公开(公告)号：US08169323B2

公开(公告)日：2012-05-01

申请号：US12513398

申请日：2007-10-30

申请人： Tetsuji Ogata ,  Hideto Sakata

发明人： Tetsuji Ogata ,  Hideto Sakata

IPC分类号： G08B13/14

CPC分类号： G06K19/07745 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07783 ,  G09F3/10 ,  G09F3/16 ,  H01L2924/0002 ,  Y10T156/1082 ,  H01L2924/00

摘要： A noncontact IC tag label includes: a band-shaped label base material inclusive of a release surface formed at least at one end of the base material and releasably treated in advance, and a non-release surface; an electroconductive layer formed on the non-release surface of the band-shaped label base material and including a required antenna pattern; and an IC chip mounted on one face of the electroconductive layer. The electroconductive layer and the IC chip are shrouded by a surface protection sheet via a pressure-sensitive adhesive layer. A thermoadhesive resin layer bonded onto the non-release surface of the band-shaped label base material is provided on an opposite face of the electroconductive layer including the antenna pattern, with respect to the surface protection sheet. Also, the pressure-sensitive adhesive layer is bonded onto the non-release surface and release surface of the band-shaped label base material.

摘要翻译： 非接触IC标签标签包括：带状标签基材，包括至少在基材的一端形成并可预先处理的剥离表面和非剥离表面; 形成在带状标签基材的非释放表面上并包括所需天线图案的导电层; 以及安装在导电层一面上的IC芯片。 导电层和IC芯片通过压敏粘合剂层被表面保护片覆盖。 粘结在带状标签基材的非剥离表面上的热粘合树脂层相对于表面保护片设置在包括天线图案的导电层的相对面上。 此外，压敏粘合剂层粘合到带状标签基材的非剥离表面和剥离表面上。

公开(公告)号：US20120073743A1

公开(公告)日：2012-03-29

申请号：US13310531

申请日：2011-12-02

申请人： Maiko TANAKA ,  Michio Uruno ,  Takayuki Matsuzaki ,  Ryoji Furutani ,  Michio Mashino ,  Teiichi Inada

发明人： Maiko TANAKA ,  Michio Uruno ,  Takayuki Matsuzaki ,  Ryoji Furutani ,  Michio Mashino ,  Teiichi Inada

IPC分类号： B32B37/16 ,  B32B7/06

CPC分类号： H01L24/28 ,  C09J7/20 ,  C09J2201/28 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6839 ,  H01L2224/26175 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T156/1082 ,  Y10T156/1093 ,  Y10T428/1476 ,  Y10T428/24562 ,  Y10T428/2839 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An adhesive sheet comprising a release substrate 10, a substrate film 14, and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14, wherein an annular incision D is formed on the release substrate 10 from the surface of the first tacky-adhesive layer 12 side, the first tacky-adhesive layer 12 is laminated so as to cover the whole inner surface of the incision D in the release substrate 10, and the incision D has a depth d of less than the thickness of the release substrate 10 and 25 μm or less.

公开(公告)号：US08136220B2

公开(公告)日：2012-03-20

申请号：US11930004

申请日：2007-10-30

申请人： James Say ,  Michael F. Tomasco ,  Adam Heller ,  Yoram Gal ,  Behrad Aria ,  Ephraim Heller ,  Phillip John Plante ,  Mark S. Vreeke

发明人： James Say ,  Michael F. Tomasco ,  Adam Heller ,  Yoram Gal ,  Behrad Aria ,  Ephraim Heller ,  Phillip John Plante ,  Mark S. Vreeke

IPC分类号： G01R3/00

CPC分类号： A61B5/14735 ,  A61B5/14532 ,  A61B5/14865 ,  A61B2562/0271 ,  A61B2562/125 ,  C12Q1/001 ,  G01N27/3272 ,  G01N33/5438 ,  G01N33/54393 ,  G01N33/66 ,  Y10T29/42 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49007 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49208 ,  Y10T29/49798 ,  Y10T156/1064 ,  Y10T156/1082

摘要： A process for the manufacture of small sensors with reproducible surfaces, including electrochemical sensors. One process includes forming channels in the surface of a substrate and disposing a conductive material in the channels to form an electrode. The conductive material can also be formed on the substrate by other impact and non-impact methods. In a preferred embodiment, the method includes cutting the substrate to form a sensor having a connector portion and a transcutaneous portion, the two portions having edges that define one continuous straight line.

摘要翻译： 一种制造具有可重复表面的小型传感器的方法，包括电化学传感器。 一种方法包括在基材的表面中形成通道并在通道中设置导电材料以形成电极。 导电材料也可以通过其它冲击和非冲击方法形成在基板上。 在优选实施例中，该方法包括切割基底以形成具有连接器部分和经皮部分的传感器，该两个部分具有限定一条连续直线的边缘。

公开(公告)号：US20120055623A1

公开(公告)日：2012-03-08

申请号：US13225180

申请日：2011-09-02

申请人： Takeharu KITAGAWA ,  Takuya NAKAZONO ,  Shusaku GOTO ,  Minoru MIYATAKE ,  Tomohiro MORI ,  Takashi KAMIJO

发明人： Takeharu KITAGAWA ,  Takuya NAKAZONO ,  Shusaku GOTO ,  Minoru MIYATAKE ,  Tomohiro MORI ,  Takashi KAMIJO

IPC分类号： B32B37/14 ,  B32B38/00 ,  B32B38/04

CPC分类号： B32B37/0046 ,  B29C55/023 ,  B29C55/026 ,  B29C55/065 ,  B29K2029/04 ,  B29K2067/003 ,  B29K2995/0034 ,  B32B37/025 ,  B32B37/12 ,  B32B37/18 ,  B32B37/182 ,  B32B37/203 ,  B32B38/0004 ,  B32B38/04 ,  B32B38/10 ,  B32B38/145 ,  B32B38/18 ,  B32B2037/243 ,  B32B2038/045 ,  B32B2307/42 ,  B32B2309/72 ,  B32B2457/20 ,  B32B2457/202 ,  B32B2457/206 ,  B32B2457/208 ,  B32B2551/00 ,  G02B5/305 ,  Y10T156/1059 ,  Y10T156/1062 ,  Y10T156/1082 ,  Y10T156/12 ,  Y10T156/1322

摘要： A method of producing an optical panel assembly including the polarizing film in a continuous manner by laminating a polarizing film to a surface of a rectangular-shaped optical panel, is disclosed. The polarizing film is formed by performing a step of subjecting a laminate including a continuous web of a thermoplastic resin substrate and a PVA type resin layer formed on the substrate, to a 2-stage stretching consisting of a preliminary in-air stretching and an in-boric-acid-solution stretching, to reduce a thickness of the PVA type resin layer to 10 μm or less, and a step of causing a dichroic material to be absorbed in the PVA type resin layer.

摘要翻译： 公开了一种通过将偏振膜层压到矩形光学面板的表面上来连续地制造包括偏振膜的光学组件的方法。 偏振膜是通过以下步骤形成的：将由热塑性树脂基板的连续纤维网和形成在基材上的PVA型树脂层构成的层叠体进行2段拉伸， 硼酸溶液拉伸，将PVA类树脂层的厚度减薄到10μm以下，以及使二色性材料吸收在PVA型树脂层中的工序。

公开(公告)号：US08127514B2

公开(公告)日：2012-03-06

申请号：US12473997

申请日：2009-05-28

申请人： Jesse A. Binkley ,  Perry J. Prudhomme ,  Frank M. Bartolic ,  Louis T. Hahn ,  Daniel C. DeJarnette ,  Charles M. Reed ,  Richard Allen Chasteen, Jr. ,  John W. Haughton ,  J. Gary Falls ,  Paul G. Wilson ,  Casimir Paul Weaver

发明人： Jesse A. Binkley ,  Perry J. Prudhomme ,  Frank M. Bartolic ,  Louis T. Hahn ,  Daniel C. DeJarnette ,  Charles M. Reed ,  Richard Allen Chasteen, Jr. ,  John W. Haughton ,  J. Gary Falls ,  Paul G. Wilson ,  Casimir Paul Weaver

IPC分类号： E04D1/28

CPC分类号： B29C66/21 ,  B29C65/56 ,  B29C65/562 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/435 ,  B29C66/71 ,  B29C66/81422 ,  B29C66/81429 ,  B29C66/8242 ,  B29C66/83413 ,  B29C66/83511 ,  B29L2031/108 ,  E04D1/26 ,  E04D2001/005 ,  Y10T29/49629 ,  Y10T156/1082 ,  Y10T428/24289 ,  Y10T428/249923 ,  B29K2095/00

摘要： A multi-layered roofing shingle is described. The layers of the shingle are connected via a mechanical fastener. A method for manufacturing a multi-layered shingle is also described. The method includes aligning the layers of the shingle, and connecting the layers via at least one mechanical fastener. Further described is a multi-layered shingle having layers that are mechanically fastened by deforming one of the layers into one of the other layers.

公开(公告)号：US20120008804A1

公开(公告)日：2012-01-12

申请号：US12833639

申请日：2010-07-09

申请人： Kevin M. Bedwell ,  Lajos Frohlich

发明人： Kevin M. Bedwell ,  Lajos Frohlich

IPC分类号： H04R1/00 ,  H04R31/00

CPC分类号： H04R31/006 ,  H04R1/1016 ,  H04R11/02 ,  H04R25/00 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/4902 ,  Y10T29/4908 ,  Y10T29/49798 ,  Y10T156/1082

摘要： A transducer and method of forming a transducer is disclosed. The method comprises locating a feed wire for forming a drive pin on a reed surface, welding a first end of the feed wire to the reed, cutting the feed wire to form a drive pin, and securing the drive pin to a paddle. The first end of the feed wire can be welded to the reed by a laser welding operation. The laser melts the reed to form a molten reed material, and the feed wire is pushed through the molten reed material to form a weld between the feed wire and the reed, once the molten reed material solidifies. The wire coil is then cut with a second laser to form the drive pin. The drive pin is then adhered to a paddle with an adhesive.

摘要翻译： 公开了一种形成换能器的换能器和方法。 该方法包括将用于在簧片表面上形成驱动销的馈线定位，将馈线的第一端焊接到簧片上，切割馈线以形成驱动销，以及将驱动销固定到桨上。 馈电线的第一端可以通过激光焊接操作焊接到簧片上。 激光熔化簧片以形成熔融的簧片材料，并且一旦熔融的簧片材料固化，馈电线就被推入熔融的簧片材料，以在馈线和簧片之间形成焊缝。 然后用第二激光器切割线圈，以形成驱动销。 然后将驱动销用粘合剂粘合到桨上。

公开(公告)号：US08092886B2

公开(公告)日：2012-01-10

申请号：US12348774

申请日：2009-01-05

申请人： John J. McKillip

发明人： John J. McKillip

IPC分类号： B42D15/00 ,  B65D65/28

CPC分类号： B42D5/00 ,  B42P2241/22 ,  G09F3/0288 ,  Y10T156/1064 ,  Y10T156/1082 ,  Y10T428/14 ,  Y10T428/1476 ,  Y10T428/1486 ,  Y10T428/149 ,  Y10T428/1495 ,  Y10T428/15 ,  Y10T428/161 ,  Y10T428/24851 ,  Y10T428/2486

摘要： A form that incorporates card such that the form can be reliably printed on by the end user and manufactured less expensively. The form includes a printable substrate. Weakened lines of the substrate define an integrated removable portion capable of being held in the form and easily removed manually when desired. In the integrated card form, a recess may be provided adjacent the removable portion to facilitate removal of the removable portion.

摘要翻译： 一种包含卡片的表格，使得该表格可以由最终用户可靠地印刷并且制造成本较低。 该形式包括可印刷基底。 衬底的弱化线限定了能够被保持为形式的集成可移除部分，并且在需要时容易地手动去除。 在集成卡形式中，可以在可移除部分附近设置凹部，以便于移除可移除部分。

公开(公告)号：US20110311778A1

公开(公告)日：2011-12-22

申请号：US13220342

申请日：2011-08-29

申请人： Steven J. Burpo ,  Michael P. Renieri ,  Nicholas B. Segobiano ,  Neal A. Froeschner

发明人： Steven J. Burpo ,  Michael P. Renieri ,  Nicholas B. Segobiano ,  Neal A. Froeschner

IPC分类号： B32B3/00 ,  B32B38/04 ,  B32B37/14 ,  B32B37/02 ,  B32B37/12

CPC分类号： B32B3/266 ,  B29C70/34 ,  B29C70/545 ,  B29L2031/3076 ,  B32B1/00 ,  B32B3/08 ,  B32B3/10 ,  B32B3/22 ,  B32B3/28 ,  B32B3/30 ,  B32B5/022 ,  B32B5/22 ,  B32B5/26 ,  B32B5/28 ,  B32B9/00 ,  B32B27/04 ,  B32B27/12 ,  B32B27/38 ,  B32B37/18 ,  B32B38/0012 ,  B32B38/04 ,  B32B2038/045 ,  B32B2250/03 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2305/08 ,  B32B2307/50 ,  B32B2307/546 ,  B32B2307/58 ,  B32B2605/00 ,  B32B2605/08 ,  B32B2605/18 ,  Y10T156/1026 ,  Y10T156/1028 ,  Y10T156/1041 ,  Y10T156/1056 ,  Y10T156/1064 ,  Y10T156/1074 ,  Y10T156/1082 ,  Y10T156/109 ,  Y10T156/1093 ,  Y10T428/20 ,  Y10T428/24298 ,  Y10T428/24314 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24339 ,  Y10T428/24479 ,  Y10T428/24628

摘要： A beaded composite panel is fabricated using composite plies. An opening is formed in each of plies, and each ply is laid up on a bead feature and drawn down over the bead feature in the area of the opening so as to widen the opening into a gap allowing the ply to conform to the contour of the bead feature. Patches are fabricated and placed on the plies overlying over the openings. The laid-up plies are compacted and cured.

摘要翻译： 使用复合层制造串珠复合板。 在每个帘布层中形成开口，并且每个帘布层被铺设在胎圈特征上并且在开口区域中的胎圈特征上向下拉，以便将开口加宽成间隙，从而允许帘布层符合 珠子功能。 制造贴片并将其放置在覆盖开口的层上。 堆积的层压实和固化。

公开(公告)号：US08006457B2

公开(公告)日：2011-08-30

申请号：US12474046

申请日：2009-05-28

申请人： Jesse A. Binkley ,  Perry J. Prudhomme ,  Frank M. Bartolic ,  Louis T. Hahn ,  Daniel C. DeJarnette ,  Charles M. Reed ,  Richard Allen Chasteen, Jr. ,  John W. Haughton ,  J. Gary Falls ,  Paul G. Wilson ,  Casimir Paul Weaver

发明人： Jesse A. Binkley ,  Perry J. Prudhomme ,  Frank M. Bartolic ,  Louis T. Hahn ,  Daniel C. DeJarnette ,  Charles M. Reed ,  Richard Allen Chasteen, Jr. ,  John W. Haughton ,  J. Gary Falls ,  Paul G. Wilson ,  Casimir Paul Weaver

IPC分类号： E04D1/28

CPC分类号： B29C66/21 ,  B29C65/56 ,  B29C65/562 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/435 ,  B29C66/71 ,  B29C66/81422 ,  B29C66/81429 ,  B29C66/8242 ,  B29C66/83413 ,  B29C66/83511 ,  B29L2031/108 ,  E04D1/26 ,  E04D2001/005 ,  Y10T29/49629 ,  Y10T156/1082 ,  Y10T428/24289 ,  Y10T428/249923 ,  B29K2095/00

摘要： A multi-layered roofing shingle is described. The layers of the shingle are connected via a mechanical fastener. A method for manufacturing a multi-layered shingle is also described. The method includes aligning the layers of the shingle, and connecting the layers via at least one mechanical fastener. Further described is a multi-layered shingle having layers that are mechanically fastened by deforming one of the layers into one of the other layers.

摘要翻译： 描述了多层屋顶瓦。 木瓦的层通过机械紧固件连接。 还描述了一种用于制造多层木瓦的方法。 该方法包括对准木瓦的层，以及经由至少一个机械紧固件连接层。 进一步描述的是具有通过使其中一层变形为其它层之一而被机械地紧固的层的多层瓦。

公开(公告)号：US20110174431A1

公开(公告)日：2011-07-21

申请号：US13054007

申请日：2009-07-13

申请人： Daniel Darmes ,  Nicolas Lavillonnière ,  Christelle Marck ,  Eric Roussel

发明人： Daniel Darmes ,  Nicolas Lavillonnière ,  Christelle Marck ,  Eric Roussel

IPC分类号： B32B37/02 ,  B32B33/00 ,  B32B37/12 ,  B32B37/14 ,  B32B38/04 ,  B32B38/10

CPC分类号： G02C7/083 ,  B32B3/12 ,  B32B3/266 ,  B32B7/12 ,  B32B23/04 ,  B32B27/08 ,  B32B27/304 ,  B32B27/36 ,  B32B2255/26 ,  B32B2551/00 ,  G02C7/101 ,  G02C7/12 ,  G02C2202/18 ,  Y10T156/1028 ,  Y10T156/1064 ,  Y10T156/1082 ,  Y10T428/1471

摘要： A method of transferring a portion of a functional film (1) onto a substrate from a base plate (100) comprises the formation of a groove (S1) which passes through the said functional film and also a separating film (2) placed between the functional film and the base plate. A portion (2p) of the separating film is then detached from the base plate with the portion of the functional film. The portion of said separating film protects the portion of the functional film in the rest of the method. According to one improvement, the portion of the functional film which is detached from the base plate comprises a useful portion (1p) and a margin (1m) that are connected together by the portion (2p) of the separating film. The useful portion (1p) of the functional film may then be gripped and handled via the margin (1m).

摘要翻译： 从基板（100）将功能膜（1）的一部分转印到基板上的方法包括形成通过所述功能膜的槽（S1），以及分离膜（2） 功能膜和底板。 然后将分离膜的一部分（2p）与功能膜的一部分从基板分离。 所述分离膜的部分在该方法的其余部分中保护功能膜的部分。 根据一个改进，从基板分离的功能膜的部分包括通过分离膜的部分（2p）连接在一起的有用部分（1p）和边缘（1m）。 然后可以通过边缘（1m）抓住并处理功能膜的有用部分（1p）。