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111 条记录 (耗时 0.028 秒)

    Moisture getter for integrated circuit packages
    61.
    发明授权
    Moisture getter for integrated circuit packages 失效
    集成电路封装的吸湿剂

    公开(公告)号：US4426769A

    公开(公告)日：1984-01-24

    申请号：US292989

    申请日：1981-08-14

    申请人： Dimitry G. Grabbe

    发明人： Dimitry G. Grabbe

    IPC分类号： H01L23/26 ,  H01L21/56

    CPC分类号： H01L23/26 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16152 ,  Y10T29/4913

    摘要： A moisture getter, which is a material capable of absorbing moisture, is painted within the cap of an integrated circuit package prior to sealing. The package is then heated to the high sealing temperature necessary to provide sealing without affecting the getter material. The getter material is formed from a family of materials which is capable of withstanding the high temperature of the sealing process without degradation and which can absorb a large amount of water after exposure to sealing temperatures.

    摘要翻译： 在密封之前，将吸湿剂作为吸收水分的材料，在集成电路封装的盖内被涂覆。 然后将包装加热到提供密封所需的高密封温度，而不影响吸气剂材料。 吸气材料由能够承受密封过程的高温而不降解的材料族形成，并且在暴露于密封温度之后可以吸收大量的水。

    Socket for integrated circuit package with extended leads
    63.
    发明授权
    Socket for integrated circuit package with extended leads 失效
    带扩展引线的集成电路封装插座

    公开(公告)号：US4402561A

    公开(公告)日：1983-09-06

    申请号：US248606

    申请日：1981-03-27

    申请人： Dimitry G. Grabbe ,  Iosif Korsunsky

    发明人： Dimitry G. Grabbe ,  Iosif Korsunsky

    IPC分类号： H05K7/10 ,  H05K1/04

    CPC分类号： H05K7/1023

    摘要： A socket for connecting an integrated circuit package to a printed circuit board or the like wherein the connection between the circuit board and the semiconductor chip is as short as possible. This is accomplished by providing a straight line conductor between the integrated circuit package and the printed circuit board. In accordance with one embodiment, a contact in the form of a movable double ended sharp needle is employed to connect the lead from the package to the lead on a substrate. In order to provide the force mating the leads and the intermediate needle, external force is provided by a spring structure comprising a multi-fingered element with the tips of the fingers encapsulated in plastic or other compliant membrane separating the spring member and the leads of the package.

    摘要翻译： 用于将集成电路封装连接到印刷电路板等的插座，其中电路板和半导体芯片之间的连接尽可能短。 这通过在集成电路封装和印刷电路板之间提供直线导体来实现。 根据一个实施例，采用可移动双头锋利针形式的触点将铅封从封装连接到衬底上的引线。 为了提供与引线和中间针匹配的力，外力由包括多指元件的弹簧结构提供，其中手指的尖端封装在塑料或其它柔性膜中，分离弹簧构件和引线 包。

    Method for packaging hermetically sealed integrated circuit chips on lead frames
    64.
    发明授权
    Method for packaging hermetically sealed integrated circuit chips on lead frames 失效
    在引线框上封装密封型集成电路芯片的方法

    公开(公告)号：US4079511A

    公开(公告)日：1978-03-21

    申请号：US710043

    申请日：1976-07-30

    申请人： Dimitry G. Grabbe

    发明人： Dimitry G. Grabbe

    IPC分类号： H01L23/08 ,  H01L21/52 ,  H01L21/60 ,  H01L23/04 ,  H01L23/057 ,  H01L23/24 ,  H01L23/28 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H05K3/28

    CPC分类号： H01L23/49861 ,  H01L21/52 ,  H01L23/24 ,  H01L23/49555 ,  H01L23/49575 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/49121 ,  Y10T29/49146

    摘要： An assembly line method for fabricating hermetically sealed integrated circuit chips with externally extending terminal leads comprising the steps of securing at least one integrated circuit chip upon a spider assembly; stamping a strip of iterative lead frame assemblies from a strip of flat stock metal; encapsulating each of said lead frame assemblies with plastic in a configuration which leaves a window space in the center thereof or defined elsewhere therein, with the convergent ends of the individual conductive paths of the lead frame extending out of the plastic and into said window space, and the divergent ends of such conductive paths extending out of the plastic and away from the window space; mounting the terminal chip holding spider assembly onto the convergent ends of the conductive paths of the lead frame; inserting a first cap over the window space on one side of the encapsulating plastic; filling the window space with a sealant to completely immerse said spider bearing chip therein and having the properties of being electrically insulative and virtually completely resistant to the passage of moisture therethrough; and inserting a second cap over said window space on the other side of said encapsulating plastic to completely seal said spider bearing chip therebetween in said sealant.

    摘要翻译： 一种用于制造具有外部延伸的端子引线的密封的集成电路芯片的装配线方法，包括将至少一个集成电路芯片固定在一个蜘蛛组件上的步骤; 从平坦的金属条上冲压一条迭代的引线框架组件; 将每个所述引线框架组件以塑料封装，其形式为在其中心处留下窗口空间或者在其中别处限定，其中引线框架的各个导电路径的收敛端延伸出塑料并进入所述窗口空间， 并且这些导电路径的发散端延伸出塑料并远离窗口空间; 将所述端子芯片保持座架组件安装在所述引线框架的导电路径的会聚端上; 在密封塑料的一侧上的窗口空间上插入第一盖; 用密封剂填充窗口空间以将所述蜘蛛轴承芯片完全浸入其中，并且具有电绝缘性并且几乎完全抵抗湿气通过其的性能; 以及在所述密封塑料的另一侧的所述窗口空间上插入第二盖，以在所述密封剂中将所述蜘蛛轴承芯片完全密封。

    Electrical connector and contact
    65.
    发明授权
    Electrical connector and contact 失效
    电气连接器和触点

    公开(公告)号：US07029292B2

    公开(公告)日：2006-04-18

    申请号：US11016405

    申请日：2004-12-16

    申请人： Dimitry G. Grabbe

    发明人： Dimitry G. Grabbe

    IPC分类号： H01R12/00

    CPC分类号： H01R12/57 ,  H01R43/0256 ,  H05K3/3426 ,  H05K2201/10984 ,  H05K2203/041 ,  Y02P70/613

    摘要： Disclosed is an electrical connector having an insulative housing and conductive connector wherein conductive connector has a distal end which is angled and generally rectangular in shape with the four corners of the rectangular shape of the distal end bent to receive a fusible material. The fusible material will generally be a solder ball. Also disclosed is a product made by the process of bending the rectangular shape of the distal end of the contact so as to receive a solder ball.

    摘要翻译： 公开了一种具有绝缘壳体和导电连接器的电连接器，其中导电连接器具有成角度并且大致矩形的远端，其中远端的矩形形状的四个角弯曲以容纳可熔材料。 易熔材料通常是焊球。 还公开了通过弯曲接触件的远端的矩形形状以接收焊球的方法制造的产品。

    Tool and method for forming a multi fiber ferrule
    66.
    发明授权
    Tool and method for forming a multi fiber ferrule 失效
    用于形成多光纤套圈的工具和方法

    公开(公告)号：US06695488B2

    公开(公告)日：2004-02-24

    申请号：US09908991

    申请日：2001-07-19

    申请人： Dimitry G. Grabbe

    发明人： Dimitry G. Grabbe

    IPC分类号： G02B636

    CPC分类号： G02B6/3865 ,  G02B6/245 ,  G02B6/25 ,  G02B6/3885 ,  Y10T409/400175 ,  Y10T409/403325 ,  Y10T409/406825

    摘要： The present invention provides a multi fiber optical ferrule, a tool for forming the ferrule, and a method of making the ferrule. The multi fiber optical ferrule is formed of two ferrule halves which are either molded or cast as imprecise blanks which are machined using a broach in order to precisely cut inner surfaces thereof for receiving an array of fibers. The inner surfaces of a pair of ferrule halves are cut simultaneously in order to assure accuracy in the fiber receiving and pin receiving channels. The halves are joined together with a fiber array placed therebetween to form the ferrule.

    摘要翻译： 本发明提供一种多纤维光学套圈，用于形成套圈的工具以及制造套圈的方法。 多纤维光学套管由两个套圈半部形成，该两个套圈半成品或铸造为不精确的坯料，其使用拉刀加工，以精确地切割其内表面以接收纤维阵列。 同时切割一对套圈半部的内表面，以确保光纤接收和引脚接收通道的精度。 半部分与放置在其间的纤维阵列连接在一起形成套圈。

    Perimeter independent precision locating member
    67.
    发明授权
    Perimeter independent precision locating member 失效
    周边独立精密定位构件

    公开(公告)号：US5637919A

    公开(公告)日：1997-06-10

    申请号：US568097

    申请日：1995-12-06

    申请人： Dimitry G. Grabbe

    发明人： Dimitry G. Grabbe

    IPC分类号： H01L21/68 ,  H01L21/52 ,  H01L21/60 ,  H01L23/00 ,  H01L23/02 ,  H01L23/13 ,  H01L23/48

    CPC分类号： H01L23/564 ,  H01L21/52 ,  H01L23/13 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14

    摘要： A perimeter independent precision locating member (22) for a semiconductor chip (10) so that contact sites upon the chip will be reliably positioned relative to connection members (18), such as contacts or leads, so that the chip may be electrically engageable. The locating member (22) is disposed upon the surface of the semiconductor chip (10) at a specific position relative the contact sites within the perimeter (24) of the chip and being closely matable with a complementary portion of a housing that contains the connection members (18). The method of making the perimeter independent precision locating member (22) for a semiconductor chip (10) involves coating the chip with a layer of photocurable material, masking the material in relation to the contact sites so that the portion of the material that will become the locating member (22) is exposed, illuminating the exposed portion of the photocurable material, and stripping from the chip the uncured portion to define the locating member (22).

    摘要翻译： 用于半导体芯片（10）的周边独立精密定位构件（22），使得芯片上的接触位置将相对于诸如触点或引线的连接构件（18）可靠地定位，使得芯片可电可接合。 定位构件（22）在相对于芯片的周边（24）内的接触位置的特定位置处设置在半导体芯片（10）的表面上，并且与包含连接的壳体的互补部分紧密配合 成员（18）。 制造用于半导体芯片（10）的周边独立精密定位构件（22）的方法包括用可光固化材料层涂覆芯片，相对于接触位置掩蔽材料，使得将成为 定位构件（22）暴露，照射光固化材料的暴露部分，并从芯片剥离未固化部分以限定定位构件（22）。

    Socket for direct electrical connection to an integrated circuit chip
    68.
    发明授权
    Socket for direct electrical connection to an integrated circuit chip 失效
    用于直接电连接到集成电路芯片的插座

    公开(公告)号：US5342206A

    公开(公告)日：1994-08-30

    申请号：US92149

    申请日：1993-07-15

    申请人： Dimitry G. Grabbe ,  Iosif Korsunsky

    发明人： Dimitry G. Grabbe ,  Iosif Korsunsky

    IPC分类号： G01R31/26 ,  G01R1/04 ,  H01L21/66 ,  H01L23/32 ,  H01R33/76 ,  H05K7/10 ,  H01R23/68

    CPC分类号： H05K7/1069 ,  G01R1/0483

    摘要： The present invention is a socket for removably connecting electrical conductors directly to the bond pads of an integrated circuit chip, and includes a chip holder that locks into the socket for burn-in and other testing and then can be removed and easily handled by automated equipment in the further processing of the chip. The socket has a series of contacts that are guided into electrical engagement with the bond pads through precisely positioned openings in a ceramic plate. The ceramic plate and the chip holder are aligned by a pair of guide pins that project from a housing. A pair of latching members secure the chip holder to the housing during burn-in and testing.

    摘要翻译： 本发明是用于将电导体直接可移除地连接到集成电路芯片的接合焊盘的插座，并且包括锁定到插座中用于老化和其他测试的芯片保持器，然后可以被自动化设备移除并且容易地处理 在芯片的进一步处理中。 插座具有一系列触点，其通过陶瓷板中的精确定位的开口被引导与接合焊盘电接合。 陶瓷板和芯片保持架通过从外壳突出的一对导销对准。 一对闩锁构件在老化和测试期间将芯片保持器固定到壳体。