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    Multilayer ceramic electronic component and board having the same
    66.
    发明授权
    Multilayer ceramic electronic component and board having the same 有权
    多层陶瓷电子元器件和板有相同的

    公开(公告)号：US09491847B2

    公开(公告)日：2016-11-08

    申请号：US14921867

    申请日：2015-10-23

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sang Soo Park ,  Byoung Hwa Lee ,  Young Ghyu Ahn ,  Heung Kil Park ,  Hyun Sub Oh

    IPC: H01G4/224 ,  H05K1/02 ,  H01G4/12 ,  H01G4/236 ,  H01G4/30 ,  H05K1/18 ,  H05K1/03

    CPC classification number: H05K1/0213 ,  H01G2/04 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/232 ,  H01G4/236 ,  H01G4/30 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/2045

    Abstract: A multilayer ceramic electronic component includes: a board including first and second contact terminals disposed on one surface thereof to be spaced apart from each other and first and second external terminals disposed on the other surface thereof to be spaced apart from each other; a multilayer ceramic capacitor including first and second external electrodes including first and second connection portions disposed on opposite end surfaces of a ceramic body and first and second band portions extending from the first and second connection portions to portions of one surface of the ceramic body and connected to the first and second contact terminals, respectively; a sealing part enclosing the multilayer ceramic capacitor on the board while exposing one ends of the first and second contact terminals; and first and second connection terminals connecting the ends of the first and second contact terminals to the first and second external terminals, respectively.

    Abstract translation: 多层陶瓷电子部件包括：板，其包括设置在其一个表面上的彼此间隔开的第一和第二接触端子，以及设置在另一个表面上的第一和第二外部端子彼此间隔开; 包括第一和第二外部电极的多层陶瓷电容器，所述第一和第二外部电极包括设置在陶瓷体的相对端面上的第一和第二连接部分以及从第一和第二连接部分延伸到陶瓷体的一个表面的部分的第一和第二带部分， 分别连接到第一和第二接触端子; 密封部分，其将所述多层陶瓷电容器封装在所述板上，同时暴露所述第一和第二接触端子的一端; 以及分别将第一和第二接触端子的端部连接到第一和第二外部端子的第一和第二连接端子。

    In-Vehicle Electronic Module
    67.
    发明申请
    In-Vehicle Electronic Module 有权
    车载电子模块

    公开(公告)号：US20160309600A1

    公开(公告)日：2016-10-20

    申请号：US15100852

    申请日：2014-11-17

    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.

    Inventor： Ryouichi KAJIWARA ,  Masaru KAMOSHIDA ,  Toshiaki ISHII

    IPC: H05K5/00 ,  H05K3/28 ,  B23K1/00 ,  B23K35/26 ,  B23K1/08 ,  H05K1/11 ,  H05K3/34

    CPC classification number: H05K5/0069 ,  B23K1/0016 ,  B23K1/08 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/226 ,  B23K35/26 ,  B23K35/262 ,  H05K1/117 ,  H05K3/282 ,  H05K3/3405 ,  H05K3/3463 ,  H05K5/003 ,  H05K5/0034 ,  H05K2201/015 ,  H05K2201/10189 ,  H05K2201/2045 ,  H05K2203/122

    Abstract: There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.

    Abstract translation: 存在如下问题：当包括非贵金属构件的连接端子的接触连接部分暴露于高温环境时，由于在接触界面上形成氧化膜或由微滑动引起的磨损粉末咬合，接触电阻增加 或重复的温度循环。 本发明的目的是提供一种车载电子模块，其具有与常规车载电子模块相当的连接可靠性，即使被放置在发动机舱的环境中并且可以通过减少数量来实现成本降低 零件和装配步骤。 该电子模块包括具有安装有电子部件的电路基板的安装板以及用于将安装基板与周围环境进行容纳保护的壳体部件。电子模块具有连接结构，电路基板的一部分为 通过壳体的开口突出到外部，并将板端子插入到外部阴连接器中以获得电连续性，并且壳体部分的一部分形成连接器壳体，该连接器壳体接收阴连接器并隔离其中板端子 存在于周围环境中，并且用于将电路板固定在壳体中的绝缘树脂构件与电路板一体地模制或接合。

    Multilayer ceramic capacitor and mounting board therefor
    68.
    发明授权
    Multilayer ceramic capacitor and mounting board therefor 有权
    多层陶瓷电容器及其安装板

    公开(公告)号：US09390853B2

    公开(公告)日：2016-07-12

    申请号：US14065271

    申请日：2013-10-28

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sang Soo Park ,  Heung Kil Park

    IPC: H01G4/228 ,  H01G4/06 ,  H01G4/005 ,  H01G4/248 ,  H01G4/01 ,  H01G2/06 ,  H01G4/30 ,  H05K1/18

    CPC classification number: H01G4/01 ,  H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: There is provided a multilayer ceramic capacitor including a ceramic body having first and second main surfaces, third and fourth end surfaces, and fifth and sixth side surfaces; a plurality of first and second internal electrodes having a dielectric layer to be alternately exposed to the third and fourth end surfaces; and first and second external electrodes formed on the end surfaces and the main surfaces and electrically connected to the first and second internal electrodes, wherein when a width of the first or second external electrode is A and a length of a margin part of the ceramic body in the length direction is B, a ratio (A/B) of the width of the first or second external electrode to the length of the margin part of the ceramic body in the length direction is 3.3 or less (A/B≦3.3).

    Abstract translation: 提供一种多层陶瓷电容器，其包括具有第一和第二主表面，第三和第四端面以及第五和第六侧表面的陶瓷体; 多个第一和第二内部电极，其具有交替地暴露于第三和第四端面的电介质层; 以及形成在所述端面和所述主表面上并与所述第一和第二内部电极电连接的第一和第二外部电极，其中当所述第一或第二外部电极的宽度为A时，所述陶瓷体的边缘部分的长度 在长度方向为B时，第一或第二外部电极的宽度与陶瓷体的边缘部分的长度方向的长度的比（A / B）为3.3以下（A / B＆NlE; 3.3） 。

    Method of manufacturing mounting substrate on which monolithic ceramic capacitors are mounted and mounting structure
    69.
    发明授权
    Method of manufacturing mounting substrate on which monolithic ceramic capacitors are mounted and mounting structure 有权
    制造安装有单片陶瓷电容器的安装基板的制造方法和安装结构

    公开(公告)号：US09338889B2

    公开(公告)日：2016-05-10

    申请号：US14050842

    申请日：2013-10-10

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo Hattori ,  Isamu Fujimoto ,  Norio Shiroiwa

    IPC: H05K1/18 ,  H05K3/30 ,  H01G4/30 ,  H05K1/11 ,  H05K3/34 ,  H01G2/06 ,  H01G4/232

    CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3415 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10545 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913

    Abstract: A method of manufacturing a mounting substrate in which a pair of monolithic ceramic capacitors each of which includes a multilayer body in which a plurality of dielectric ceramic sheets and a plurality of substantially planar inner electrodes are stacked on top of one another and at least a pair of outer electrodes electrically connected to the inner electrodes and provided on a surface of the multilayer body are mounted on a circuit board includes a process of joining the outer electrodes to lands formed on the front rear surfaces of the circuit board, the lands formed on the front surface being formed at positions that are plane-symmetrical to positions of the corresponding lands formed on the rear surface while being electrically connected to the corresponding lands formed on the rear surface, such that surface directions of planes of the inner electrodes match each other.

    Abstract translation: 一种制造安装基板的方法，其中，一对叠层陶瓷电容器包括多层体，其中多个介电陶瓷片和多个基本上平面的内电极彼此堆叠并且至少一对 电连接到内部电极并设置在多层体的表面上的外部电极安装在电路板上，包括将外部电极连接到形成在电路板的前后表面上的平台， 前表面形成在与形成在后表面上的相应焊盘的位置平面对称的位置处，同时电连接到形成在后表面上的相应焊盘，使得内电极的平面的表面方向彼此匹配。

    Electrical device, system and method for operating with reduced acoustic noise generation
    70.
    发明授权
    Electrical device, system and method for operating with reduced acoustic noise generation 有权
    电气设备，系统和方法，用于减少噪声产生

    公开(公告)号：US09337011B2

    公开(公告)日：2016-05-10

    申请号：US13646391

    申请日：2012-10-05

    Applicant: Rockwell Automation Technologies, Inc.

    Inventor： Peter Janes ,  Riazuddin R. Shaikh

    IPC: H01L21/02 ,  H01L23/051 ,  H01L23/16 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18

    CPC classification number: H01L21/02 ,  H01L23/051 ,  H01L23/16 ,  H01L24/72 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/0271 ,  H05K1/182 ,  H05K2201/10166 ,  H05K2201/2045 ,  Y10T29/41 ,  Y10T29/49002 ,  Y10T29/49169 ,  H01L2924/00

    Abstract: Disclosed herein is a device for reducing noise generated by an electrical component, the device including a stiffening component secured to an electrical component, wherein the stiffening component provides rigidity to the electrical component, thereby reducing the mechanical resonance of the electrical component during operation. The electrical component has at least one end face and a flange portion that includes a flange face that extends about a perimeter of the end face. The flange face is substantially parallel to the end face, wherein the stiffening component is secured to the flange face of the electrical component such that it does not extend into a plane of the end face. Further, the stiffening component can include a stiffening portion and a securing portion, wherein the stiffening portion is secured to the flange face of the electrical component by the securing portion. Further, the electrical component can be a power semiconductor device.

    Abstract translation: 本文公开了一种用于减少由电气部件产生的噪声的装置，该装置包括固定到电气部件的加强部件，其中加强部件为电气部件提供刚性，由此在运行期间减小电气部件的机械谐振。 电气部件具有至少一个端面和凸缘部分，该凸缘部分包括围绕端面的周边延伸的凸缘面。 凸缘面基本上平行于端面，其中加强部件固定到电气部件的凸缘面，使得其不延伸到端面的平面内。 此外，加强部件可以包括加强部分和固定部分，其中加强部分通过固定部分固定到电气部件的凸缘面。 此外，电气部件可以是功率半导体器件。

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