公开(公告)号：US20240215269A1

公开(公告)日：2024-06-27

申请号：US18086232

申请日：2022-12-21

Applicant: Intel Corporation

Inventor： Bohan Shan ,  Haobo Chen ,  Yiqun Bai ,  Dingying Xu ,  Srinivas Venkata Ramanuja Pietambaram ,  Hongxia Feng ,  Gang Duan ,  Xiaoying Guo ,  Ziyin Lin ,  Bai Nie ,  Kyle Jordan Arrington

IPC: H10B80/00 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16 ,  H01L25/18

CPC classification number: H10B80/00 ,  H01L23/49816 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/13 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13023

Abstract: An electronic system includes a substrate that includes a glass core layer including a cavity formed through the glass core layer; at least one active component die disposed in the cavity; a first buildup layer contacting a first surface of the glass core layer and a first surface of the at least one active component die, wherein the first buildup layer includes electrically conductive interconnect contacting the at least one active component die and extending to a first surface of the substrate; a second buildup layer contacting a second surface of the glass core layer and a second surface of the at least one active component die; and one or more solder bumps on a second surface of the substrate and contacting the second surface of the at least one active component die.

公开(公告)号：US20240214786A1

公开(公告)日：2024-06-27

申请号：US17916748

申请日：2021-05-04

Applicant: Intel Corporation

Inventor： Vesh Raj SHARMA BANJADE ,  Kathiravetpillai SIVANESAN ,  Satish C. JHA ,  Leonardo GOMES BALTAR

IPC: H04W4/40 ,  H04W4/029

CPC classification number: H04W4/40 ,  H04W4/029

Abstract: The present disclosure is related to Intelligent Transport Systems (ITS), and in particular, to Vulnerable Road User (VRU) basic services (VBS) of a VRU ITS Station (ITS-S). Implementations of how the VBS is arranged within the facilities layer of an ITS-S, different conditions for VRU Awareness Message (VAM) dissemination, and format and coding rules of the VAM generation.

公开(公告)号：US20240214694A1

公开(公告)日：2024-06-27

申请号：US18456303

申请日：2023-08-25

Applicant: Intel Corporation

Inventor： David Israel Gonzalez-Aguirre

IPC: H04N23/84 ,  G06T3/40 ,  H04N13/128 ,  H04N13/239

CPC classification number: H04N23/84 ,  G06T3/40 ,  H04N13/128 ,  H04N13/239 ,  H04N13/194

Abstract: Example systems, apparatus, articles of manufacture, and methods are disclosed to implement and utilize epipolar scan line neural processor arrays for four-dimensional event detection and identification. An example apparatus disclosed herein is to generate, based on left input image data and right input image data, left epipolar image data and right epipolar image data, the left epipolar image data including a plurality of left epipolar scan lines, the right epipolar image data including a plurality of right epipolar scan lines. The example apparatus is also to process, with respective neural processors, respective pairs of the left epipolar scan lines and the right epipolar scan lines to detect events represented in the left input image data and the right input image data, and output data packets representative of the detected events.

公开(公告)号：US20240214594A1

公开(公告)日：2024-06-27

申请号：US18404696

申请日：2024-01-04

Applicant: Intel Corporation

Inventor： Chen Wang ,  Ximin Zhang ,  Huan Dou ,  Yi-Jen Chiu ,  Sang-Hee Lee

IPC: H04N19/44 ,  G06F18/25 ,  G06N3/08 ,  G06T3/4007 ,  G06T3/4053 ,  G06T9/00 ,  G06V10/82 ,  H04N19/132 ,  H04N19/159 ,  H04N19/176 ,  H04N19/184 ,  H04N19/30

CPC classification number: H04N19/44 ,  G06F18/251 ,  G06N3/08 ,  G06T3/4007 ,  G06T3/4053 ,  G06T9/002 ,  G06V10/82 ,  H04N19/132 ,  H04N19/159 ,  H04N19/176 ,  H04N19/184 ,  H04N19/30

Abstract: Techniques related to accelerated video enhancement using deep learning selectively applied based on video codec information are discussed. Such techniques include applying a deep learning video enhancement network selectively to decoded non-skip blocks that are in low quantization parameter frames, bypassing the deep learning network for decoded skip blocks in low quantization parameter frames, and applying non-deep learning video enhancement to high quantization parameter frames.

公开(公告)号：US20240214272A1

公开(公告)日：2024-06-27

申请号：US18550276

申请日：2022-07-05

Applicant: Intel Corporation

Inventor： Dawei Ying ,  Leifeng Ruan ,  Jaemin Han ,  Qian Li

IPC: H04L41/0894

CPC classification number: H04L41/0894

Abstract: The present invention relates to an apparatus comprising: memory to store policy statement information for a plurality of radio access network (RAN) automation applications (rApps); and processing circuitry, coupled with the memory, to: retrieve the policy statement information from the memory, wherein the policy statement information includes respective policy scope identifiers for respective rApps in the plurality of rApps; identify a conflict associated with common or overlapping policy scope identifiers between two or more rApps from the plurality of rApps; modify one or more A1 policies associated with an A1 interface connecting a non-real-time (non-RT) RAN intelligence controller (RIC) and a near-real-time (near-RT) RIC to resolve the conflict; and notify the two or more rApps of the modification of the one or more A1 policies.

公开(公告)号：US20240214185A1

公开(公告)日：2024-06-27

申请号：US18556022

申请日：2021-09-23

Applicant: LI Zhiqiang ,  Daniel MIDDLETON ,  Dan HE ,  Yiqi CHEN ,  Intel Corporation

Inventor： Zhiqiang LI ,  Daniel MIDDLETON ,  Dan HE ,  Yiqi CHEN

IPC: H04L9/08

CPC classification number: H04L9/0825 ,  H04L9/083 ,  H04L9/0822

Abstract: An apparatus and method of protect secret input data, secret processing, and secret output data by receiving a signed private enclave from a secret processing owner; receiving a signed manager enclave from a trusted third party (TTP); deploying the signed manager enclave; receiving a protected code loader (PCL) key encrypted with an encryption public key of the signed manager enclave from the secret processing owner; deploying the signed private enclave; running secret processing in the signed private enclave with secret input data to generate secret output data; and encrypting the secret output data in the signed private enclave using an ephemeral key, encrypting the ephemeral key in the signed private enclave using an encryption public key of the signed manager enclave, and sending the encrypted secret output data and the encrypted ephemeral key to the signed manager enclave.

公开(公告)号：US20240214022A1

公开(公告)日：2024-06-27

申请号：US18145860

申请日：2022-12-23

Applicant: Intel Corporation

Inventor： Vamshi Krishna AAGIRU ,  Santhosh AP ,  Praveen Kashyap Ananta BHAT ,  Arjun C ,  Shailendra Singh CHAUHAN ,  Sajal Kumar DAS ,  Walid EL HAJJ ,  Isha GARG ,  Sagar GUPTA ,  Mallari HANCHATE ,  Mythili HEGDE ,  Siva Prasad JANGILI GANGA ,  Satyajit Siddharay KAMAT ,  Noam KOGOS ,  Ronen KRONFELD ,  Adiel LANGER ,  Gil MEYUHAS ,  Padmesh MURUGAN LATHA ,  Vishram Shriram PANDIT ,  Abhijith PRABHA ,  Manisha RAIGURU ,  Ehud RESHEF ,  Amir RUBIN ,  Shubham Kumar SAHU ,  Gurpreet SANDHU ,  Michael SHACHAR ,  Harry SKINNER ,  Madhukiran SRINIVASAREDDY ,  Gokul SUBRAMANIAM ,  Maruti TAMRAKAR ,  Jayprakash THAKUR ,  Vijaya Prasad UMMELLA ,  Yagnesh Vinodrai WAGHELA

IPC: H04B1/3827 ,  H04W52/36

CPC classification number: H04B1/3838 ,  H04W52/365 ,  H04B2001/3844

Abstract: Various principles and methods are described herein to improve wireless communication in a user computing device. Certain aspects of the disclosure describe management of wireless transmissions relative to various regulations related to a specific absorption rate. Other aspects of the disclosure relate to detection of user proximity to a transmitting antenna. Other aspects relate to alternative strategies to improve wireless communication, such as selection of alternate antennas or baseband modems, or changes in device orientation.

公开(公告)号：US20240213331A1

公开(公告)日：2024-06-27

申请号：US18088542

申请日：2022-12-24

Applicant: Intel Corporation

Inventor： Han Wui THEN ,  Sansaptak DASGUPTA ,  Pratik KOIRALA ,  Wesley HARRISON ,  Marko RADOSAVLJEVIC

IPC: H01L29/20 ,  H01L29/40 ,  H01L29/423 ,  H01L29/66 ,  H01L29/78

CPC classification number: H01L29/2003 ,  H01L29/407 ,  H01L29/4236 ,  H01L29/66462 ,  H01L29/7838

Abstract: Gallium nitride (GaN) layer on substrate carburization for integrated circuit technology is described. In an example, an integrated circuit structure includes a substrate including silicon. A layer comprising silicon and carbon is above the substrate. A layer comprising gallium and nitrogen is on the layer comprising silicon and carbon.

公开(公告)号：US20240213301A1

公开(公告)日：2024-06-27

申请号：US18089471

申请日：2022-12-27

Applicant: Intel Corporation

Inventor： Darko GRUJICIC ,  Thomas L. SOUNART ,  Benjamin DUONG ,  Kristof DARMAWIKARTA ,  Shayan KAVIANI ,  Suddhasattwa NAD ,  Mahdi MOHAMMADIGHALENI ,  Marcel WALL ,  Rengarajan SHANMUGAM

IPC: H01G4/33

CPC classification number: H01L28/40 ,  H01G4/33

Abstract: Embodiments disclosed herein include a package core. In an embodiment, the package core comprises a core substrate that includes glass. In an embodiment, a cavity is provided into the core substrate. In an embodiment, a capacitor is lining sidewalls of the cavity, and the capacitor comprises a first layer, a dielectric layer over the first layer, and a second layer over the dielectric layer.

公开(公告)号：US20240213250A1

公开(公告)日：2024-06-27

申请号：US18088547

申请日：2022-12-24

Applicant: INTEL CORPORATION

Inventor： Shao Ming KOH ,  Sudipto NASKAR ,  Leonard P. GULER ,  Patrick MORROW ,  Richard E. SCHENKER ,  Walid M. HAFEZ ,  Charles H. WALLACE ,  Mohit K. HARAN ,  Jeanne L. LUCE ,  Dan S. LAVRIC ,  Jack T. KAVALIEROS ,  Matthew PRINCE ,  Lars LIEBMANN

IPC: H01L27/092 ,  H01L29/06 ,  H01L29/786

CPC classification number: H01L27/0924 ,  H01L29/0673 ,  H01L29/78696

Abstract: Embodiments disclosed herein include forksheet transistor transistors with self-aligned backbones. In an example, an integrated circuit structure includes a backbone including a lower backbone portion distinct from an upper backbone portion. A first vertical stack of nanowires is in lateral contact with a first side of the backbone. A second vertical stack of nanowires is in lateral contact with a second side of the backbone, the second side opposite the first side.