公开(公告)号：US07049684B2

公开(公告)日：2006-05-23

申请号：US10697180

申请日：2003-10-29

申请人： Masanori Minamio ,  Hiroshi Horiki ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Hiroshi Horiki ,  Toshiyuki Fukuda

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A resin-encapsulated semiconductor device includes a semiconductor chip, a plurality of inner leads that are connected to a group of electrodes of the semiconductor chip, respectively, and an encapsulating resin that encapsulates a connection part located between the semiconductor chip and the inner leads. Each of the inner leads includes a protruded portion provided on a surface thereof on an outer side relative to the periphery of the semiconductor chip. The protruded portion protrudes in a thickness direction and is provided with a step portion formed in its side portion. The group of electrodes of the semiconductor chip is connected to surfaces of inner portions of the inner leads located on an inner side relative to their protruded portions, through electroconductive bumps, respectively. The encapsulating resin encapsulates the semiconductor chip and the electroconductive bumps and is formed to expose surfaces of the protruded portions. The surfaces of the protruded portions that function as external terminals can be reduced in size and thereby the pitch between the external terminals can be reduced.

摘要翻译： 树脂封装的半导体器件包括半导体芯片，分别连接到半导体芯片的一组电极的多个内部引线以及封装位于半导体芯片和内部引线之间的连接部分的封装树脂。 每个内引线包括在其相对于半导体芯片的周边的外侧的表面上设置的突出部分。 突出部在厚度方向上突出，并且在其侧部形成有台阶部。 半导体芯片的电极组通过导电凸块分别连接到位于内侧的内部引线的相对于它们的突出部分的内部的表面。 封装树脂封装半导体芯片和导电凸块，并形成为露出突出部分的表面。 作为外部端子的突出部分的表面的尺寸可以减小，从而可以减小外部端子之间的间距。

公开(公告)号：US20050253211A1

公开(公告)日：2005-11-17

申请号：US11102736

申请日：2005-04-11

申请人： Masanori Minamio ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Toshiyuki Fukuda

IPC分类号： H01L27/14 ,  H01L23/02 ,  H01L27/00 ,  H01L27/146

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  Y10T29/49172 ,  H01L2924/00014

摘要： An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an internal terminal portion, an external terminal portion, and a midpoint terminal portion. A pad electrode of the optical element chip is connected to the internal terminal portion through a bump, and a pad electrode of the integrated circuit chip is connected to the midpoint terminal portion through a fine metal wire.

摘要翻译： 光学装置包括基座，附接到基座的光学元件芯片，附接到光学元件芯片的背面上的集成电路芯片以及透光构件（窗口构件）。 电线埋设在基座内，电线具有内部端子部分，外部端子部分和中点端子部分。 光学元件芯片的焊盘电极通过凸块连接到内部端子部分，并且集成电路芯片的焊盘电极通过细金属线连接到中点端子部分。

公开(公告)号：US20050001145A1

公开(公告)日：2005-01-06

申请号：US10877927

申请日：2004-06-25

申请人： Masanori Minamio ,  Tetsushi Nishio ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tetsushi Nishio ,  Toshiyuki Fukuda

IPC分类号： H01L27/14 ,  H01L23/00 ,  H01L23/02 ,  H01L23/04 ,  H01L23/08 ,  H01L27/00 ,  H01L27/146 ,  H01L31/00 ,  H04N3/14 ,  H04N5/335

CPC分类号： H01L27/14601 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A solid-state imaging device includes: a housing having a base and a rectangular-frame-shaped rib that are resin molded integrally; metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal space, an external terminal portion exposed on a bottom face, and a side electrode portion exposed on an external side face; an imaging element fixed on the base; connection members connecting electrodes of the imaging element and the internal terminal portions of the metal lead pieces, respectively; and a transparent plate fixed on an upper end face of the rib. A thickness of each metal lead piece at a position of its internal terminal portion is substantially equal to a thickness of the base, and the external terminal portion is formed with a reverse face of the metal lead piece at a position corresponding to the internal terminal portion. In the resin molding, the internal terminal portion is pressed against the upper mold, whereby the occurrence of resin burrs is suppressed.

公开(公告)号：US06720207B2

公开(公告)日：2004-04-13

申请号：US09971731

申请日：2001-10-09

申请人： Masanori Minamio ,  Fumihiko Kawai ,  Masahiko Ohiro ,  Masanori Koichi ,  Yoshinori Satoh ,  Akira Oga ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Fumihiko Kawai ,  Masahiko Ohiro ,  Masanori Koichi ,  Yoshinori Satoh ,  Akira Oga ,  Toshiyuki Fukuda

IPC分类号： H01L2150

CPC分类号： H01L21/568 ,  H01L21/4821 ,  H01L21/4828 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68318 ,  H01L2224/29007 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/01083 ,  H01L2924/00

摘要： A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).

公开(公告)号：US06680220B2

公开(公告)日：2004-01-20

申请号：US10152725

申请日：2002-05-23

申请人： Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Toshiyuki Fukuda ,  Toru Nomura

发明人： Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Toshiyuki Fukuda ,  Toru Nomura

IPC分类号： H01L2144

CPC分类号： H01L21/561 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device includes: a wiring substrate; a wiring electrode; a semiconductor chip; a connecting member; a resin encapsulant; and a mark member. The wiring electrode is formed on the wiring substrate. The semiconductor chip is mounted on the wiring substrate. An electrode pad formed on the semiconductor chip and the wiring electrode are electrically connected to each other with the connecting member. The semiconductor chip, the wiring electrode, and the connecting member, for example, are molded with the resin encapsulant on the upper surface of the wiring substrate. The mark member is embedded in the upper surface of the resin encapsulant. The mark member, which is transferred from a transfer sheet in a single process step, is highly visible and can be formed efficiently.

摘要翻译： 半导体器件包括：布线基板; 布线电极; 半导体芯片; 连接构件; 树脂密封剂; 和标记成员。 布线电极形成在布线基板上。 半导体芯片安装在布线基板上。 形成在半导体芯片上的电极焊盘和布线电极通过连接部件彼此电连接。 例如，半导体芯片，布线电极和连接部件用树脂密封剂模制在布线基板的上表面上。 标记构件嵌入树脂密封剂的上表面。 在单个工艺步骤中从转印纸转印的标记部件是高度可见的并且可以有效地形成。

公开(公告)号：US20140299982A1

公开(公告)日：2014-10-09

申请号：US13982720

申请日：2012-12-10

申请人： Masanori Minamio ,  Zyunya Tanaka

发明人： Masanori Minamio ,  Zyunya Tanaka

IPC分类号： H01L23/02 ,  H01L23/00 ,  H01L23/495 ,  H01L23/36

CPC分类号： H01L23/02 ,  H01L23/053 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/495 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/66 ,  H01L24/85 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H05K3/306 ,  H05K2201/10166 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A semiconductor device includes a package 1, a block-module 2, and a control board 3 for controlling power semiconductor elements 11a. The block-module 2 has embedded power semiconductor elements 11a and second leads 4b and first leads 4a that are drawn from the block-module 2. The package 1 has external connection terminals 6a in contact with the first leads 4a of the block-module 2. The second leads 4b are connected to the control board 3 while the first leads 4a are joined to the external connection terminals 6a.

摘要翻译： 半导体器件包括封装1，块模块2和用于控制功率半导体元件11a的控制板3。 块模块2具有从块模块2拉出的嵌入式功率半导体元件11a和第二引线4b以及第一引线4a。封装1具有与块模块2的第一引线4a接触的外部连接端子6a 第二引线4b连接到控制板3，而第一引线4a连接到外部连接端子6a。

公开(公告)号：US20130056885A1

公开(公告)日：2013-03-07

申请号：US13697886

申请日：2012-03-26

申请人： Masanori Minamio ,  Tatsuo Sasaoka

发明人： Masanori Minamio ,  Tatsuo Sasaoka

IPC分类号： H01L23/36 ,  H01L21/56

CPC分类号： H01L23/49558 ,  H01L21/565 ,  H01L21/566 ,  H01L23/29 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An encapsulated semiconductor device includes: a first conduction path formative plate (1); a second conduction path formative plate (5) joined to the first conduction path formative plate; a power element (12) bonded to the first conduction path formative plate; a heatsink (14) held by the first conduction path formative plate with an insulation sheet (13) interposed between the heatsink and the first conduction path formative plate; and an encapsulation resin (9) configured to encapsulate the first and second conduction path formative plates. A through hole (3) or a lead gap (1b) is formed in a region of the first conduction path formative plate in contact with the insulation sheet. The insulation sheet is press-fitted into the through hole or the lead gap.

摘要翻译： 封装的半导体器件包括：第一导电路径形成板（1）; 连接到第一传导路径形成板的第二传导路径形成板（5） 功率元件（12），其接合到所述第一传导路径形成板; 由所述第一导电路径形成板保持的散热片（14），其间插入在所述散热器和所述第一导电路径形成板之间的绝缘片（13） 以及被配置为封装所述第一和第二导电路径形成板的封装树脂（9）。 在与绝缘片接触的第一传导路径形成板的区域中形成有通孔（3）或引线间隙（1b）。 绝缘片被压配合到通孔或引线间隙中。

公开(公告)号：US20120038033A1

公开(公告)日：2012-02-16

申请号：US13285896

申请日：2011-10-31

申请人： Akira OGA ,  Yoshihiro Tomita ,  Masanori Minamio

发明人： Akira OGA ,  Yoshihiro Tomita ,  Masanori Minamio

IPC分类号： H01L23/495

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45147 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/206

摘要： A semiconductor device includes a first semiconductor chip 1, a second semiconductor chip 4, a first lead frame 3 including a first die pad 9 on which the first semiconductor chip 1 is mounted, and a second lead frame 5 including a second die pad 11 on which the second semiconductor chip 4 is mounted. A sealing structure 6 covers the first semiconductor chip 1 and the second semiconductor chip 4. A noise shield 7 is disposed between the first semiconductor chip 1 and the second semiconductor chip 4.

摘要翻译： 半导体器件包括第一半导体芯片1，第二半导体芯片4，第一引线框架3，第一引线框架3和第二引线框架3，第一引线框架3包括安装有第一半导体芯片1的第一管芯焊盘9和第二引线框架5， 第二半导体芯片4被安装。 密封结构6覆盖第一半导体芯片1和第二半导体芯片4.噪声屏蔽7设置在第一半导体芯片1和第二半导体芯片4之间。

公开(公告)号：US07939901B2

公开(公告)日：2011-05-10

申请号：US12203429

申请日：2008-09-03

申请人： Masanori Minamio ,  Hiroyuki Ishida ,  Noriyuki Yoshikawa

发明人： Masanori Minamio ,  Hiroyuki Ishida ,  Noriyuki Yoshikawa

IPC分类号： H01L31/02

CPC分类号： H01L24/97 ,  B29C45/14418 ,  B29C45/14655 ,  B29C2045/14663 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83

摘要： An optical element mounted on a wiring board is sealed by a sealing resin except an optical function region. Wires connecting the wiring board with the optical element are also sealed by the sealing resin. The optical function region is exposed as a bottom surface of a recess whose side surface is formed by the sealing resin. A boundary portion between the side surface of the recess and a top surface portion and a boundary portion between the side surface and bottom surface of the recess have a rounded shape.

摘要翻译： 安装在布线板上的光学元件由光学功能区域以外的密封树脂密封。 将布线板与光学元件连接的电线也由密封树脂密封。 光学功能区域作为其侧表面由密封树脂形成的凹部的底表面露出。 凹部的侧表面与顶表面部分之间的边界部分和凹部的侧表面和底表面之间的边界部分具有圆形。

公开(公告)号：US07719585B2

公开(公告)日：2010-05-18

申请号：US12510562

申请日：2009-07-28

申请人： Katsutoshi Shimizu ,  Masanori Minamio ,  Kouichi Yamauchi

发明人： Katsutoshi Shimizu ,  Masanori Minamio ,  Kouichi Yamauchi

IPC分类号： H04N3/14 ,  H04N5/225 ,  H01J40/14 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L24/32 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state imaging-device includes a base, frame-shaped ribs provided on the base and forming an internal space, a plurality of wiring members for electrically leading the internal space of a housing formed by the base and the ribs to an external portion, an imaging element fixed to the base inside the internal space, a transparent plate fixed to an upper surface of the ribs, and connecting members electrically connecting electrodes of the imaging element to the wiring members, wherein a plurality of protrusions are provided in a region of the base that faces the imaging element, and the imaging element is fixed by adhesive to the base while being supported by the protrusions. The protrusions enable the imaging element to avoid distortion caused by following the surface of the base, thereby suppressing the effect on electrical properties of the imaging element.

摘要翻译： 固态成像装置包括基部，设置在基部上并形成内部空间的框状肋，多个布线构件，用于将由基部和肋形成的壳体的内部空间电引导到外部部分 ，固定在内部空间内的基座的成像元件，固定到肋的上表面的透明板，以及将成像元件的电极电连接到布线构件的连接构件，其中在区域中设置多个突起 面向成像元件的基部，并且成像元件通过粘合剂固定到基部，同时由突起支撑。 突起使得成像元件能够避免由于跟随基底的表面引起的变形，从而抑制对成像元件的电性能的影响。