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公开(公告)号：US11015052B2
公开(公告)日：2021-05-25
申请号：US16277069
申请日：2019-02-15
发明人： Shur-Fen Liu , Chin-Hsien Hung
摘要： A halogen-free low dielectric resin composition is provided. The halogen-free low dielectric resin composition comprises: (A) a resin system, which includes: (a1) a polyphenylene ether resin with unsaturated functional groups, and (a2) a polyfunctional vinyl aromatic copolymer; and (B) an allyl cyclophosphazene compound represented by the following formula (I): in formula (I), t is an integer ranging from 2 to 6, wherein, the polyfunctional vinyl aromatic copolymer (a2) is prepared by copolymerizing one or more divinyl aromatic compounds and one or more monovinyl aromatic compounds.
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62.发明授权公开(公告)号：US10994516B2
公开(公告)日：2021-05-04
申请号：US15859829
申请日：2018-01-02
发明人： Chih-Wei Liao , Hsien-Te Chen , Tsung-Hsien Lin , Ju-Ming Huang
摘要： A resin composition is provided. The resin composition comprises the following components: (A) epoxy resin; (B) a cross-linking agent; (C) bismaleimide resin (BMI) represented by the following formula (I): wherein R1 is an organic group; and (D) a resin represented by the following formula (II): wherein n is an integer of 1 to 10.
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公开(公告)号：US10575401B1
公开(公告)日：2020-02-25
申请号：US16145822
申请日：2018-09-28
发明人： Shur-Fen Liu , Chin-Hsien Hung , Wei-Jung Yang , Chang-Chih Liu
IPC分类号： H05K1/03 , C08L9/00 , C08K5/3492 , C08F236/06 , C08F236/08 , C08F4/34
摘要： A dielectric composite is provided. The dielectric composite includes: at least one first dielectric layer; and at least one second dielectric layer, wherein the first dielectric layer has a thermal coefficient of dielectric constant (TCDk) not higher than −150 ppm/° C., and the second dielectric layer has a TCDK not lower than 50 ppm/° C.; and the dielectric composite has a dielectric constant (Dk) not lower than 4, and a TCDk ranging from 0 to −150 ppm/° C.
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公开(公告)号：US10568211B2
公开(公告)日：2020-02-18
申请号：US14808364
申请日：2015-07-24
发明人： Shur-Fen Liu , Meng-Huei Chen
IPC分类号： C08J5/24 , C08G65/48 , C08K5/00 , C08G65/44 , C08K5/3492 , C08K5/5313 , H05K3/00 , H05K1/03 , H05K3/02
摘要： A resin composition, comprising: (a) a resin of formula (I): (b) triallyl isocyanurate (TAIC) as a first hardener; and (c) a hardening promoter, which is a metallic salt compound of formula (II): wherein, R1, R2, R3, R4, A1, A2, Ma+, b, and n are as defined in the specification, and wherein the weight ratio of the resin (a) to the first hardener (b) is about 10:1 to about 1:1, and the content of the hardening promoter (c) is about 0.1 wt % to less than 15 wt % based on the total weight of the resin (a) and the first hardener (b), and the weight ratio of the resin (a) to the total amount of the first hardener (b) and BMI is not lower than 1:1.
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公开(公告)号：US10513607B2
公开(公告)日：2019-12-24
申请号：US15298568
申请日：2016-10-20
发明人： Shur-Fen Liu , Meng-Huei Chen
IPC分类号： C08L71/12 , B32B1/00 , C08K5/3492 , C08L79/08 , C08J5/10 , B05D1/18 , B05D3/00 , C08J5/24 , C08G73/12
摘要： A resin composition is provided. The resin composition comprises the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I), wherein M1 and the Z1 groups are as defined in the specification; and (b) an organic compound of the following formula (II) or formula (III), wherein R′, R11 to R19 and R21 to R28 are as defined in the specification, and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).
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66.发明申请公开(公告)号：US20190203003A1
公开(公告)日：2019-07-04
申请号：US16009266
申请日：2018-06-15
发明人： CHIH-WEI LIAO , GUAN-SYUN TSENG , TSUNG-HSIEN LIN , JU-MING HUANG , CHEN-HUA YU
IPC分类号： C08J5/24 , C08L63/00 , C09D163/00 , C09D5/18 , B32B15/092 , H05K1/03 , H05K1/02 , H05K3/02
CPC分类号： C08J5/24 , B32B15/092 , B32B2457/08 , C08J2363/00 , C08J2421/00 , C08J2465/02 , C08L63/00 , C08L2201/02 , C08L2203/20 , C08L2205/025 , C08L2205/03 , C08L2205/035 , C08L2207/53 , C09D5/18 , C09D163/00 , H05K1/024 , H05K1/0366 , H05K1/0373 , H05K3/022 , H05K2201/012 , H05K2201/0212 , H05K2201/0227
摘要： A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, 1, R1, and R2 are as defined in the specification.
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公开(公告)号：US10246588B1
公开(公告)日：2019-04-02
申请号：US15819382
申请日：2017-11-21
发明人： Shur-Fen Liu , Chin-Hsien Hung
IPC分类号： C08L63/00 , C08L79/04 , H05K1/03 , H05K1/11 , C08G59/22 , C08G59/32 , C08G59/40 , C08G59/50 , C08G59/68
摘要： A solvent-free thermosetting filling resin composition is provided. The resin composition comprises the following components: (A) a benzoxazine resin of formula (I), (B) an epoxy resin with an alicyclic skeleton; (C) an epoxy resin hardener; (D) a benzoxazine resin hardener; and (E) a modified filler, wherein, A, B, R, and n in formula (I) are as defined in the specification.
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公开(公告)号：US10081728B2
公开(公告)日：2018-09-25
申请号：US13679173
申请日：2012-11-16
发明人： Kai-Lun Liu , Hsien-Te Chen , Chih-Wei Liao
CPC分类号： C08L63/00 , B32B15/092 , B32B15/14 , B32B15/20 , B32B27/38 , B32B2262/101 , B32B2307/536 , B32B2457/08 , B82Y30/00 , C08K3/22 , C08K2003/2296 , C08K2201/003 , C08K2201/009 , Y10S977/773 , Y10T428/31529
摘要： A resin composition is provided. The resin composition comprises an epoxy resin, a zinc oxide powder and a hardener, wherein the zinc oxide powder has a Mohs hardness ranging from about 4 to about 5 and a diameter ranging from about 0.1 μm to about 50 μm, and the amount of the zinc oxide powder is more than 0.5 parts by weight and less than 10 parts by weight per 100 parts by weight of the epoxy resin.
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69.发明申请公开(公告)号：US20180044467A1
公开(公告)日：2018-02-15
申请号：US15664156
申请日：2017-07-31
CPC分类号： C08G59/621 , C08G59/3218 , C08G59/34 , C08G59/4014 , C08G59/4071 , C08G59/686 , C08J5/24 , C08J2363/00 , C08J2363/04 , C08J2463/00 , C08J2463/04 , C08J2463/08 , C08L63/00 , C08L63/04 , C08L2203/20 , C08L2205/02 , C08L2205/025 , C08L2205/035 , C08L2205/05 , H05K1/02 , H05K1/0326 , C08K3/36
摘要： A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.
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公开(公告)号：US20170260367A1
公开(公告)日：2017-09-14
申请号：US15174270
申请日：2016-06-06
发明人： Shur-Fen Liu , Meng-Huei Chen
CPC分类号： C08K5/5399 , B32B5/26 , B32B7/04 , B32B15/08 , B32B15/12 , B32B15/14 , B32B15/20 , B32B27/06 , B32B2250/02 , B32B2250/40 , B32B2260/023 , B32B2260/046 , B32B2262/062 , B32B2262/101 , B32B2307/306 , B32B2307/3065 , B32B2307/7246 , B32B2307/73 , B32B2307/748 , B32B2457/08 , C08J5/10 , C08J5/24 , C08J2371/00 , C08J2375/00 , C08J2375/04 , C08J2379/08 , C08K3/016 , C08K3/36 , C08K5/0066 , C08L25/10 , C08L47/00 , C08L53/02 , C08L71/12 , C08L85/02
摘要： A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.004 at 10 GHz; and (b) an alkenyl phenoxy phosphazene component, wherein the amount of the component (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the component (b).
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