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    Forming LED having angled sides for increased side light extraction
    61.
    发明授权
    Forming LED having angled sides for increased side light extraction 有权
    成型LED具有成角度的侧面，用于增加侧光提取

    公开(公告)号：US06323063B2

    公开(公告)日：2001-11-27

    申请号：US09732459

    申请日：2000-12-06

    Applicant: Michael R Krames ,  Fred A Kish, Jr. ,  Tun S Tan

    Inventor： Michael R Krames ,  Fred A Kish, Jr. ,  Tun S Tan

    IPC: H01L2100

    CPC classification number: H01L33/20 ,  H01L33/02

    Abstract: The invention is a method for designing semiconductor light emitting devices such that the side surfaces (surfaces not parallel to the epitaxial layers) are formed at preferred angles relative to vertical (normal to the plane of the light-emitting active layer) to improve light extraction efficiency and increase total light output efficiency. Device designs are chosen to improve efficiency without resorting to excessive active area-yield loss due to shaping. As such, these designs are suitable for low-cost, high-volume manufacturing of semiconductor light-emitting devices with improved characteristics.

    Abstract translation: 本发明是一种用于设计半导体发光器件的方法，使得侧表面（不平行于外延层的表面）以相对于垂直（垂直于发光有源层的平面）的优选角度形成，以改善光提取 提高总光输出效率。 选择器件设计以提高效率，而不需要由于成形而过度的有效面积产量损失。 因此，这些设计适用于具有改进特性的半导体发光器件的低成本，大批量制造。

    Highly reflective contacts for light emitting semiconductor devices
    63.
    发明授权
    Highly reflective contacts for light emitting semiconductor devices 失效
    用于发光半导体器件的高反射触点

    公开(公告)号：US5917202A

    公开(公告)日：1999-06-29

    申请号：US576251

    申请日：1995-12-21

    Applicant: Roland H. Haitz ,  Fred A. Kish, Jr.

    Inventor： Roland H. Haitz ,  Fred A. Kish, Jr.

    IPC: H01L33/22 ,  H01L33/38 ,  H01L33/40 ,  H01L33/00

    CPC classification number: H01L33/387 ,  H01L33/405 ,  H01L33/22

    Abstract: Light emitting diodes with highly reflective contacts and methods for fabricating them are described. In a first preferred embodiment of the present invention, LEDs with reflective contacts are formed using a laser to create small alloyed dots in a highly reflective metal evaporated on the top and bottom surface of the LED chip. Using this technique, most of the bottom surface remains highly reflective, and only those portions of the bottom surface where the laser struck become absorbing. Typically, only 1% of the bottom surface is formed into contacts, leaving 99% of the bottom surface to serve as a reflecting surface. The 1% of the surface, however, provides an adequate low resistance ohmic contact. LEDs fabricated with this technique allow photons to bounce off the rear surface more than 20 times before there is a 50% chance of absorption. In a second embodiment of the present invention, an application of compound semiconductor wafer bonding techniques permits the fabrication of LEDs with a plurality of these small, micro-alloyed contacts without the use of a laser.

    Abstract translation: 描述了具有高反射触点的发光二极管及其制造方法。 在本发明的第一优选实施例中，使用激光形成具有反射触点的LED，以在LED芯片的顶表面和底表面上蒸发的高反射金属中产生小的合金点。 使用这种技术，大部分底表面保持高反射性，并且仅激光打入的底表面的那些部分变得吸收。 通常，只有底部表面的1％形成接触，使99％的底部表面作为反射表面。 然而，表面的1％提供了足够的低电阻欧姆接触。 用这种技术制造的LED允许光子在背面吸收50％之前从后表面反弹超过20次。 在本发明的第二实施例中，化合物半导体晶片接合技术的应用允许在不使用激光的情况下制造具有多个这些小的微合金触点的LED。

    Banded semiconductor optical amplifier
    67.
    发明授权
    Banded semiconductor optical amplifier 有权
    带状半导体光放大器

    公开(公告)号：US08964284B2

    公开(公告)日：2015-02-24

    申请号：US13449515

    申请日：2012-04-18

    Applicant: Mehrdad Ziari ,  Scott Corzine ,  Masaki Kato ,  Michael Francis Van Leeuwen ,  Radhakrishnan L. Nagarajan ,  Matthew L. Mitchell ,  Fred A. Kish, Jr.

    Inventor： Mehrdad Ziari ,  Scott Corzine ,  Masaki Kato ,  Michael Francis Van Leeuwen ,  Radhakrishnan L. Nagarajan ,  Matthew L. Mitchell ,  Fred A. Kish, Jr.

    IPC: H04S5/00

    CPC classification number: H04B10/2914 ,  H01S5/4087 ,  H01S5/5009 ,  H01S5/5036 ,  H01S5/5045 ,  H04J14/02 ,  H04J14/0221 ,  H04J14/06

    Abstract: A semiconductor optical amplifier module may include a beam splitter to split an optical signal into two polarization optical signals including a first polarization optical signal with a Transverse Magnetic (TM) polarization provided along a first path of two paths, and a second polarization optical signal with a Transverse Electric (TE) polarization provided along a second path of the two paths; a first rotator to rotate the TM polarization of the first polarization optical signal to TE polarization; a first semiconductor optical amplifier to amplify the rotated first polarization optical signal to output a first resultant optical signal; a second semiconductor optical amplifier to amplify the second polarization optical signal; and a second rotator to rotate the polarization of the amplified second polarization optical signal to output a second resultant optical signal; and a beam combiner to combine the first resultant optical signal and the second resultant optical signal.

    Abstract translation: 半导体光放大器模块可以包括光束分离器，以将光信号分成两个偏振光信号，包括具有沿着两条路径的第一路径提供的横向磁（TM）偏振的第一偏振光信号，以及第二偏振光信号， 沿着两个路径的第二路径提供的横向电（TE）极化; 第一旋转器，用于将第一偏振光信号的TM偏振旋转为TE极化; 第一半导体光放大器，用于放大旋转的第一偏振光信号以输出第一合成光信号; 第二半导体光放大器，用于放大第二偏振光信号; 以及第二旋转器，用于旋转放大的第二偏振光信号的偏振，以输出第二合成光信号; 以及光束组合器，以组合第一合成光信号和第二合成光信号。

    COOLERLESS PHOTONIC INTEGRATED CIRCUITS (PICs) FOR WDM TRANSMISSION NETWORKS AND PICs OPERABLE WITH A FLOATING SIGNAL CHANNEL GRID CHANGING WITH TEMPERATURE BUT WITH FIXED CHANNEL SPACING IN THE FLOATING GRID
    70.
    发明申请
    COOLERLESS PHOTONIC INTEGRATED CIRCUITS (PICs) FOR WDM TRANSMISSION NETWORKS AND PICs OPERABLE WITH A FLOATING SIGNAL CHANNEL GRID CHANGING WITH TEMPERATURE BUT WITH FIXED CHANNEL SPACING IN THE FLOATING GRID 审中-公开
    用于WDM传输网络的无线光电集成电路（PIC）可用于浮动信号通道网格变化与温度变化，但在浮动网格中具有固定通道间隔

    公开(公告)号：US20100166424A1

    公开(公告)日：2010-07-01

    申请号：US12612646

    申请日：2009-11-04

    Applicant: Radhakrishnan L. Nagarajan ,  Fred A. Kish, JR. ,  David F. Welch ,  Drew D. Perkins ,  Masaki Kato

    Inventor： Radhakrishnan L. Nagarajan ,  Fred A. Kish, JR. ,  David F. Welch ,  Drew D. Perkins ,  Masaki Kato

    IPC: H01S3/04 ,  H04J14/02 ,  H04B10/04 ,  H01S5/024

    CPC classification number: G02B6/12033 ,  B82Y20/00 ,  G02B6/12019 ,  G02B6/2813 ,  G02B6/293 ,  G02B6/29317 ,  G02B6/29338 ,  G02B6/29352 ,  H01S5/005 ,  H01S5/0085 ,  H01S5/02248 ,  H01S5/024 ,  H01S5/0261 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0683 ,  H01S5/1032 ,  H01S5/12 ,  H01S5/1221 ,  H01S5/2231 ,  H01S5/34306 ,  H01S5/4031 ,  H01S5/4087 ,  H04B10/506

    Abstract: A coolerless photonic integrated circuit (PIC), such as a semiconductor electro-absorption modulator/laser (EML) or a coolerless optical transmitter photonic integrated circuit (TxPIC), may be operated over a wide temperature range at temperatures higher then room temperature without the need for ambient cooling or hermetic packaging. Since there is large scale integration of N optical transmission signal WDM channels on a TxPIC chip, a new DWDM system approach with novel sensing schemes and adaptive algorithms provides intelligent control of the PIC to optimize its performance and to allow optical transmitter and receiver modules in DWDM systems to operate uncooled. Moreover, the wavelength grid of the on-chip channel laser sources may thermally float within a WDM wavelength band where the individual emission wavelengths of the laser sources are not fixed to wavelength peaks along a standardized wavelength grid but rather may move about with changes in ambient temperature. However, control is maintained such that the channel spectral spacing between channels across multiple signal channels, whether such spacing is periodic or aperiodic, between adjacent laser sources in the thermally floating wavelength grid are maintained in a fixed relationship. Means are then provided at an optical receiver to discover and lock onto floating wavelength grid of transmitted WDM signals and thereafter demultiplex the transmitted WDM signals for OE conversion.

    Abstract translation: 诸如半导体电吸收调制器/激光器（EML）或无冷器光发射机光子集成电路（TxPIC）的无冷却光子集成电路（PIC）可以在高于室温的温度范围内工作，而不需要 需要环境冷却或密封包装。 由于在TxPIC芯片上存在N个光传输信号WDM信道的大规模集成，新的具有新型感测方案和自适应算法的DWDM系统方法提供了PIC的智能控制，以优化其性能并允许光发射机和接收机模块在DWDM 系统运行未冷却。 此外，片上通道激光源的波长网格可以在WDM波长带内热漂浮，其中激光源的各个发射波长不沿着标准波长网格固定到波长峰值，而是可以随着环境的变化而移动 温度。 然而，保持控制，使得在热浮动波长网格中的相邻激光源之间跨多个信号通道的信道之间的信道频谱间隔（无论这样的间隔是周期性的还是非周期性的）保持固定的关系。 然后在光接收器处提供装置以发现并锁定发送的WDM信号的浮动波长网格，然后对发送的WDM信号进行解复用以进行OE转换。

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