PRESSURE-SENSITIVE ADHESIVE TAPE
    54.
    发明申请
    PRESSURE-SENSITIVE ADHESIVE TAPE 审中-公开
    压敏胶带

    公开(公告)号:US20110287240A1

    公开(公告)日:2011-11-24

    申请号:US13073080

    申请日:2011-03-28

    Abstract: Provided is a novel pressure-sensitive adhesive tape having a moderately weak adhesion during a time period from a production process (during its production) to the time of the accomplishment of the product as a result of the completion of the production (immediately after the production). Accordingly, the peeling failure, or the like, resulting from strong adherence of a pressure-sensitive adhesive layer to a roll or the like at the time of the production can be sufficiently suppressed. As a result, stable product supply can be performed. In addition, even after the lapse of about a half day from immediately after the production, the pressure-sensitive adhesive tape can be easily rewound. On the other hand, the pressure-sensitive adhesive tape can express a sufficiently strong adhesion for an adherend after the lapse of a predetermined time from the production (e.g., at the time of its use). The pressure-sensitive adhesive tape of the present invention includes at least three layers including: a base material layer (A); a first pressure-sensitive adhesive layer (B1); and a second pressure-sensitive adhesive layer (B2) in the stated order, in which: the base material layer (A) contains a thermoplastic resin; the first pressure-sensitive adhesive layer (B1) contains a tackifier at a content of 12 wt % or more; the second pressure-sensitive adhesive layer (B2) contains a tackifier at a content of 10 wt % or less; and the second pressure-sensitive adhesive layer (B2) has a thickness of 10 μm or more.

    Abstract translation: 提供了一种新的压敏粘合带,其在生产过程(在其生产中)到生产完成(紧随生产之后)完成产品的时间段内具有适度弱的粘合性 )。 因此,可以充分地抑制在制造时粘合剂层对辊等的强粘附而产生的剥离破坏等。 因此,可以实现稳定的产品供应。 此外,即使在生产后立即经过约半天之后,也可以容易地卷绕压敏粘合带。 另一方面,压敏粘合带在从生产(例如在使用时)经过预定时间之后,可以对被粘物表现出足够强的粘合性。 本发明的压敏粘合带包括至少三层,包括:基材层(A); 第一压敏粘合剂层(B1); 和第二压敏粘合剂层(B2),其中:基材层(A)含有热塑性树脂; 第一粘合剂层(B1)含有12重量%以上的增粘剂, 第二压敏粘合剂层(B2)含有10重量%以下的增粘剂, 第二粘合剂层(B2)的厚度为10μm以上。

    Bilayer pressure-sensitive adhesives
    55.
    发明授权
    Bilayer pressure-sensitive adhesives 有权
    双层压敏粘合剂

    公开(公告)号:US08012581B2

    公开(公告)日:2011-09-06

    申请号:US11004448

    申请日:2004-12-03

    Abstract: The invention relates to a bilayer pressure-sensitive adhesive. Provision is made for the bilayer pressure-sensitive adhesive to comprise an apolar layer and a polar layer, the apolar layer and the polar layer each comprising a polyacrylate pressure-sensitive adhesive having a static glass transition temperature of not more than +15° C., and the surface energy of the apolar layer differing from the surface energy of the polar layer by at least 5 mN/m.

    Abstract translation: 本发明涉及双层压敏粘合剂。 双面压敏粘合剂包括非极性层和极性层,非极性层和极性层各自包含静态玻璃化转变温度不超过+ 15℃的聚丙烯酸酯压敏粘合剂。 ,并且非极性层的表面能不同于极性层的表面能至少5mN / m。

    Wafer-dicing adhesive tape and method of producing chips using the same
    56.
    发明授权
    Wafer-dicing adhesive tape and method of producing chips using the same 有权
    晶片切割胶带和使用其制造芯片的方法

    公开(公告)号:US07985474B2

    公开(公告)日:2011-07-26

    申请号:US11892905

    申请日:2007-08-28

    Abstract: A wafer-dicing adhesive tape, containing two or more removable adhesive layers, on a base film, that have resin compositions containing a radiation-polymerizable compound, in which a content of the radiation-polymerizable compound in the resin composition constituting an outermost removable adhesive layer is different from that of an inner removable adhesive layer and a stress applied to the base film is sufficiently introduced to the outermost removable adhesive layer irradiated with radiation, so that said layer can be easily peeled off from chips cut; and a method of producing chips using the same.

    Abstract translation: 一种在基膜上含有两个或多个可移除粘合剂层的晶片切割粘合带,其具有含有可辐射聚合化合物的树脂组合物,其中构成最外层可去除粘合剂的树脂组合物中的可辐射聚合化合物的含量 层与内部可除去的粘合剂层不同,并且施加到基膜的应力被充分地引入到用辐射照射的最外层可去除的粘合剂层中,使得所述层可以容易地从切割的切屑剥离; 以及使用其制造芯片的方法。

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