Nanoimprint resist
    62.
    发明申请
    Nanoimprint resist 有权
    纳米抗蚀剂

    公开(公告)号:US20050224452A1

    公开(公告)日:2005-10-13

    申请号:US10511402

    申请日:2003-04-09

    Abstract: The invention relates to a method for microstructuring electronic components, which yields high resolutions (≦200 nm) at a good aspect ratio while being significantly less expensive than photolithographic methods. The inventive method comprises the following steps: i) a planar unhardened sol film of a nanocomposite composition according to claim 1 is produced; ii) a target substrate consisting of a bottom coat (b) and a support (c) is produced; iii) sol film material obtained in step i) is applied to the bottom coat (b) obtained in step ii) by means of a microstructured transfer embossing stamp; iv) the applied sol film material is hardened; v) the transfer embossing stamp is separated, whereby an embossed microstructure is obtained as a top coat (a). The method for producing a microstructured semiconductor material comprises the following additional steps: vi) the remaining layer of the nanocomposite sol film is plasma etched, preferably with CHF3/O2 plasma; vii) the bottom coat is plasma etched, preferably with O2 plasma; viii) the semiconductor material is etched or the semiconductor material is doped in the etched areas.

    Abstract translation: 本发明涉及一种用于微结构化电子部件的方法,其以良好的纵横比产生高分辨率(<= 200nm),同时显着地低于光刻方法。 本发明的方法包括以下步骤:i)制备根据权利要求1的纳米复合组合物的平面未硬化溶胶膜; ii)制备由底涂层(b)和载体(c)组成的靶基材; iii)在步骤i)中获得的溶胶膜材料通过微结构转印压花印刷施加到在步骤ii)中获得的底涂层(b) iv)涂覆的溶胶膜材料硬化; v)分离转印压花印模,由此获得作为顶涂层(a)的压花微结构。 制造微结构化半导体材料的方法包括以下附加步骤:vi)纳米复合溶胶膜的剩余层被等离子体蚀刻,优选地具有CHF 3 O 2 / O 2等离子体 ; vii)底涂层被等离子体蚀刻,优选为O 2等离子体; viii)蚀刻半导体材料或者在蚀刻区域中掺杂半导体材料。

    Multi-purpose lighting system for airports, roads or the like
    67.
    发明授权
    Multi-purpose lighting system for airports, roads or the like 失效
    用于机场,道路等的多功能照明系统

    公开(公告)号:US06489733B1

    公开(公告)日:2002-12-03

    申请号:US09693886

    申请日:2000-10-23

    CPC classification number: H05B37/0254 B64F1/18 B64F1/205 H05B37/02

    Abstract: A lighting system, which may be used, for example, as an airport lighting system, as a street lighting system, as an obstruction warning light, as an illuminated sign, as a warning light, or as a signal light or the like. The lighting system includes a device for monitoring and controlling its light sources or groups of light sources. The light sources have at least one respective lighting unit, with which a transceiver device is associated. The transceiver device includes a microcontroller and is, via a power supply line and a router, connected to a central station. The central station includes a transceiver part and a control computer and supplies the transceiver device with control commands. To ensure that larger lighting systems can be safely operated with a comparatively low expenditure, the microcontrollers of each lighting unit are components of a decentralized control device. The decentralized control device includes application-specific components, such as switching components, monitoring components, and adjustment components. Therein, the larger lighting systems include a plurality of light sources that are to be controlled and regulated on an individual basis. The transceiver device is structured as a module part disposed on a sickle-shaped printed circuit board and disposed next to the lighting unit.

    Abstract translation: 照明系统可以例如作为机场照明系统,作为街道照明系统,作为障碍物警告灯,照明标志,警告灯或信号灯等使用。 照明系统包括用于监测和控制其光源或光源组的装置。 光源具有至少一个相应的照明单元,与收发器设备相关联的照明单元。 收发器设备包括微控制器,并且经由电源线和路由器连接到中心站。 中心站包括收发器部分和控制计算机,并向收发器装置提供控制命令。 为了确保更大的照明系统可以以相对较低的开支安全运行,每个照明单元的微控制器都是分散式控制装置的组件。 分散控制装置包括特定于应用的组件,例如开关组件,监控组件和调整组件。 其中,较大的照明系统包括将被单独控制和调节的多个光源。 收发器装置被构造为设置在镰刀形印刷电路板上并设置在照明单元旁边的模块部分。

    Process for the production of compounds based on silanes containing epoxy groups
    70.
    发明授权
    Process for the production of compounds based on silanes containing epoxy groups 有权
    用于生产基于含有环氧基硅烷的化合物的方法

    公开(公告)号:US06228921B1

    公开(公告)日:2001-05-08

    申请号:US09429302

    申请日:1999-10-28

    Abstract: A process is disclosed for the production of compounds based on hydrolyzable silanes containing epoxy groups. The process involves adding one of the following substances to a pre-hydrolyzed silicon compound A with at least one hydrolytically non-separable group which includes an epoxy ring: i) a particulate substance B which can be selected from oxides, oxyhydrates, nitrides or carbides of Si, Al and B, and of transition metals, the particle size being 1-100 nm; ii) a surface-active agent, preferably non-ionic; iii) an aromatic polyol with an average molecular weight not exceeding 1000. The compounds obtained through this process can be used to produce coatings and molded bodies with a range of properties, in particular high scratch resistance, lasting hydrophilic characteristics, corrosion resistance, good adhesion and transparency.

    Abstract translation: 公开了用于生产基于含有环氧基的可水解硅烷的化合物的方法。 该方法包括将以下物质之一加入到具有至少一个包含环氧环的水解不可分离基团的预水解硅化合物A中:i)可以选自氧化物,氧化合物,氮化物或碳化物的颗粒物质B 的Si,Al和B以及过渡金属,粒度为1-100nm; ii)表面活性剂,优选非离子型; iii)平均分子量不超过1000的芳族多元醇。化合物 通过该方法获得的涂料和成型体可用于生产具有一系列性能,特别是高耐刮擦性,持久的亲水性,耐腐蚀性,良好的粘合性和透明性的涂料和成型体。

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