公开(公告)号：US08107185B2

公开(公告)日：2012-01-31

申请号：US12562742

申请日：2009-09-18

Applicant: Kazuhiro Okamoto ,  Yuki Ono ,  Yukihiro Gorai ,  Mitsuru Watanabe ,  Akihiro Sato ,  Keitaro Kikuchi

Inventor： Kazuhiro Okamoto ,  Yuki Ono ,  Yukihiro Gorai ,  Mitsuru Watanabe ,  Akihiro Sato ,  Keitaro Kikuchi

IPC: G11B21/02 ,  G11B5/48

CPC classification number: G11B5/3136 ,  G11B5/6005 ,  G11B5/6064

Abstract: A magnetic disk device includes a magnetic head assembly, which includes magnetic heads, support plates, and a flexible wiring substrate that are integrally formed. The magnetic heads include heating elements for making head element parts protrude toward magnetic disks by thermal expansion, the support plate supports the magnetic head, the flexible wiring substrate is provided along the support plate and electrically connects the magnetic heads to a circuit system, and the magnetic head assembly and the magnetic disks are assembled in a case. The magnetic disk device includes a sensor and a floating distance control circuit. The sensor detects at least one of atmospheric pressure, temperature, and humidity in the case. The floating distance control circuit increases or decreases current supplied to the heating element on the basis of the output of the sensor and controls the floating distance of the magnetic head so that the floating distance is constant. While being received in a package made of high temperature co-fired ceramic, the sensor is mounted on a circuit mounting surface of the flexible wiring substrate in the case.

Abstract translation: 磁盘装置包括磁头组件，其包括一体形成的磁头，支撑板和柔性布线基板。 磁头包括用于通过热膨胀使头元件部件朝向磁盘突出的加热元件，支撑板支撑磁头，柔性布线基板沿着支撑板设置并将磁头电连接到电路系统，并且 磁头组件和磁盘组装在一个壳体中。 磁盘装置包括传感器和浮动距离控制电路。 该传感器检测大气压力，温度和湿度中的至少一个。 浮动距离控制电路根据传感器的输出增加或减少提供给加热元件的电流，并控制磁头的浮动距离，使浮动距离恒定。 在被接收在由高温共烧陶瓷制成的包装中时，传感器安装在壳体中的柔性布线基板的电路安装表面上。

公开(公告)号：US20110207263A1

公开(公告)日：2011-08-25

申请号：US13101454

申请日：2011-05-05

Applicant: Mitsuru WATANABE ,  Tetsuya FUKUI

Inventor： Mitsuru WATANABE ,  Tetsuya FUKUI

IPC: H01L21/78

CPC classification number: H01L24/34 ,  H01L23/49562 ,  H01L24/37 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: The present invention relates to a method of manufacturing a semiconductor device including (1) forming a laminated structure on a major surface of a semiconductor substrate, the laminated structure comprising at least a first metal layer that forms a Schottky junction with the semiconductor substrate, a second metal layer primarily composed of aluminum, and a third metal layer primarily composed of molybdenum or titanium, (2) patterning the laminated structure into a predetermined configuration, (3) forming a solder bonding metal layer comprising at least nickel, ion or cobalt on the major surface of the semiconductor substrate having the patterned laminated structure formed thereon, (4) patterning the solder bonding metal layer into a pattern configuration identical to that of the laminated structure, (5) cutting the semiconductor substrate on which the laminated structure and the solder bonding metal layer are patterned to form a plurality of semiconductor chips, and (6) bonding the semiconductor chip to a first frame using at least one solder layer formed on the solder bonding metal layer on the major surface of the semiconductor substrate, and bonding a rear face of the semiconductor chip to a second frame.

Abstract translation: 本发明涉及一种制造半导体器件的方法，该半导体器件包括：（1）在半导体衬底的主表面上形成叠层结构，所述层压结构至少包括与半导体衬底形成肖特基结的第一金属层， 主要由铝构成的第二金属层和主要由钼或钛构成的第三金属层，（2）将层压结构图案化为规定的构造，（3）形成至少包含镍，离子或钴的焊料接合金属层， （4）将焊料接合金属层图案化为与层叠结构相同的图案构造，（5）切割其上层叠结构和层叠结构的半导体基板，其中， 图案化焊接金属层以形成多个半导体芯片，（6）将焊接接合金属层接合 使用在所述半导体衬底的主表面上的所述焊料接合金属层上形成的至少一个焊料层，将所述半导体芯片的后表面接合到第二框架的第一框架。

公开(公告)号：US20090193905A1

公开(公告)日：2009-08-06

申请号：US11911778

申请日：2007-10-17

Applicant: Tetsuya FUKUDA ,  Katsuya KIKUIRI ,  Kiyoshi SATO ,  Mitsuru WATANABE

Inventor： Tetsuya FUKUDA ,  Katsuya KIKUIRI ,  Kiyoshi SATO ,  Mitsuru WATANABE

IPC: G01L9/12

CPC classification number: G01L9/0073

Abstract: Embodiments of the present disclosure are directed to a package having pressure sensor including a first substrate having a fixed electrode bonded to a second substrate having a movable electrode disposed at a predetermined interval from the fixed electrode, a support substrate with an opening for storing the second substrate, and a resin layer for fixing the pressure sensor and the support substrate. The pressure sensor may be packaged on the support substrate via the first substrate and a bonding member in a state where the second substrate is fit within the opening. The package for the pressure sensor may be sufficiently thin to be employed for the use on a minimum area.

Abstract translation: 本公开的实施例涉及一种具有压力传感器的封装，所述封装具有第一基板，所述第一基板具有粘合到第二基板的固定电极，所述第二基板具有以与所述固定电极隔开预定间隔设置的可动电极，具有开口的支撑基板， 基板和用于固定压力传感器和支撑基板的树脂层。 压力传感器可以经由第一基板和接合部件在第二基板配合在开口内的状态下被包装在支撑基板上。 用于压力传感器的包装可以足够薄以便在最小面积上使用。

公开(公告)号：US07506548B2

公开(公告)日：2009-03-24

申请号：US11865479

申请日：2007-10-01

Applicant: Tetsuya Fukuda ,  Katsuya Kikuiri ,  Kiyoshi Sato ,  Mitsuru Watanabe ,  Yoshinobu Nakamura

Inventor： Tetsuya Fukuda ,  Katsuya Kikuiri ,  Kiyoshi Sato ,  Mitsuru Watanabe ,  Yoshinobu Nakamura

IPC: G01L7/00

CPC classification number: G01L19/0069 ,  G01L19/147 ,  H01L2224/48091 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: A package is mainly formed of a package body having a storage area for storing a pressure sensor, a capacity type pressure sensor stored in the storage area of the package body, a lid seals the package body in which the pressure sensor is stored, an adhesive agent for fixing the pressure sensor to the package body, and a bonding wire for electrically coupling a bonding pad of the pressure sensor and a conductive portion of the package body. An adhesive area of the package body and the pressure sensor is set to the area other than a projection area of the diaphragm of the pressure sensor on a mount bottom surface. This makes it possible to provide the package for the pressure sensor capable of detecting the pressure with high sensitivity although the gap between the substrate and the diaphragm has the value with the magnitude of several μms.

Abstract translation: 封装主要由具有用于存储压力传感器的存储区域的存储区域，存储在封装体的存储区域中的容量型压力传感器，密封保存有压力传感器的封装体的封装体，粘合剂 用于将压力传感器固定到封装主体的代理，以及用于将压力传感器的焊盘电耦接到封装体的导电部分的接合线。 包装体和压力传感器的粘合区域设置在除了压力传感器的隔膜的投影区域之外的区域在安装底面上。 这使得可以提供能够以高灵敏度检测压力的压力传感器的封装，尽管基板和隔膜之间的间隙具有几个数量级的值。

公开(公告)号：US20060187584A1

公开(公告)日：2006-08-24

申请号：US11352740

申请日：2006-02-13

Applicant: Mitsuru Watanabe

Inventor： Mitsuru Watanabe

IPC: G11B5/60

CPC classification number: G11B5/4826

Abstract: A magnetic head is provided that is formed by fixedly bonding a slider having a thin-film magnetic element on a flexure formed of metallic material which constitutes a gimbal suspension. The slider includes electrodes conducted to the thin-film magnetic head on an end surface thereof on a trailing side which is orthogonal to the recording-medium-opposed surface. The flexure has independent spacer projections. The slider and the flexure are bonded by an adhesive agent applied to bonding areas on end surfaces of a pair of spacer projections positioned in the vicinity of the end surface on the trailing side out of the spacer projections.

Abstract translation: 提供了一种磁头，其通过将由具有薄膜磁性元件的滑块固定地结合在由构成万向架悬架的金属材料形成的挠曲件上而形成。 滑块包括在与记录介质相对表面正交的后侧的端面上传导到薄膜磁头的电极。 挠曲件具有独立的间隔件突起。 滑块和挠曲件通过施加到定位在后侧端面附近的一对间隔突起的端面上的接合区域上的粘合剂粘合在间隔件突出部之外。

公开(公告)号：US07095590B2

公开(公告)日：2006-08-22

申请号：US10681474

申请日：2003-10-08

Applicant: Michiharu Motonishi ,  Mitsuru Watanabe

Inventor： Michiharu Motonishi ,  Mitsuru Watanabe

IPC: G11B21/20

CPC classification number: G11B5/4826 ,  H05K1/053 ,  H05K3/321

Abstract: A head gimbal assembly has a gimbal suspension that includes a metal flexure bonded to a slider having a magnetic head element. This head gimbal assembly prevents damage from electrostatic discharge more efficiently. In the head gimbal assembly, a region of an oxide film on a slider-bonding surface of the flexure is completely or incompletely removed to form a film-removed region, and conductive adhesive resin is disposed between the film-removed region and the slider.

Abstract translation: 头万向架组件具有万向架悬架，其包括接合到具有磁头元件的滑块的金属挠曲件。 该头万向架组件可以更有效地防止静电放电造成的损坏。 在头部万向节组件中，在挠曲件的滑块接合表面上的氧化膜区域被完全或不完全地去除以形成膜去除区域，并且导电粘合剂树脂设置在膜去除区域和滑块之间。

公开(公告)号：US20060131685A1

公开(公告)日：2006-06-22

申请号：US11099454

申请日：2005-04-06

Applicant: Mitsuru Watanabe ,  Tetsuya Fukui

Inventor： Mitsuru Watanabe ,  Tetsuya Fukui

IPC: H01L29/47 ,  H01L21/28

CPC classification number: H01L29/8611 ,  H01L23/488 ,  H01L23/49562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/33 ,  H01L24/48 ,  H01L29/0619 ,  H01L29/0638 ,  H01L29/402 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05556 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48095 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device has a semiconductor device chip with upper and lower terminal electrodes, and upper and lower frames bonded to the upper and lower terminal electrodes, respectively, with solder material, wherein the semiconductor device chip includes: a semiconductor layer of a first conductivity type; a diffusion layer of a second conductivity type, which is selectively formed in the semiconductor layer; a plurality of guard-ring layers of the second conductivity type, which are formed outside of the diffusion layer in the semiconductor layer; an insulating film formed on the semiconductor layer; and a field plate formed of a poly-crystalline silicon film embedded in the insulating film.

Abstract translation: 半导体器件具有具有上端子电极和下端子电极的半导体器件芯片，并且上下框架分别与焊接材料接合到上端子电极和下端子电极，其中半导体器件芯片包括：第一导电类型的半导体层 ; 第二导电类型的扩散层，其被选择性地形成在半导体层中; 多个第二导电类型的保护环层，形成在半导体层中的扩散层的外部; 形成在半导体层上的绝缘膜; 以及由嵌入绝缘膜中的多晶硅膜形成的场板。

公开(公告)号：US07030547B2

公开(公告)日：2006-04-18

申请号：US10800526

申请日：2004-03-15

Applicant: Mitsuru Watanabe ,  Satoshi Muto

Inventor： Mitsuru Watanabe ,  Satoshi Muto

IPC: H01J29/07 ,  H01J29/81

CPC classification number: H01J29/076 ,  H01J2229/0772 ,  H01J2229/0788

Abstract: A color cathode ray tube has stress-absorbing hole patterns in skirt portions of its color selection electrode. Each of the stress-absorbing hole patterns is composed of a plurality of columns of rectangular through holes, and the columns are arranged in a lengthwise direction of the skirt portions. Each of the plurality of columns of rectangular through holes is composed of rectangular through holes arranged in a widthwise direction of the skirt portions. The relationships in shape of the rectangular through holes among outermost columns, columns next to the outermost columns, and remaining columns is optimized in the stress-absorbing hole patterns.

Abstract translation: 彩色阴极射线管在其选色电极的裙部具有应力吸收孔图案。 每个应力吸收孔图案由多个矩形通孔列组成，并且该列沿裙部的长度方向布置。 多个矩形通孔列中的每一个由在裙部的宽度方向上布置的矩形通孔构成。 应力吸收孔图案优化了最外面的列之间的矩形通孔的形状与最外面的列之间的列以及剩余的列的关系。

公开(公告)号：US20060006506A1

公开(公告)日：2006-01-12

申请号：US11171282

申请日：2005-07-01

Applicant: Mitsuru Watanabe ,  Tetsuya Fukui

Inventor： Mitsuru Watanabe ,  Tetsuya Fukui

IPC: H01L23/495

CPC classification number: H01L24/34 ,  H01L23/49562 ,  H01L24/37 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: A semiconductor device comprises: a semiconductor chip; a first frame; a solder layer which bonds the solder bonding metal layer of the semiconductor chip and the first frame; and a second frame bonded to the rear face of the semiconductor chip. The semiconductor chip includes: a semiconductor substrate; a first metal layer provided on a major surface of the semiconductor substrate and forming a Schottky junction with the semiconductor substrate; a second metal layer provided on the first metal layer and primarily composed of aluminum; a third metal layer provided on the second metal layer and primarily composed of molybdenum or titanium; and a solder bonding metal layer provided on the third metal layer and including at least a forth metal layer which is primarily composed of nickel, ion or cobalt.

Abstract translation: 半导体器件包括：半导体芯片; 第一帧; 焊接层，其结合半导体芯片的焊料接合金属层和第一框架; 以及结合到半导体芯片的背面的第二框架。 半导体芯片包括：半导体衬底; 设置在所述半导体衬底的主表面上并与所述半导体衬底形成肖特基结的第一金属层; 设置在第一金属层上并主要由铝构成的第二金属层; 设置在第二金属层上并主要由钼或钛构成的第三金属层; 以及设置在所述第三金属层上并且包括主要由镍，离子或钴组成的至少第四金属层的焊料接合金属层。

公开(公告)号：US06845422B2

公开(公告)日：2005-01-18

申请号：US09986614

申请日：2001-11-09

Applicant: Masaki Shimada ,  Mitsuru Watanabe ,  Kiyotaka Murakami

Inventor： Masaki Shimada ,  Mitsuru Watanabe ,  Kiyotaka Murakami

IPC: G06F1/26 ,  G06F1/18 ,  G06F3/00 ,  G06F3/06 ,  G06F13/14 ,  G06F13/38 ,  G06F13/40 ,  G11C29/00

CPC classification number: G06F1/18 ,  G06F1/266 ,  G06F3/0601 ,  G06F13/387 ,  G06F2003/0692 ,  Y02D10/14 ,  Y02D10/151

Abstract: The present invention concerns a data-storing device, which is coupled to a personal computer through an interface and can enlarge a number of and a kind of devices connectable to the personal computer. The data-storing device includes an interfacing circuit that includes a data communication path through which the data can be bilaterally communicated between the device and an external device, which is coupled to the device with an interface cable, and a power-supplying path through which a power current can be bilaterally supplied between the device and the external device, wherein the interface cable also includes the data communication path and the power-supplying path; a data-storing unit to store the data sent from the interfacing circuit; and a plurality of interface connecting ports serving as input/output terminals of the interfacing circuit, wherein the interface cable can be connected to one of the interface connecting ports.

Abstract translation: 本发明涉及一种数据存储装置，其通过接口耦合到个人计算机，并且可以扩大可连接到个人计算机的多个设备和一种设备。 数据存储装置包括接口电路，其包括数据通信路径，通过该数据通信路径，数据可以在设备和外部设备之间进行双向通信，外部设备使用接口电缆耦合到设备，以及供电路径， 可以在设备和外部设备之间双向提供电力电流，其中接口电缆还包括数据通信路径和供电路径; 数据存储单元，用于存储从接口电路发送的数据; 以及用作接口电路的输入/输出端子的多个接口连接端口，其中接口电缆可以连接到接口连接端口之一。