公开(公告)号：US07267867B2

公开(公告)日：2007-09-11

申请号：US10920724

申请日：2004-08-18

Applicant: Friedrich Müller ,  Christoph Dinkelmeyer ,  Alfred Gemmel

Inventor： Friedrich Müller ,  Christoph Dinkelmeyer ,  Alfred Gemmel

IPC: A01K1/015 ,  H01B3/30

CPC classification number: C08K3/40 ,  C08K2201/014 ,  H01B3/30 ,  H01B7/295 ,  Y10T428/249921 ,  Y10T428/249924

Abstract: An insulation material based on polymeric plastic is specified, to which glass particles that consist of types of glass with different softening points are added for stabilization in case of fire. To provide protection in a very broad temperature range, at least three types of glass with different softening points are used as the glass particles, namely, a first type of glass with a softening point below about 470° C., a second type of glass with a softening point above about 470° C. and below about 620° C., and a third type of glass with a softening point above about 760° C.

Abstract translation: 规定了基于聚合物塑料的绝缘材料，添加了由不同软化点的玻璃类型组成的玻璃颗粒，用于在发生火灾时进行稳定化。 为了在非常宽的温度范围内提供保护，使用具有不同软化点的至少三种类型的玻璃作为玻璃颗粒，即软化点低于约470℃的第一类玻璃，第二类玻璃 软化点高于约470℃且低于约620℃，第三类软化点高于约760℃。

公开(公告)号：US20070158095A1

公开(公告)日：2007-07-12

申请号：US11330957

申请日：2006-01-11

Applicant: Garud Sridhar ,  Joseph Varkey

Inventor： Garud Sridhar ,  Joseph Varkey

IPC: H01B9/02

CPC classification number: H01B7/2806 ,  G01V1/201 ,  G01V1/52 ,  H01B3/30 ,  H01B7/046

Abstract: Disclosed are electric cables with improved armor wires used with wellbore devices to analyze geologic formations adjacent a wellbore. The cables include at least one insulated conductor, and one or more armor wires surrounding the insulated conductor. The armor wires include a low density core surrounded by a corrosion resistant alloy clad, where the alloy clad includes such alloys as beryllium-copper based alloys, nickel-chromium based alloys, superaustenitic stainless steel alloys, nickel-cobalt based alloys, nickel-molybdenum-chromium based alloys, and the like. The low density core may be based upon titanium or titanium alloys. The cables of the invention may be any useful electric cable design, including monocables, quadcables, heptacables, quadcables, slickline cables, multiline cables, coaxial cables, or seismic cables.

Abstract translation: 公开了具有改进的装甲线的电缆，其与井眼装置一起用于分析井眼附近的地质构造。 电缆包括至少一个绝缘导体和围绕绝缘导体的一个或多个铠装线。 铠装线包括由耐腐蚀合金包覆层围绕的低密度芯，其中合金包层包括诸如铍铜基合金，镍铬基合金，超奥氏体不锈钢合金，镍 - 钴基合金，镍 - 钼 铬基合金等。 低密度芯可以基于钛或钛合金。 本发明的电缆可以是任何有用的电缆设计，包括单面电缆，四线电缆，七口电缆，四线电缆，光滑电缆，多线缆，同轴电缆或地震电缆。

公开(公告)号：US20070031687A1

公开(公告)日：2007-02-08

申请号：US11580959

申请日：2006-10-16

Applicant: Masahiro Akiyama ,  Hisashi Nakagawa ,  Takahiko Kurosawa ,  Atsushi Shiota

Inventor： Masahiro Akiyama ,  Hisashi Nakagawa ,  Takahiko Kurosawa ,  Atsushi Shiota

IPC: B32B27/00 ,  C08L83/00 ,  C08G77/04 ,  B32B9/04

CPC classification number: C08L83/14 ,  C08G77/50 ,  C08G77/60 ,  C09D183/14 ,  H01B3/30 ,  H01L21/02126 ,  H01L21/0234 ,  H01L21/02348 ,  H01L21/02351 ,  H01L21/3121 ,  Y10T428/31663

Abstract: An insulating-film-forming composition including an organic solvent and a hydrolysis-condensation product which is obtained by hydrolysis and condensation of a component (A) in the presence of a component (B).

Abstract translation: 一种绝缘膜形成组合物，其包含通过在（B）成分的存在下水解和缩合组分（A）而获得的有机溶剂和水解缩合产物。

公开(公告)号：US20050136326A1

公开(公告)日：2005-06-23

申请号：US11053562

申请日：2005-02-08

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: B29C45/00 ,  G06K19/077 ,  H01Q1/12 ,  H01Q1/24 ,  H01Q1/32 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/00 ,  H05K1/09 ,  H05K3/10 ,  H01M2/30

CPC classification number: H01M2/30 ,  B29C45/0001 ,  B29C45/0013 ,  B29C47/0004 ,  B29K2995/0005 ,  B29K2995/0013 ,  B29L2031/3456 ,  B29L2031/3468 ,  B29L2031/36 ,  G06K19/07749 ,  H01B3/30 ,  H01B3/308 ,  H01B7/02 ,  H01B13/0036 ,  H01M2/00 ,  H01M10/6551 ,  H01Q1/1271 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T29/49108

Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 电端子由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：US20030010961A1

公开(公告)日：2003-01-16

申请号：US10194318

申请日：2002-07-15

Applicant: FUJITSU LIMITED

Inventor： Shun-Ichi Fukuyama ,  Tamotsu Owada ,  Hiroko Inoue

IPC: H01B003/24

CPC classification number: H01L21/02126 ,  H01B3/30 ,  H01B3/46 ,  H01L21/02282 ,  H01L21/02348 ,  H01L21/312 ,  H01L21/76801 ,  H05K3/4676

Abstract: A composition for the formation of an insulating film comprising a low dielectric constant polymeric material and a sublimating material, which are dissolved in a solvent. Preferred low dielectric constant polymeric materials include polyaryl ethers. Preferred sublimating materials include silicone compounds having a closed stereostructure having atoms at its vertexes, such as those known as Si-T8 and Si-T12. A method of forming a low dielectric constant insulating film and electronic parts or components using an insulating film formed thereby are also disclosed.

Abstract translation: 用于形成包含溶解在溶剂中的低介电常数聚合物材料和升华材料的绝缘膜的组合物。 优选的低介电常数聚合物材料包括聚芳基醚。 优选的升华材料包括具有在其顶点具有原子的闭合立体结构的硅氧烷化合物，例如称为Si-T8和Si-T12的那些。 还公开了使用由此形成的绝缘膜形成低介电常数绝缘膜和电子部件或组件的方法。

公开(公告)号：US06489928B2

公开(公告)日：2002-12-03

申请号：US09978745

申请日：2001-10-17

Applicant: Kiyoyasu Sakurada

Inventor： Kiyoyasu Sakurada

IPC: H01Q1906

CPC classification number: H01B3/30 ,  H01B3/12 ,  H01Q15/08 ,  H01Q15/10 ,  H01Q19/08 ,  Y10T428/24917

Abstract: Provided is a composite dielectric molded product exhibiting excellent properties such as the antenna gain and side lobe, etc. when used for a lens antenna, and exhibiting less variation of properties in one individual product and between individual products. The composite dielectric molded product is formed by molding a composite dielectric material containing a dielectric inorganic filler and an organic polymer material so that the dielectric constant anisotropy is in the range of about 1.00 to 1.05.

公开(公告)号：US06468589B2

公开(公告)日：2002-10-22

申请号：US09771970

申请日：2001-01-30

Applicant: Michinori Nishikawa ,  Takashi Okada ,  Kinji Yamada

Inventor： Michinori Nishikawa ,  Takashi Okada ,  Kinji Yamada

IPC: B05G302

CPC classification number: C08J5/18 ,  C08G65/40 ,  C08G65/4006 ,  C08G65/4012 ,  C08J2371/08 ,  C08L71/00 ,  H01B3/30 ,  H05K3/4626

Abstract: A composition for film formation comprising a polymer having repeating structural units represented by the formula (1), the structural unit having one or more alkyl groups therein, and an insulating film obtained by applying the composition for film formation to a substrate and heating the coating film.

Abstract translation: 一种成膜用组合物，其包含具有式（1）所示的重复结构单元的聚合物，其中具有一个或多个烷基的结构单元和通过将所述成膜用于基材并加热所述涂层而获得的绝缘膜 电影。

公开(公告)号：US06440642B1

公开(公告)日：2002-08-27

申请号：US09397301

申请日：1999-09-15

Applicant: James G. Shelnut ,  Wade Sonnenberg ,  James L. Aubry ,  Jennifer Patricia Canlas

Inventor： James G. Shelnut ,  Wade Sonnenberg ,  James L. Aubry ,  Jennifer Patricia Canlas

IPC: G03F7004

CPC classification number: G03F7/038 ,  H01B3/30 ,  H01B3/40 ,  H05K3/4661 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  Y10S428/901 ,  Y10T428/31504

Abstract: Low VOC, dielectric compositions suitable for use in circuit board manufacture are disclosed. Also disclosed are methods of making circuit boards using the low VOC, dielectric compositions.

Abstract translation: 公开了适用于电路板制造的低VOC介电组合物。 还公开了制造使用低VOC电介质组合物的电路板的方法。

公开(公告)号：US20020076535A1

公开(公告)日：2002-06-20

申请号：US09892608

申请日：2001-06-28

Applicant: FUJITSU LIMITED

Inventor： Nawalage Florence Cooray

IPC: B32B015/08

CPC classification number: H01L23/49894 ,  H01B3/30 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/4647 ,  H05K3/4676 ,  H05K2201/015 ,  Y10T428/24917 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A dielectric film is obtained by heat curing a thermally curable fluorinated o-aminophenol polymer or oligomer based on an o-aminophenol compound and an aromatic dicarboxylic acid compound, at least one of which is mono- or poly-fluorinated, and having thermosetting groups at both ends that undergo cross-linking reaction upon thermal treatment. The dielectric film is employed in multilayer circuit boards.

Abstract translation: 通过基于邻氨基苯酚化合物和芳族二羧酸化合物热固化可热固化的氟化邻氨基苯酚聚合物或低聚物获得电介质膜，其中至少一种是单氟化或聚氟化，并且具有热固性基团 两端在热处理时进行交联反应。 电介质膜用于多层电路板。

公开(公告)号：US20020004537A1

公开(公告)日：2002-01-10

申请号：US09073863

申请日：1998-05-07

Inventor： VADIM V. KRONGAUZ ,  CHAU T.M. HA ,  SANGEETA RAMPURIA

IPC: C08J003/28

CPC classification number: H01B3/30 ,  C08F290/147 ,  C09D4/06 ,  C09J4/06 ,  G11B7/26 ,  C08F290/067 ,  C08F290/08 ,  C08F290/14

Abstract: A UV-curable acrylate-thiol-ene insulating coating composition for electrical conductors, a method of manufacturing a UV-curable acrylate-thiol-ene insulating coating composition for electrical conductors. The insulating coating being of about 2.5 nullm to about 500 nullm thickness, which cured coating has a dielectric dissipation factor (60Hz, 24null C.) of lower than about 0.05.

Abstract translation: 用于电导体的可紫外线固化的丙烯酸酯 - 硫醇烯绝缘涂料组合物，用于制造用于导电体的可UV固化的丙烯酸酯 - 硫醇烯绝缘涂料组合物的方法。 绝缘涂层的厚度约为2.5μm至约500μm，该固化涂层的介电损耗因子（60Hz，24℃）低于约0.05。