公开(公告)号：US09752662B2

公开(公告)日：2017-09-05

申请号：US14886129

申请日：2015-10-19

申请人： Takehiro Takano ,  Seiji Sato

发明人： Takehiro Takano ,  Seiji Sato

IPC分类号： F16H7/12 ,  F16C33/58 ,  F16C33/78 ,  F16C35/063 ,  F16C13/00 ,  F16H7/20 ,  F16H7/08 ,  F16C19/06

CPC分类号： F16H7/1281 ,  F16C13/006 ,  F16C19/06 ,  F16C33/586 ,  F16C33/7889 ,  F16C33/805 ,  F16C35/063 ,  F16C2226/60 ,  F16C2361/63 ,  F16H7/12 ,  F16H7/20 ,  F16H2007/0865 ,  F16H2007/0893

摘要： A tensioner assembly includes a pulley arm pivotable about a pivot shaft, and a tension pulley mounted on the pulley arm at its end remote from the pivot shaft and pressed against a belt to keep the tension of the belt. The tension pulley is rotatably mounted around a base portion of the pulley arm through a rolling bearing with the inner surface and axial rear end surface of the bearing inner race in contact with the outer peripheral surface of the base portion and an end surface of a shoulder of the base portion, respectively. The base portion has an axial through hole formed with an internal thread on its inner surface. A support bolt is threaded into the through hole from the axial front end to press the rolling bearing against the end surface of the shoulder. The internal thread has an axial front end located in the vicinity of, or axially rearwardly of, the end surface of the shoulder.

公开(公告)号：US09334875B2

公开(公告)日：2016-05-10

申请号：US13806003

申请日：2011-10-20

申请人： Seiji Sato ,  Tsuyoshi Eguchi ,  Atusi Suzuki

发明人： Seiji Sato ,  Tsuyoshi Eguchi ,  Atusi Suzuki

IPC分类号： F04D29/44 ,  F04D29/42 ,  F04D29/40 ,  F04D29/66 ,  F28F13/12 ,  F24F1/00 ,  F24F13/24

CPC分类号： F04D29/4226 ,  F04D29/403 ,  F04D29/4233 ,  F04D29/441 ,  F04D29/661 ,  F05D2250/52 ,  F05D2260/96 ,  F24F1/0022 ,  F24F13/24 ,  F28F13/12

摘要： Provided are a low-noise, high-performance multiblade centrifugal fan that suppresses interference between rotational flows generated within extension sections that are extended in a rotation-axis direction at upper and lower end surfaces of a scroll casing, and an air conditioner equipped with the same. In a multiblade centrifugal fan having an impeller disposed in a rotatable manner about a rotation shaft within a scroll casing having a flow path whose cross section gradually increases in a rotational direction, at least one of upper and lower end surfaces of the scroll casing serves as an inclined end surface that is extended in the extending direction of the rotation shaft such that an extended height thereof gradually increases in the rotational direction from a scroll start position, and a stepped section extending in the rotational direction is provided between the inclined end surface and an inner-peripheral side surface of an extension section.

摘要翻译： 提供一种低噪声，高性能的多叶片式离心风扇，其抑制在涡旋壳体的上端面和下端面上沿旋转轴线方向延伸的延伸部内产生的旋转流之间的干涉，以及装备有 相同。 在具有可旋转地设置在涡旋壳体内的旋转轴的叶片的多叶片离心式风扇中，所述涡旋壳体的横截面在旋转方向上逐渐增大，所述涡旋壳体的上端面和下端面中的至少一方作为 倾斜端面沿着旋转轴的延伸方向延伸，使得其延伸高度从涡旋开始位置沿旋转方向逐渐增大，并且在倾斜端面和 延伸部分的内周侧表面。

公开(公告)号：US08710184B2

公开(公告)日：2014-04-29

申请号：US13388021

申请日：2010-07-29

申请人： Seiji Sato ,  Takeshi Hanada ,  Naomi Wakabayashi ,  Yutaka Masuda ,  Yuriko Harada

发明人： Seiji Sato ,  Takeshi Hanada ,  Naomi Wakabayashi ,  Yutaka Masuda ,  Yuriko Harada

IPC分类号： A61K38/16 ,  A61P1/04 ,  A61P1/00 ,  C07K14/00

CPC分类号： C07K14/63 ,  A61K38/00

摘要： The present invention aims at providing motilin-like peptide compounds that maintain the gastrointestinal motility stimulating activity of native motilin and which are adapted to have higher absorbability upon transmucosal administration. Motilin derivatives were designed and synthesized in consideration of the pathway for the degradation of motilin at a site of its transmucosal absorption and the maintenance of motilin's physiological activity and compounds characterized by substitutions for the amino acid at position 21 of native motilin have been found to show higher absorbability upon transmucosal administration and yet maintain the same activity as motilin.

摘要翻译： 本发明的目的在于提供维持天然胃动素的胃肠动力刺激活性的胃动素样肽化合物，其适于在经粘膜给药时具有较高的吸收性。 考虑到胃粘蛋白在其经粘膜吸收部位的降解途径和维持胃动素生理活性的途径，Motilin衍生物的设计和合成，已发现天然胃动素21位氨基酸的取代为特征的化合物 经粘膜给药后的吸收能力较高，但仍维持与胃动素相同的活性。

公开(公告)号：US08262829B2

公开(公告)日：2012-09-11

申请号：US10703111

申请日：2003-11-06

申请人： Seiji Sato ,  Hidehiko Sekizawa

发明人： Seiji Sato ,  Hidehiko Sekizawa

IPC分类号： B29C65/56 ,  B32B37/02 ,  B32B37/14 ,  B32B38/04 ,  B32B38/10 ,  C09K19/02 ,  G02B5/30 ,  C09K19/52

CPC分类号： G02B27/26 ,  H01L2924/00013 ,  Y10T156/1057 ,  Y10T156/108 ,  Y10T156/1082 ,  Y10T428/1005 ,  Y10T428/1086 ,  H01L2224/29099

摘要： An adhesive layer is formed on a substrate by printing such that the adhesive layer has a predetermined pattern. A film having a phase-difference characteristic is bonded thereon to form a divided waveplate material layer. The divided waveplate material layer is divided all at once with cutter blades disposed in a row such that the divided waveplate material layer has the predetermined pattern. Then the divided waveplate material layer remaining on portions to be removed is removed, thereby forming divided waveplates on the substrate such that the divided waveplates have the predetermined pattern.

摘要翻译： 通过印刷在基板上形成粘合剂层，使得粘合剂层具有预定图案。 将具有相位差特性的膜接合在其上以形成分隔的波片材料层。 划分的波片材料层被一次分割成一排切割刀片，使得划分的波片材料层具有预定图案。 然后除去残留在待除去部分上的划分的波片材料层，从而在基板上形成分割的波片，使得划分的波片具有预定的图案。

公开(公告)号：US08232641B2

公开(公告)日：2012-07-31

申请号：US12782054

申请日：2010-05-18

申请人： Takashi Ozawa ,  Seiji Sato

发明人： Takashi Ozawa ,  Seiji Sato

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/17 ,  H01L21/563 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/81121 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A wiring substrate includes: a semiconductor chip on which a plurality of bumps are mounted, and a plurality of connection pads which are joined to the bumps mounted on the semiconductor chip in a flip chip method, wherein the connection pads of a peripheral portion of the wiring substrate are formed in a non-solder mask defined structure, and the connection pads of a center portion of the wiring substrate are formed in a solder mask defined structure.

摘要翻译： 布线基板包括：半导体芯片，其上安装有多个凸块;以及多个连接焊盘，其以倒装芯片方法接合到安装在半导体芯片上的凸块，其中，连接焊盘的周边部分 布线基板形成为非阻焊掩模限定结构，并且布线基板的中心部分的连接焊盘形成为焊料掩模限定结构。

公开(公告)号：US20110158629A1

公开(公告)日：2011-06-30

申请号：US12963780

申请日：2010-12-09

申请人： Koji KAMIYA ,  Seiji Sato ,  Tomoyasu Katsuyama

发明人： Koji KAMIYA ,  Seiji Sato ,  Tomoyasu Katsuyama

IPC分类号： G03B35/00

CPC分类号： G03B35/08 ,  H04N13/239 ,  H04N13/246 ,  H04N13/296

摘要： An adapter for controlling a first camera and a second camera, which exhibit differing operating characteristics, in a three-dimension (3D) camera imaging system. The adapter provides a camera control signal to the first camera to control operation of the first camera. The adapter converts the camera control signal to a second camera control signal utilizing information from the first and the second cameras indicative of imaging states of the cameras, and provides the second camera control signal to the second camera to control operation of the second camera. The conversion compensates for the differing operating characteristics of the first and second cameras.

摘要翻译： 一种用于在三维（3D）照相机成像系统中控制呈现不同操作特性的第一相机和第二相机的适配器。 适配器向第一相机提供相机控制信号以控制第一相机的操作。 适配器利用来自第一和第二摄像机的指示摄像机的成像状态的信息将相机控制信号转换成第二摄像机控制信号，并且向第二摄像机提供第二摄像机控制信号以控制第二摄像机的操作。 该转换补偿了第一和第二相机的不同操作特性。

公开(公告)号：US07901997B2

公开(公告)日：2011-03-08

申请号：US12021664

申请日：2008-01-29

申请人： Takashi Ozawa ,  Seiji Sato ,  Masao Nakazawa ,  Mitsuyoshi Imai ,  Masatoshi Nakamura ,  Kei Imafuji

发明人： Takashi Ozawa ,  Seiji Sato ,  Masao Nakazawa ,  Mitsuyoshi Imai ,  Masatoshi Nakamura ,  Kei Imafuji

IPC分类号： H01L21/00

CPC分类号： H01L24/32 ,  H01L21/4853 ,  H01L21/563 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1146 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81026 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83051 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/10674 ,  H05K2203/043 ,  H05K2203/0475 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A solder 14 is formed, by a plating method, on a connecting surface 21A and a side surface 21B in a connecting pad 21 of a wiring board 11 which is opposed to a metal bump 13 formed on an electrode pad 31 of a semiconductor chip 12, and subsequently, the solder 14 is molten to form an accumulated solder 15 taking a convex shape on the connecting surface 21A of the connecting pad 21 and the metal bump 13 is then mounted on the connecting surface 21A of the connecting pad 21 on which the accumulated solder is formed, and the accumulated solder 15 and the metal bump 13 are thus bonded to each other.

摘要翻译： 在布线基板11的与半导体芯片12的电极焊盘31上形成的金属凸块13相对的连接焊盘21的连接面21A和侧面21B上，通过电镀法形成焊锡14 随后，焊料14熔化，形成在连接焊盘21的连接面21A上呈凸形的积聚焊料15，然后将金属凸块13安装在连接焊盘21的连接面21A上， 形成积累的焊料，并且积累的焊料15和金属凸块13因此彼此结合。

公开(公告)号：US07884482B2

公开(公告)日：2011-02-08

申请号：US11957866

申请日：2007-12-17

申请人： Takashi Ozawa ,  Yasushi Araki ,  Masatoshi Nakamura ,  Seiji Sato

发明人： Takashi Ozawa ,  Yasushi Araki ,  Masatoshi Nakamura ,  Seiji Sato

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H05K1/111 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/10175 ,  H01L2224/814 ,  H01L2924/00014 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： It is a flip-chip mounting substrate according to the invention has a wiring pattern in which bonding pads and predetermined parts of lead wires continuously extending from the bonding pads are exposed from an insulating layer or a solder resist. In the flip-chip mounting substrate, exposed parts of the wiring pattern are formed in to a plurality of different shapes. The exposed parts are formed so that the areas of the bonding pads are substantially equal to one another, and that the total areas of predetermined parts of the lead wires continuously extending from the bonding pads are substantially equal to one another.

摘要翻译： 根据本发明的倒装芯片安装基板具有布线图案，其中从焊盘连续延伸的焊盘和引线的预定部分从绝缘层或阻焊剂露出。 在倒装芯片安装基板中，布线图案的露出部分形成为多种不同的形状。 露出的部分形成为使得接合焊盘的面积基本上彼此相等，并且从接合焊盘连续延伸的引线的预定部分的总面积基本相等。

公开(公告)号：US07847417B2

公开(公告)日：2010-12-07

申请号：US11613753

申请日：2006-12-20

申请人： Yasushi Araki ,  Seiji Sato ,  Masatoshi Nakamura ,  Takashi Ozawa

发明人： Yasushi Araki ,  Seiji Sato ,  Masatoshi Nakamura ,  Takashi Ozawa

IPC分类号： H01L23/02

CPC分类号： H05K3/3452 ,  H01L21/563 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/02 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/10175 ,  H01L2224/11 ,  H01L2224/1132 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00014

摘要： A solder resist and a central pad to which a central Au bump provided on a semiconductor chip is flip-chip bonded are formed on a substrate main body. In a flip-chip mounting substrate where an underfill resin is provided after the semiconductor chip is mounted, a central opening portion for exposing the central pad is formed in the solder resist, and also, an edge portion forming the central opening portion of the solder resist is partially overlapped with the outer peripheral portion of the central pad.

摘要翻译： 在衬底主体上形成阻焊剂和设置在半导体芯片上的中心Au凸块倒装芯片接合的中心焊盘。 在安装半导体芯片之后设置底部填充树脂的倒装芯片安装基板中，在阻焊层中形成用于暴露中心焊盘的中心开口部分，并且还形成形成焊料的中心开口部分的边缘部分 抗蚀剂部分地与中心焊盘的外周部分重叠。

公开(公告)号：US20100295174A1

公开(公告)日：2010-11-25

申请号：US12782054

申请日：2010-05-18

申请人： Takashi Ozawa ,  Seiji Sato

发明人： Takashi Ozawa ,  Seiji Sato

IPC分类号： H01L23/485

CPC分类号： H01L24/17 ,  H01L21/563 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/81121 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A wiring substrate includes: a semiconductor chip on which a plurality of bumps are mounted, and a plurality of connection pads which are joined to the bumps mounted on the semiconductor chip in a flip chip method, wherein the connection pads of a peripheral portion of the wiring substrate are formed in a non-solder mask defined structure, and the connection pads of a center portion of the wiring substrate are formed in a solder mask defined structure.

摘要翻译： 布线基板包括：半导体芯片，其上安装有多个凸块;以及多个连接焊盘，其以倒装芯片方法接合到安装在半导体芯片上的凸块，其中，连接焊盘的周边部分 布线基板形成为非阻焊掩模限定结构，并且布线基板的中心部分的连接焊盘形成为焊料掩模限定结构。