公开(公告)号：US07823412B2

公开(公告)日：2010-11-02

申请号：US11683092

申请日：2007-03-07

申请人： Won Jae Jang ,  Suk Ho Lee

发明人： Won Jae Jang ,  Suk Ho Lee

IPC分类号： F25B23/00

CPC分类号： F25B43/02 ,  F25B2400/02 ,  F25B2500/01 ,  Y10T137/206

摘要： A hermetic vessel capable of preventing noise caused by fluid flow, and an oil separator, a gas-liquid separator, and an air conditioning system using the same. The hermetic vessel having a vessel body includes an inlet through which a fluid flows into the vessel body, and a discharge pipe which is inserted into the vessel body to discharge the fluid. The discharge pipe includes a first discharge pipe which guides a flow of the fluid in a first direction and causes a wave of a higher frequency than an audible frequency, and a second discharge pipe which is connected to the first discharge pipe to guide a flow of the fluid from the first discharge pipe in a second direction which is different from the first direction.

摘要翻译： 能够防止由流体流动引起的噪音的密封容器，以及油分离器，气液分离器和使用其的空调系统。 具有容器主体的密封容器包括流体流入容器主体的入口和插入容器主体中以排出流体的排出管。 排出管包括：第一排出管，其在第一方向上引导流体的流动并引起比可听频率高的波;以及第二排出管，其连接到第一排出管，以引导流体的流动 来自第一排出管的流体沿与第一方向不同的第二方向。

公开(公告)号：US20100267817A1

公开(公告)日：2010-10-21

申请号：US12744151

申请日：2008-11-21

申请人： Woo Jae Jang ,  Joon-Gyo Oh ,  Young Youn Hwang ,  Won Jae Choi ,  Key An Um

发明人： Woo Jae Jang ,  Joon-Gyo Oh ,  Young Youn Hwang ,  Won Jae Choi ,  Key An Um

IPC分类号： A61K31/337 ,  A61P43/00

CPC分类号： A61K9/19 ,  A61K47/26 ,  A61K47/32

摘要： The present invention relates to a lyophilized composition with an improved reconstitution time comprising a taxoid and a method thereof. More specifically, the present invention relates to a lyophilized composition with an improved reconstitution time prepared by mixing and dissolving a taxoid; cyclodextrin (CD); a hydrophilic polymer selected from the group consisting of hydroxypropylmethyl CeIIuIoSe (HPMC), polyethylene glycol (PEG), and polyvinylpyrrolidone (PVP); and a bulking agent of saccharides in water for injection; and lyophilizing the mixture, and a method thereof.

摘要翻译： 本发明涉及具有改进的重构时间的冻干组合物，其包含紫杉烷及其方法。 更具体地，本发明涉及通过混合和溶解紫杉烷制备的具有改进的重构时间的冻干组合物; 环糊精（CD）; 选自羟丙基甲基CeIIuIoSe（HPMC），聚乙二醇（PEG）和聚乙烯吡咯烷酮（PVP）的亲水性聚合物; 和糖类在注射用水中的填充剂; 并将混合物冻干，及其方法。

公开(公告)号：US07719845B1

公开(公告)日：2010-05-18

申请号：US11379550

申请日：2006-04-20

申请人： Sang Jae Jang ,  Chul Woo Park ,  Jae Dong Kim ,  Choon Heung Lee

发明人： Sang Jae Jang ,  Chul Woo Park ,  Jae Dong Kim ,  Choon Heung Lee

IPC分类号： H05K5/02

CPC分类号： H01L23/3121 ,  G06K19/07732 ,  G06K19/07745 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/0989 ,  H05K2201/10159 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A memory card comprising a circuit board having opposed upper and lower circuit board surfaces, multiple side edges, a chamfer extending between a pair of the side edges, a plurality of pads disposed on the lower circuit board surface, and a conductive pattern which is disposed on the upper circuit board surface and electrically connected to the pads. At least one electronic circuit device is attached to the upper circuit board surface and electrically connected to the conductive pattern of the circuit board. A body at least partially encapsulates the circuit board and the electronic circuit element such that sections of the upper circuit board surface, including one which extends along the entirety of the chamfer, is not covered by the body.

摘要翻译： 一种存储卡，包括具有相对的上电路板表面和下电路板表面的电路板，多个侧边缘，在一对侧边缘之间延伸的倒角，设置在下电路板表面上的多个焊盘和设置在下电路板表面上的导电图案 在上电路板表面上并电连接到焊盘。 至少一个电子电路装置附接到上电路板表面并电连接到电路板的导电图案。 主体至少部分地封装电路板和电子电路元件，使得包括沿整个倒角延伸的上电路板表面的部分不被主体覆盖。

公开(公告)号：US07588625B2

公开(公告)日：2009-09-15

申请号：US10540357

申请日：2003-12-23

申请人： Kung-Won Nam ,  Min-Young Cho ,  Young-Chae Jung ,  Young-Jae Jang ,  Franz Hauzenberger

发明人： Kung-Won Nam ,  Min-Young Cho ,  Young-Chae Jung ,  Young-Jae Jang ,  Franz Hauzenberger

IPC分类号： C21B13/02

CPC分类号： C21B13/02 ,  C21B13/0013 ,  C21B13/002 ,  C21B13/0033 ,  C21B13/14 ,  C21B13/143 ,  C21B2100/44 ,  C21B2100/64 ,  Y02P10/136 ,  Y02P10/216

摘要： The invention relates to an apparatus and method for manufacturing molten irons. The method for manufacturing molten irons includes providing a mixture containing iron by drying and mixing iron ores and additives, passing the mixture containing iron through one or more successively-connected fluidized beds to convert the mixture into a reducing material that is reduced and calcined, forming a coal packed bed, which is a heat source in which the reducing material has been melted, charging the reducing material to the coal packed bed and supplying oxygen to the coal packed bed to manufacture molten irons, and supplying reducing gas exhausted from the coal packed bed to the fluidized bed. In the providing a mixture containing iron, exhaust gas exhausted from the fluidized bed is branched to dry at least one of the iron ores and the additives. The apparatus for manufacturing molten irons uses this method for manufacturing molten irons. Through the use of the invention, at least one of iron ores and additives is dried and conveyed to thereby enhance energy efficiency and minimize the amount of required equipment.

摘要翻译： 本发明涉及一种用于制造铁水的设备和方法。 制造铁水的方法包括通过干燥和混合铁矿石和添加剂来提供含铁的混合物，使含有铁的混合物通过一个或多个连续连续的流化床，将混合物转化成还原和煅烧的还原材料，形成 作为还原材料熔融的热源的填充煤层，将还原材料装入煤填充床并向煤填充床供给氧以制造铁水，并且供应从煤包装中排出的还原气体 床到流化床。 在提供含铁的混合物中，从流化床排出的废气被分支以干燥至少一种铁矿石和添加剂。 用于制造铁水的设备使用这种制造铁水的方法。 通过使用本发明，将铁矿石和添加剂中的至少一种干燥和输送，从而提高能量效率并使所需设备的量最小化。

公开(公告)号：US20070113176A1

公开(公告)日：2007-05-17

申请号：US11650985

申请日：2007-01-09

申请人： Jae Jang

发明人： Jae Jang

IPC分类号： G06F17/00 ,  G06F15/16

CPC分类号： H04M1/72552 ,  H04M1/72555

摘要： A method and apparatus simultaneously displays the main text and/or more attached filed of a message received in a mobile terminal. This simultaneous display allows a user to confirm the main text and attached files in the message. The main text and attached files may be shown in respective areas of the display.

摘要翻译： 一种方法和装置同时显示在移动终端中接收的消息的主文本和/或更多附加的字段。 这种同时显示允许用户在消息中确认主文本和附加文件。 主文本和附件可能会显示在显示屏的各个区域中。

公开(公告)号：US07201327B1

公开(公告)日：2007-04-10

申请号：US10967462

申请日：2004-10-18

申请人： Chul Woo Park ,  Sang Jae Jang ,  Sung Su Park ,  Choon Heung Lee ,  Suk Gu Ko

发明人： Chul Woo Park ,  Sang Jae Jang ,  Sung Su Park ,  Choon Heung Lee ,  Suk Gu Ko

IPC分类号： G06K19/06

CPC分类号： G06K19/077 ,  G06K19/07732 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012

摘要： A memory card comprising a die paddle having opposed, generally planar first and second die paddle surfaces and multiple peripheral edge segments. Disposed along and in spaced relation to one of the peripheral edge segments of the die paddle is a plurality of contacts, each of which has opposed, generally planar first and second contact surfaces. An inner body partially encapsulates the die paddle and the contacts, the first contact surface of each of the contacts and the first die paddle surface of the die paddle being exposed in and substantially flush with a generally planar first inner body surface of the inner body. The inner body further defines a generally planar second inner body surface which is disposed in opposed relation to the first inner body surface, the second contact surface of each of the contacts being exposed in the second inner body surface. At least one electronic circuit element is attached to the first die paddle surface and electrically connected to at least one of the contacts. An outer body partially encapsulates the inner body such that the first die paddle surface, the first contact surface of each of the contacts, the first inner body surface and the electronic circuit element are covered by the outer body, with the second inner body surface and hence the second contact surface of each of the contacts not being covered by the outer body and thus exposed.

摘要翻译： 一种存储卡，其包括具有相对的，大致平面的第一和第二管芯片表面和多个外围边缘部分的管芯焊盘。 与模板的周边边缘部分中的一个相互间隔设置有多个触点，每个触点具有相对的大致平面的第一和第二接触表面。 内部主体部分地封装管芯焊盘和触头，每个触头的第一接触表面和管芯焊盘的第一裸片焊盘表面暴露于内部主体的大致平面的第一内部主体表面并基本上与其平齐。 内体进一步限定大致平坦的第二内体表面，其以与第一内体表面相对的方式设置，每个触头的第二接触表面暴露在第二内体表面中。 至少一个电子电路元件附接到第一裸片表面并电连接到至少一个触点。 外部主体部分地封装内部主体，使得第一裸片表面，每个触点的第一接触表面，第一内部主体表面和电子电路元件被外部主体覆盖，具有第二内部主体表面和 因此每个触点的第二接触表面不被外体覆盖并因此被暴露。

公开(公告)号：US20070071659A1

公开(公告)日：2007-03-29

申请号：US11527421

申请日：2006-09-27

申请人： Jae Gil ,  Ro Lee ,  Sung Kim ,  Jae Jang

发明人： Jae Gil ,  Ro Lee ,  Sung Kim ,  Jae Jang

IPC分类号： B01J10/00 ,  B01J8/04

CPC分类号： B01J19/0093 ,  B01B1/005 ,  B01J2219/00783 ,  B01J2219/00835 ,  B01J2219/00873 ,  C01B3/384 ,  C01B2203/0233 ,  C01B2203/044 ,  C01B2203/047 ,  C01B2203/085 ,  C01B2203/1294

摘要： The invention relates to a thin micro reforming apparatus used in a fuel cell system. The reforming apparatus includes a substrate having a flow path formed therein, and a fuel inlet portion for introducing fuel to the flow path of the substrate. The fuel inlet portion allows the fuel to flow through a predetermined length of a channel, thereby preheating the fuel. The reforming apparatus also includes an evaporator having a flow path for gasifying liquid fuel, and a reformer for reforming fuel into hydrogen gas via heat absorption reaction. The reforming apparatus further includes a CO remover for removing CO gas contained in the hydrogen gas via heat generation reaction, and a cover for sealing the flow paths of the substrate. The channel of the fuel inlet portion surrounds the evaporator, reformer and CO remover, thereby facilitating insulation at the sides of the reforming apparatus and increasing heat efficiency.

摘要翻译： 本发明涉及一种用于燃料电池系统的薄型微型重整装置。 重整装置包括其中形成有流路的基板和用于将燃料引入基板的流路的燃料入口部。 燃料入口部分允许燃料流过预定长度的通道，从而预热燃料。 重整装置还包括具有用于气化液体燃料的流路的蒸发器和用于通过吸热反应将燃料重整成氢气的重整器。 重整装置还包括CO去除器，用于通过发热反应除去包含在氢气中的CO气体，以及用于密封基板的流动路径的盖。 燃料入口部分的通道围绕蒸发器，重整器和CO去除器，从而促进重整设备侧面的绝缘并提高热效率。

公开(公告)号：US20060065502A1

公开(公告)日：2006-03-30

申请号：US11056225

申请日：2005-02-14

申请人： In Joo ,  Jae Jang ,  Jae Lee ,  Sang Yang ,  Myung Kim ,  Jong Lim

发明人： In Joo ,  Jae Jang ,  Jae Lee ,  Sang Yang ,  Myung Kim ,  Jong Lim

IPC分类号： F16H45/02

CPC分类号： F16H45/02 ,  F16H41/28 ,  F16H2045/0294

摘要： A torque converter for a vehicle includes a front cover integrally formed with a boss to which a crank shaft of an engine side is connected, an impeller connected to the front cover to rotate together with the front cover, a turbine disposed facing the impeller, a stator disposed between the impeller and the turbine to convert flow of oil directed from the turbine, a lockup clutch mechanism for directly connecting the engine to the turbine. A blade of the impeller and/or the turbine is provided with inner and outer projections coupled to shell and core of the impeller and/or the turbine. Each of the inner and outer and inner projections includes a base located on a slit formed on the shell/core and an extending section extending from the base, the extending section being bent after penetrating the slit.

摘要翻译： 一种用于车辆的变矩器，包括：前盖，其整体地形成有与发动机侧的曲轴连接的凸台;连接到前盖的叶轮与前盖一起旋转，与所述叶轮相对设置的涡轮机; 定子布置在叶轮和涡轮之间以转换从涡轮机引导的油流，用于将发动机直接连接到涡轮机的锁止离合器机构。 叶轮和/或涡轮机的叶片设置有联接到叶轮和/或涡轮机的壳和芯的内部和外部突出部。 内外凸部分别具有形成在壳/芯上的狭缝上的基部和从基部延伸的延伸部，该延伸部在穿透狭缝后弯曲。

公开(公告)号：US06936922B1

公开(公告)日：2005-08-30

申请号：US10672886

申请日：2003-09-26

申请人： Sung Soon Park ,  Sang Jae Jang ,  Choon Heung Lee ,  Seon Goo Lee ,  Eun Sook Sohn ,  Sung Su Park

发明人： Sung Soon Park ,  Sang Jae Jang ,  Choon Heung Lee ,  Seon Goo Lee ,  Eun Sook Sohn ,  Sung Su Park

IPC分类号： H01L23/16 ,  H01L23/48 ,  H01L23/498 ,  H01L25/10 ,  H05K1/11 ,  H05K3/34

CPC分类号： H05K3/3436 ,  H01L23/16 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3511 ,  H05K1/111 ,  H05K2201/094 ,  H05K2201/09736 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electrical substrate useful for semiconductor packages is disclosed. The electrical substrate includes a core insulative layer. A first surface of the insulative layer has circuit patterns thereon. Some of the circuit patterns are stepped in their heights from the first surface, in that a first subportion of the circuit pattern, including a ball land, extends further from the first surface than a second subportion of the same circuit pattern, and also extends further from the first surface than a ball land of other circuit patterns. Accordingly, solder balls fused to the ball lands of the stepped circuit patterns extend further from the first surface than same-size solder balls fused to the ball lands of the non-stepped circuit patterns, thereby circumventing electrical connectivity problems that may arise from warpage of the electrical substrate.

摘要翻译： 公开了一种可用于半导体封装的电气基板。 电气基板包括芯绝缘层。 绝缘层的第一表面具有电路图案。 电路图案中的一些从第一表面上升到它们的高度，因为电路图形的第一子部分（包括球形区域）比第一表面的第一子部分比相同电路图案的第二子部分进一步延伸，并且还进一步延伸 从第一个表面比其他电路图案的球场。 因此，熔融到阶梯式电路图案的球台的焊球比与非阶梯式电路图案的球面熔合的相同尺寸的焊球相比，从第一表面延伸出来，从而避免了由于翘曲引起的电连接问题 电气基板。

公开(公告)号：US06750545B1

公开(公告)日：2004-06-15

申请号：US10376988

申请日：2003-02-28

申请人： Sun Goo Lee ,  Sang Jae Jang ,  Choon Heung Lee ,  Akito Yoshida

发明人： Sun Goo Lee ,  Sang Jae Jang ,  Choon Heung Lee ,  Akito Yoshida

IPC分类号： H01L2348

CPC分类号： H01L23/49805 ,  H01L23/49833 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/01079

摘要： A stackable semiconductor package. The semiconductor package comprises a plurality of first and second leads which are arranged in a generally quadrangular array having one pair of opposed sides defined by the first leads and one pair of opposed sides defined by the second leads. The first and second leads each include opposed, generally planar first and second surfaces, and a third surface which is also disposed in opposed relation to the second surface and positioned between the first and second surfaces. A first semiconductor die is electrically connected to the third surfaces of the first leads, with a second semiconductor die being electrically connected to the third surfaces of the second leads. A package body at least partially encapsulates the first and second leads and the first and second semiconductor dies such that the first and second surfaces of each of the first and second leads are exposed in the package body.

摘要翻译： 可堆叠半导体封装。 半导体封装包括多个第一和第二引线，其布置成大致四边形阵列，其具有由第一引线限定的一对相对侧和由第二引线限定的一对相对侧。 第一和第二引线各自包括相对的，大致平面的第一和第二表面，以及第三表面，其也与第二表面相对设置并且位于第一和第二表面之间。 第一半导体管芯电连接到第一引线的第三表面，第二半导体管芯电连接到第二引线的第三表面。 封装体至少部分地封装第一和第二引线以及第一和第二半导体管芯，使得第一和第二引线中的每一个的第一和第二表面暴露在封装主体中。