Abstract:
The present disclosure relates to a thermoplastic film containing an adhesive layer which is heat activated and adhered to metal sheeting and another layer which is heat activated and adhered to rubber.
Abstract:
A film for use in manufacturing semiconductor devices of the present invention includes a bonding layer having a first surface and a second surface, a first adhesive layer bonding to the second surface of the bonding layer and a second adhesive layer bonding to the first adhesive layer at a side opposite to the bonding layer wherein the second adhesive layer has an outer peripheral portion extending beyond an outer peripheral edge of the first adhesive layer. Further, the film is used in dicing a semiconductor wafer in a state that the semiconductor wafer is bonded to the first surface of the bonding layer while a wafer ring is bonded to the outer peripheral portion of the second adhesive layer wherein the bonding force A1 (cN/25 mm) of the first adhesive layer to the bonding layer is smaller than the bonding force A2 (cN/25 mm) of the second adhesive layer to the wafer ring.
Abstract:
A self-adhesive film comprises a substrate layer and an adhesive layer on the substrate layer, which comprises a carboxylic acid-modified thermoplastic elastomer, a carboxylic acid-unmodified thermoplastic elastomer, a crosslinking agent and a plasticizer. A self-adhesive functional film comprises a substrate layer, an adhesive layer formed on one side of the substrate layer, and a functional layer on the other side of the substrate layer which has at least one of antireflective, electromagnetic wave blocking, heat ray cutting off, antistatic, anticlauding, antibacterial, deodorizing easy-adhering, antifouling functions and hard coat layer.
Abstract:
Provided is a novel pressure-sensitive adhesive tape having a moderately weak adhesion during a time period from a production process (during its production) to the time of the accomplishment of the product as a result of the completion of the production (immediately after the production). Accordingly, the peeling failure, or the like, resulting from strong adherence of a pressure-sensitive adhesive layer to a roll or the like at the time of the production can be sufficiently suppressed. As a result, stable product supply can be performed. In addition, even after the lapse of about a half day from immediately after the production, the pressure-sensitive adhesive tape can be easily rewound. On the other hand, the pressure-sensitive adhesive tape can express a sufficiently strong adhesion for an adherend after the lapse of a predetermined time from the production (e.g., at the time of its use). The pressure-sensitive adhesive tape of the present invention includes at least three layers including: a base material layer (A); a first pressure-sensitive adhesive layer (B1); and a second pressure-sensitive adhesive layer (B2) in the stated order, in which: the base material layer (A) contains a thermoplastic resin; the first pressure-sensitive adhesive layer (B1) contains a tackifier at a content of 12 wt % or more; the second pressure-sensitive adhesive layer (B2) contains a tackifier at a content of 10 wt % or less; and the second pressure-sensitive adhesive layer (B2) has a thickness of 10 μm or more.
Abstract:
The invention relates to a bilayer pressure-sensitive adhesive. Provision is made for the bilayer pressure-sensitive adhesive to comprise an apolar layer and a polar layer, the apolar layer and the polar layer each comprising a polyacrylate pressure-sensitive adhesive having a static glass transition temperature of not more than +15° C., and the surface energy of the apolar layer differing from the surface energy of the polar layer by at least 5 mN/m.
Abstract:
A wafer-dicing adhesive tape, containing two or more removable adhesive layers, on a base film, that have resin compositions containing a radiation-polymerizable compound, in which a content of the radiation-polymerizable compound in the resin composition constituting an outermost removable adhesive layer is different from that of an inner removable adhesive layer and a stress applied to the base film is sufficiently introduced to the outermost removable adhesive layer irradiated with radiation, so that said layer can be easily peeled off from chips cut; and a method of producing chips using the same.
Abstract:
The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a substrate material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein the adhesion of the pressure-sensitive adhesive layer (2) to the die-bonding adhesive layer (3), as determined under the conditions of a peel angle of 15° and a peel point moving rate of 2.5 mm/sec. at 23° C., is different between a region (2a) corresponding to a work attachment region (3a) and a region (2b) corresponding to a part or the whole of the other region (3b), in the die-bonding adhesive layer (3), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer (2a)
Abstract:
There is provided an adhesive film for stacking semiconductor layers of chips comprising: a first adhesive layer comprising phenoxy resin, epoxy resin and phenol resin; a second adhesive layer comprising phenoxy resin and an ultraviolet ray curable compound; and a third adhesive layer comprising phenoxy resin, epoxy resin and phenol resin, wherein the second adhesive layer is disposed between the first adhesive layer and the third adhesive layer.
Abstract:
Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.
Abstract:
A surface protective sheet comprises an adhesive layer having a plurality of layers on one side of a base film, the adhesive layer having a 25° C. storage elastic modulus of 10 to 100 MPa, and an adhesive strength with respect to a silicon mirror wafer of 1.0 N/20 mm or less at peeling off the surface protective sheet. The surface protective sheet is used for a semiconductor wafer having a protruding electrode of 10 to 150 μm height on its surface.