公开(公告)号：US20130300025A1

公开(公告)日：2013-11-14

申请号：US13841773

申请日：2013-03-15

Applicant: Corning Incorporated

Inventor： Glen Bennett Cook ,  Prantik Mazumder ,  John Paul Bir Singh

IPC: B29C33/56

CPC classification number: B29C33/56

Abstract: A method of forming a solid layer of a semiconducting material on an external surface of a treated mold which extends between a leading edge and a trailing edge comprises selectively modifying a temperature gradient of a mold such that a temperature of the leading edge (T1) is less than a temperature of the trailing edge (T2) to form the treated mold. The method further comprises submersing the treated mold into a molten semiconducting material such that the leading edge of the treated mold is first submersed into the molten semiconducting material. The method also comprises withdrawing the treated mold from the molten semiconducting material to form the solid layer of the semiconducting material on the external surface of the treated mold.

Abstract translation: 在处理的模具的外表面上形成半导体材料的固体层的方法，其在前缘和后缘之间延伸，包括选择性地改变模具的温度梯度，使得前缘（T1）的温度为 小于后缘（T2）的温度以形成经处理的模具。 该方法还包括将经处理的模具浸入熔融半导体材料中，使得经处理的模具的前缘首先浸入熔融半导体材料中。 该方法还包括从熔融半导体材料中取出经处理的模具，以在被处理的模具的外表面上形成半导体材料的固体层。

公开(公告)号：US12131985B2

公开(公告)日：2024-10-29

申请号：US17470519

申请日：2021-09-09

Applicant: CORNING INCORPORATED

Inventor： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: C25D3/38 ,  C03C3/06 ,  C03C15/00 ,  C03C17/06 ,  C03C17/10 ,  C03C23/00 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/48 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/38 ,  C03C3/076 ,  C25D7/12 ,  H01L23/00 ,  H01L23/492 ,  H05K3/00 ,  H05K3/42

CPC classification number: H01L23/49827 ,  C03C3/06 ,  C03C15/00 ,  C03C17/06 ,  C03C17/10 ,  C03C23/0025 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/76877 ,  H01L23/15 ,  H01L23/481 ,  H01L23/49838 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/388 ,  C03C3/076 ,  C03C2218/115 ,  C25D3/38 ,  C25D7/123 ,  H01L21/486 ,  H01L23/4924 ,  H01L23/49866 ,  H01L23/564 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/0055 ,  H05K3/423 ,  H05K3/425 ,  H05K3/428 ,  H05K2201/068 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/0989 ,  H05K2201/10378 ,  H05K2203/1194 ,  H05K2203/1361 ,  H05K2203/143 ,  H05K2203/1438 ,  H05K2203/162 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

公开(公告)号：US11999135B2

公开(公告)日：2024-06-04

申请号：US16639664

申请日：2018-08-20

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Indrani Bhattacharyya ,  Pei-Chen Chiang ,  Hong-goo Choi ,  Dae youn Kim ,  Jen-Chieh Lin ,  Prantik Mazumder ,  Pei-Lien Tseng

IPC: B32B17/10

CPC classification number: B32B17/1055 ,  B32B17/10036 ,  B32B2307/728

Abstract: Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a cationic polymer coating layer, and associated deposition methods, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (≤600° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.

公开(公告)号：US20240140864A1

公开(公告)日：2024-05-02

申请号：US18409103

申请日：2024-01-10

Applicant: CORNING INCORPORATED

Inventor： Hoon Kim ,  Prantik Mazumder ,  Aram Rezikyan ,  Rajesh Vaddi

IPC: C03C27/04 ,  C03C17/245 ,  C03C17/36

CPC classification number: C03C27/048 ,  C03C17/245 ,  C03C17/3607 ,  C23C18/1637

Abstract: In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnOx) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.

公开(公告)号：US11891687B2

公开(公告)日：2024-02-06

申请号：US17038991

申请日：2020-09-30

Applicant: Corning Incorporated ,  ICFO—The Institute of Photonic Sciences ,  INSTITUCIÓ CATALANA DE RECERCA I ESTUDIS AVANÇATS

Inventor： Rinu Maniyara ,  Prantik Mazumder ,  Valerio Pruneri

IPC: C23C14/58 ,  C23C14/35 ,  C23C14/08 ,  H01B1/08

CPC classification number: C23C14/5806 ,  C23C14/086 ,  C23C14/35 ,  H01B1/08

Abstract: A method is provided for manufacturing an article comprising a transparent conductive material, wherein a transparent conductive material (e.g., indium tin oxide) is deposited onto a substrate (e.g., fused silica) by physical vapor deposition, then annealed at high temperature (i.e., at least 450° C.) in a nitrogen atmosphere. The resulting article comprises a transparent conductive material that reduces the trade-off between low resistivity (or sheet resistance) and high near infrared transmission. For example, the transparent conductive material thus obtained may possess a transmission of at least 80% at 1550 nm while having a resistivity of less than or equal to about 5×10−4 Ohm-cm and a Haacke figure of merit of at least about 40×10−4Ω−1. Also provided is a method for modulating the resistivity and/or the near infrared transmission of a transparent conductive material by annealing the transparent conductive material at a high temperature under nitrogen atmosphere.

公开(公告)号：US11807571B2

公开(公告)日：2023-11-07

申请号：US17545493

申请日：2021-12-08

Applicant: CORNING INCORPORATED ,  ICFO

Inventor： Albert Carrilero ,  Prantik Mazumder ,  Valerio Pruneri

IPC: C30B29/06 ,  C03C15/00 ,  C30B29/60 ,  C30B29/18 ,  C30B11/12 ,  C01B33/12

CPC classification number: C03C15/00 ,  C01B33/12 ,  C30B11/12 ,  C30B29/06 ,  C30B29/18 ,  C30B29/60 ,  C30B29/602 ,  C01P2004/13

Abstract: Provided herein are methods for forming one or more silicon nanostructures, such as silicon nanotubes, and a silica-containing glass substrate. As a result of the process used to prepare the silicon nanostructures, the silica-containing glass substrate comprises one or more nanopillars and the one or more silicon nanostructures extend from the nanopillars of the silica-containing glass substrate. The silicon nanostructures include nanotubes and optionally nanowires. A further aspect is a method for preparing silicon nanostructures on a silica-containing glass substrate. The method includes providing one or more metal nanoparticles on a silica-containing glass substrate and then performing reactive ion etching of the silica-containing glass substrate under conditions that are suitable for the formation of one or more silicon nanostructures.

公开(公告)号：US11123954B2

公开(公告)日：2021-09-21

申请号：US15921034

申请日：2018-03-14

Applicant: Corning Incorporated

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Dana Craig Bookbinder ,  Theresa Chang ,  Shiwen Liu ,  Robert George Manley ,  Prantik Mazumder

IPC: B32B7/06 ,  B32B37/26 ,  B32B17/06 ,  C03C17/22 ,  C03C23/00 ,  C03C27/06 ,  C03C27/10 ,  B32B7/02

Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.

公开(公告)号：US11092733B2

公开(公告)日：2021-08-17

申请号：US16461498

申请日：2017-11-16

Applicant: CORNING INCORPORATED

Inventor： Byung Yun Joo ,  Shenping Li ,  Prantik Mazumder ,  Wageesha Senaratne ,  Amber Leigh Tremper ,  Natesan Venkataraman

IPC: F21V8/00

Abstract: Disclosed herein are light guide plates comprising a glass substrate having an edge surface and a light emitting surface and a polymeric film comprising a plurality of microstructures disposed on the light emitting surface. At least one light source may be coupled to the edge surface of the glass substrate. The light guides disclosed herein may exhibit reduced light attenuation and/or color shift. Display and lighting devices comprising such light guide plates are further disclosed.

公开(公告)号：US20210206930A1

公开(公告)日：2021-07-08

申请号：US17056950

申请日：2019-05-23

Applicant: CORNING INCORPORATED

Inventor： Prantik Mazumder ,  Wageesha Senaratne

IPC: C08J7/02 ,  C08J7/06 ,  C08J5/12 ,  B32B17/10 ,  B29C71/00

Abstract: A method of modifying a deformable substrate that includes depositing a sessile liquid droplet on a first surface of a deformable substrate, the sessile liquid droplet forming a deformed region in the first surface of the deformable substrate, the deformed region having a recess and a perimeter rim, the recess extending toward a second surface of the deformable substrate, and the perimeter rim extending away from the second surface of the deformable substrate and curing the deformable substrate, thereby increasing an elastic modulus of the deformable substrate such that upon removal of the sessile liquid droplet, the deformed region remains in the first surface of the deformable substrate.

公开(公告)号：US20200251424A1

公开(公告)日：2020-08-06

申请号：US16744776

申请日：2020-01-16

Applicant: CORNING INCORPORATED

Inventor： Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Navaneetha Krishnan Subbaiyan

IPC: H01L23/00 ,  H01L23/15 ,  H01L23/498 ,  H01L21/48

Abstract: According to various embodiments, an article including a glass or glass-ceramic substrate having a first major surface and a second major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, the via defining a first axial portion, a third axial portion, and a second axial portion disposed between the first and third axial portions. The article further includes a helium hermetic adhesion layer disposed on the interior surface in the first and/or third axial portions and a metal connector disposed within the via, the metal connector being adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, the via has a maximum diameter, Φmax, of less than or equal to 30 μm, and the axial length, L, and the maximum diameter, Φmax, satisfy an equation: L Φ max > 20   micron 1 / 2 .