘合剂层和基材层另一侧的功能层，其具有抗反射，电磁波阻挡，热射线切割中的至少一种 抗静电，抗冲击，抗菌，除臭易粘附，防污功能和硬涂层。

公开(公告)号：US20110287240A1

公开(公告)日：2011-11-24

申请号：US13073080

申请日：2011-03-28

Applicant: Shinsuke IKISHIMA ,  Naoto HAYASHI ,  Kooki OOYAMA ,  Keiji HAYASHI ,  Shou UCHIDA ,  Kouhei TAKEDA ,  Ryohei SAWAZAKI

Inventor： Shinsuke IKISHIMA ,  Naoto HAYASHI ,  Kooki OOYAMA ,  Keiji HAYASHI ,  Shou UCHIDA ,  Kouhei TAKEDA ,  Ryohei SAWAZAKI

IPC: C09J7/02 ,  B32B7/02 ,  B29C47/06

CPC classification number: B32B7/12 ,  B32B7/02 ,  B32B27/08 ,  B32B27/16 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B2274/00 ,  B32B2307/732 ,  B32B2405/00 ,  C09J7/381 ,  C09J2201/36 ,  C09J2453/00 ,  Y10T428/24967 ,  Y10T428/269

Abstract: Provided is a novel pressure-sensitive adhesive tape having a moderately weak adhesion during a time period from a production process (during its production) to the time of the accomplishment of the product as a result of the completion of the production (immediately after the production). Accordingly, the peeling failure, or the like, resulting from strong adherence of a pressure-sensitive adhesive layer to a roll or the like at the time of the production can be sufficiently suppressed. As a result, stable product supply can be performed. In addition, even after the lapse of about a half day from immediately after the production, the pressure-sensitive adhesive tape can be easily rewound. On the other hand, the pressure-sensitive adhesive tape can express a sufficiently strong adhesion for an adherend after the lapse of a predetermined time from the production (e.g., at the time of its use). The pressure-sensitive adhesive tape of the present invention includes at least three layers including: a base material layer (A); a first pressure-sensitive adhesive layer (B1); and a second pressure-sensitive adhesive layer (B2) in the stated order, in which: the base material layer (A) contains a thermoplastic resin; the first pressure-sensitive adhesive layer (B1) contains a tackifier at a content of 12 wt % or more; the second pressure-sensitive adhesive layer (B2) contains a tackifier at a content of 10 wt % or less; and the second pressure-sensitive adhesive layer (B2) has a thickness of 10 μm or more.

Abstract translation: 提供了一种新的压敏粘合带，其在生产过程（在其生产中）到生产完成（紧随生产之后）完成产品的时间段内具有适度弱的粘合性 ）。 因此，可以充分地抑制在制造时粘合剂层对辊等的强粘附而产生的剥离破坏等。 因此，可以实现稳定的产品供应。 此外，即使在生产后立即经过约半天之后，也可以容易地卷绕压敏粘合带。 另一方面，压敏粘合带在从生产（例如在使用时）经过预定时间之后，可以对被粘物表现出足够强的粘合性。 本发明的压敏粘合带包括至少三层，包括：基材层（A）; 第一压敏粘合剂层（B1）; 和第二压敏粘合剂层（B2），其中：基材层（A）含有热塑性树脂; 第一粘合剂层（B1）含有12重量％以上的增粘剂， 第二压敏粘合剂层（B2）含有10重量％以下的增粘剂， 第二粘合剂层（B2）的厚度为10μm以上。

公开(公告)号：US08012581B2

公开(公告)日：2011-09-06

申请号：US11004448

申请日：2004-12-03

Applicant: Marc Husemann ,  Stephan Zollner

Inventor： Marc Husemann ,  Stephan Zollner

IPC: B32B15/04 ,  B32B27/08 ,  B32B5/00 ,  B05D3/02

CPC classification number: C09J133/04 ,  C09J7/10 ,  C09J7/385 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2433/00 ,  Y10T428/2891 ,  Y10T428/3192 ,  Y10T428/31928

Abstract: The invention relates to a bilayer pressure-sensitive adhesive. Provision is made for the bilayer pressure-sensitive adhesive to comprise an apolar layer and a polar layer, the apolar layer and the polar layer each comprising a polyacrylate pressure-sensitive adhesive having a static glass transition temperature of not more than +15° C., and the surface energy of the apolar layer differing from the surface energy of the polar layer by at least 5 mN/m.

Abstract translation: 本发明涉及双层压敏粘合剂。 双面压敏粘合剂包括非极性层和极性层，非极性层和极性层各自包含静态玻璃化转变温度不超过+ 15℃的聚丙烯酸酯压敏粘合剂。 ，并且非极性层的表面能不同于极性层的表面能至少5mN / m。

公开(公告)号：US07985474B2

公开(公告)日：2011-07-26

申请号：US11892905

申请日：2007-08-28

Applicant: Akira Yabuki ,  Syozo Yano

Inventor： Akira Yabuki ,  Syozo Yano

IPC: B32B7/12

CPC classification number: H01L21/67132 ,  C09J4/00 ,  C09J7/22 ,  C09J7/38 ,  C09J7/385 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68322 ,  H01L2221/68327 ,  Y10T428/28 ,  Y10T428/2891

Abstract: A wafer-dicing adhesive tape, containing two or more removable adhesive layers, on a base film, that have resin compositions containing a radiation-polymerizable compound, in which a content of the radiation-polymerizable compound in the resin composition constituting an outermost removable adhesive layer is different from that of an inner removable adhesive layer and a stress applied to the base film is sufficiently introduced to the outermost removable adhesive layer irradiated with radiation, so that said layer can be easily peeled off from chips cut; and a method of producing chips using the same.

Abstract translation: 一种在基膜上含有两个或多个可移除粘合剂层的晶片切割粘合带，其具有含有可辐射聚合化合物的树脂组合物，其中构成最外层可去除粘合剂的树脂组合物中的可辐射聚合化合物的含量 层与内部可除去的粘合剂层不同，并且施加到基膜的应力被充分地引入到用辐射照射的最外层可去除的粘合剂层中，使得所述层可以容易地从切割的切屑剥离; 以及使用其制造芯片的方法。

公开(公告)号：US20110147952A1

公开(公告)日：2011-06-23

申请号：US12983821

申请日：2011-01-03

Applicant: Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

Inventor： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

IPC: H01L23/52 ,  H01L21/50

CPC classification number: H01L21/6836 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/3512

Abstract: The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a substrate material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein the adhesion of the pressure-sensitive adhesive layer (2) to the die-bonding adhesive layer (3), as determined under the conditions of a peel angle of 15° and a peel point moving rate of 2.5 mm/sec. at 23° C., is different between a region (2a) corresponding to a work attachment region (3a) and a region (2b) corresponding to a part or the whole of the other region (3b), in the die-bonding adhesive layer (3), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer (2a)

Abstract translation: 本发明涉及一种在基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割芯片接合膜，其中 在剥离角度为15°，剥离移动速度为2.5mm / sec的条件下测定粘合剂层（2）与芯片粘接层（3）的粘合性。 在相对于工件附着区域（3a）的区域（2a）和与其他区域（3b）的一部分或全部对应的区域（2b）在23℃下不同，在芯片接合粘合剂 层（3），并且满足以下关系：粘合剂层（2a）的粘合性<粘合剂层（2b）的粘合性和粘合剂层（2a）对粘合剂层 芯片粘合层（3）不高于2.3N / 25mm。

公开(公告)号：US07960023B2

公开(公告)日：2011-06-14

申请号：US11950470

申请日：2007-12-05

Applicant: Chang-Hoon Sim ,  Ki-Jeong Moon ,  Hae-Sang Jun ,  Jun-Ho Lee ,  Yun-Min Park

Inventor： Chang-Hoon Sim ,  Ki-Jeong Moon ,  Hae-Sang Jun ,  Jun-Ho Lee ,  Yun-Min Park

IPC: B32B7/12 ,  B32B7/00

CPC classification number: H01L24/83 ,  C09J7/10 ,  C09J2201/36 ,  C09J2461/00 ,  C09J2463/00 ,  H01L25/0657 ,  H01L2224/26135 ,  H01L2224/29083 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01012 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/351 ,  Y10T428/24975 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00

Abstract: There is provided an adhesive film for stacking semiconductor layers of chips comprising: a first adhesive layer comprising phenoxy resin, epoxy resin and phenol resin; a second adhesive layer comprising phenoxy resin and an ultraviolet ray curable compound; and a third adhesive layer comprising phenoxy resin, epoxy resin and phenol resin, wherein the second adhesive layer is disposed between the first adhesive layer and the third adhesive layer.

Abstract translation: 提供了一种用于堆叠芯片的半导体层的粘合膜，包括：包含苯氧基树脂，环氧树脂和酚醛树脂的第一粘合剂层; 第二粘合剂层，其包含苯氧基树脂和紫外线固化性化合物; 以及包含苯氧基树脂，环氧树脂和酚醛树脂的第三粘合剂层，其中所述第二粘合剂层设置在所述第一粘合剂层和所述第三粘合剂层之间。

公开(公告)号：US20110104873A1

公开(公告)日：2011-05-05

申请号：US12863063

申请日：2008-12-16

Applicant: Katsuhiko Kamiya ,  Takeshi Matsumura ,  Shuuhei Murata ,  Hironao Ootake

Inventor： Katsuhiko Kamiya ,  Takeshi Matsumura ,  Shuuhei Murata ,  Hironao Ootake

IPC: H01L21/30 ,  B32B33/00 ,  B32B38/00

CPC classification number: C09J163/00 ,  C08F8/30 ,  C08F2220/1858 ,  C09J7/22 ,  C09J7/30 ,  C09J133/066 ,  C09J133/08 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/2809 ,  C08F2220/281 ,  C08F220/18 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.

Abstract translation: 提供一种切割芯片接合膜，其在切割时半导体晶片的保持和拾取时的剥离性之间的平衡优异。 公开了一种切片芯片接合膜，其包括在基材上具有压敏粘合剂层的切割膜和形成在压敏粘合剂层上的芯片接合膜，其中该压敏粘合剂层含有包含 作为主要单体的丙烯酸酯，基于丙烯酸酯的含有羟基的单体为10〜40摩尔％，基于丙烯酸酯的具有自由基反应性碳 - 碳双键的异氰酸酯化合物为70〜90摩尔％ 含有羟基的单体，并且在成膜后在规定条件下用紫外线照射固化，其中，芯片接合膜含有环氧树脂，并且还粘合在压敏粘合剂层上 用紫外线照射。

公开(公告)号：US20110008597A1

公开(公告)日：2011-01-13

申请号：US12834541

申请日：2010-07-12

Applicant: Fumiteru ASAI ,  Takatoshi SASAKI ,  Noriyoshi KAWASHIMA

Inventor： Fumiteru ASAI ,  Takatoshi SASAKI ,  Noriyoshi KAWASHIMA

IPC: C09J7/02 ,  B32B7/02

CPC classification number: H01L21/6836 ,  C09J7/20 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/6835 ,  H01L2221/68327 ,  Y10T428/2495 ,  Y10T428/26 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2891

Abstract: A surface protective sheet comprises an adhesive layer having a plurality of layers on one side of a base film, the adhesive layer having a 25° C. storage elastic modulus of 10 to 100 MPa, and an adhesive strength with respect to a silicon mirror wafer of 1.0 N/20 mm or less at peeling off the surface protective sheet. The surface protective sheet is used for a semiconductor wafer having a protruding electrode of 10 to 150 μm height on its surface.

Abstract translation: 表面保护片包括在基膜的一侧具有多层的粘合剂层，所述粘合层具有10℃至100MPa的25℃的储能弹性模量和相对于硅镜晶片的粘合强度 在剥离表面保护片时为1.0N / 20mm以下。 表面保护片用于其表面上具有10至150μm高的突出电极的半导体晶片。