Abstract:
Nanoscale corundum powders are obtained by first producing an Al2O3 precursor by adding seed crystals to an aqueous solution of an aluminium compound and adding a base and then converting the Al2O3 precursor into corundum by calcination at a high temperature. Before the calcination, the salts that are present in addition to the Al2O3 precursor are separated off. The resulting product is calcined at temperatures of 700 to 975° C. and any fines that may be present are removed. The resulting corundum powders can be sintered at temperatures of ≦1200° C. to produce compacts or components of multiple layer systems.
Abstract translation:通过首先通过将晶种加入到铝化合物的水溶液中并加入碱,然后将Al 2 O 3 3 O 3前体转化成Al 2 O 3 3 N 3前体而获得纳米级刚玉粉末, 通过在高温下煅烧,将其加入到刚玉中。 在煅烧之前,分离除了Al 2 O 3 3前体之外存在的盐。 所得产物在700至975℃的温度下煅烧,并且可以存在任何可能存在的细粒。 所得到的刚玉粉末可以在<= 1200℃的温度下烧结以产生多层系统的压块或组分。
Abstract:
The invention relates to a method for microstructuring electronic components, which yields high resolutions (≦200 nm) at a good aspect ratio while being significantly less expensive than photolithographic methods. The inventive method comprises the following steps: i) a planar unhardened sol film of a nanocomposite composition according to claim 1 is produced; ii) a target substrate consisting of a bottom coat (b) and a support (c) is produced; iii) sol film material obtained in step i) is applied to the bottom coat (b) obtained in step ii) by means of a microstructured transfer embossing stamp; iv) the applied sol film material is hardened; v) the transfer embossing stamp is separated, whereby an embossed microstructure is obtained as a top coat (a). The method for producing a microstructured semiconductor material comprises the following additional steps: vi) the remaining layer of the nanocomposite sol film is plasma etched, preferably with CHF3/O2 plasma; vii) the bottom coat is plasma etched, preferably with O2 plasma; viii) the semiconductor material is etched or the semiconductor material is doped in the etched areas.
Abstract translation:本发明涉及一种用于微结构化电子部件的方法,其以良好的纵横比产生高分辨率(<= 200nm),同时显着地低于光刻方法。 本发明的方法包括以下步骤:i)制备根据权利要求1的纳米复合组合物的平面未硬化溶胶膜; ii)制备由底涂层(b)和载体(c)组成的靶基材; iii)在步骤i)中获得的溶胶膜材料通过微结构转印压花印刷施加到在步骤ii)中获得的底涂层(b) iv)涂覆的溶胶膜材料硬化; v)分离转印压花印模,由此获得作为顶涂层(a)的压花微结构。 制造微结构化半导体材料的方法包括以下附加步骤:vi)纳米复合溶胶膜的剩余层被等离子体蚀刻,优选地具有CHF 3 O 2 / O 2等离子体 ; vii)底涂层被等离子体蚀刻,优选为O 2等离子体; viii)蚀刻半导体材料或者在蚀刻区域中掺杂半导体材料。
Abstract:
Substrates with a biofilm-inhibiting coating comprising an inorganic condensate modified with organic groups, at least some of the organic groups of the condensate containing fluorine atoms and the coating comprising copper colloids or silver colloids.
Abstract:
Magnetic particles are prepared containing a magnetic core coated with a glass layer having a substantially pore-free class surface or having pores with a diameter offices than 10 nm. The particles are used for separating biological material such as nucleic acids. A preferred process of preparing the particles is by forming a mixture of magnetic cores with a sol formed from an alcohol and a metal alkoxide, spray-drying the mixture to coat the cores with a layer of gelled sol, and heating the coated cores to obtain the magnetic glass particles. Preferably, the particles have an average particle size of less than 100 μm. The magnetic core may be a composite material containing a mica core and magnetite particles immobilized on the mica core, and the glass layer may contain boron oxide. Magnetic core materials include magnetite (Fe3O4) and Fe2O3.
Abstract:
A substrate has an abrasion-resistant diffusion barrier layer system having: a hard base layer including a coating composition based on a polymer containing reactive surface groups; and a nanostructured topcoat obtained by applying a nanoscale composition comprising sol particles and/or particulate solids to the basecoat and then curing it. The system features good abrasion resistance and diffusion barrier effect, and is particularly suitable as a protective coat for plastic substrates.
Abstract:
Described is the use of nanoscale metal oxide particles as catalysts for the thermal and/or photochemical polymerization of species having at least one polymerizable carbon-carbon multiple bond and/or at least one carbon containing ring capable of undergoing a ring opening polymerization.
Abstract:
A lighting system, which may be used, for example, as an airport lighting system, as a street lighting system, as an obstruction warning light, as an illuminated sign, as a warning light, or as a signal light or the like. The lighting system includes a device for monitoring and controlling its light sources or groups of light sources. The light sources have at least one respective lighting unit, with which a transceiver device is associated. The transceiver device includes a microcontroller and is, via a power supply line and a router, connected to a central station. The central station includes a transceiver part and a control computer and supplies the transceiver device with control commands. To ensure that larger lighting systems can be safely operated with a comparatively low expenditure, the microcontrollers of each lighting unit are components of a decentralized control device. The decentralized control device includes application-specific components, such as switching components, monitoring components, and adjustment components. Therein, the larger lighting systems include a plurality of light sources that are to be controlled and regulated on an individual basis. The transceiver device is structured as a module part disposed on a sickle-shaped printed circuit board and disposed next to the lighting unit.
Abstract:
The wet film thickness during spraying of the coating composition onto the substrate is preferably adjusted such that it is greater by a factor of at least 8 than the target dry film thickness.
Abstract:
Described are nanostructured molded articles and layers which are produced by a wet chemical process comprising the following steps: a) provision of a free-flowing composition containing solid nanoscaled inorganic particles having polymerizable and/or polycondensable organic surface groups; b) introduction of said composition of step a) into a mold; or b2) application of said composition of step a) onto a substrate; and c) polymerization and/or polycondensation of the surface groups of said solid particles with formation of a cured molded article or a cured layer.
Abstract:
A process is disclosed for the production of compounds based on hydrolyzable silanes containing epoxy groups. The process involves adding one of the following substances to a pre-hydrolyzed silicon compound A with at least one hydrolytically non-separable group which includes an epoxy ring: i) a particulate substance B which can be selected from oxides, oxyhydrates, nitrides or carbides of Si, Al and B, and of transition metals, the particle size being 1-100 nm; ii) a surface-active agent, preferably non-ionic; iii) an aromatic polyol with an average molecular weight not exceeding 1000. The compounds obtained through this process can be used to produce coatings and molded bodies with a range of properties, in particular high scratch resistance, lasting hydrophilic characteristics, corrosion resistance, good adhesion and transparency.