公开(公告)号：US20100170639A1

公开(公告)日：2010-07-08

申请号：US12636886

申请日：2009-12-14

Applicant: Wen-Tsun Chen ,  Shin-Chih Liaw ,  Tao-Ming Liao ,  Chia-Hung Shen ,  Yun-Fei Lien

Inventor： Wen-Tsun Chen ,  Shin-Chih Liaw ,  Tao-Ming Liao ,  Chia-Hung Shen ,  Yun-Fei Lien

IPC: C23F1/08 ,  B08B3/04

CPC classification number: C23F1/08 ,  B08B3/022 ,  H05K3/0085 ,  H05K2203/075 ,  H05K2203/1509 ,  H05K2203/163

Abstract: An exemplary apparatus for wet processing a substantially rectangular substrate includes a conveyor, a supporting mechanism, an adjusting mechanism, a processing module and a dosing system. The conveyor is configured for conveying the substrate to a wet process work station. The supporting mechanism is configured for supporting the substrate away from the conveyor. The adjusting mechanism is configured for adjusting the orientation of the substrate. The processing module is configured for obtaining an area of a surface of the substrate. The dosing system communicates with the processing unit, and is configured for dispensing a corresponding amount of wet processing liquid to the substrate to wet process the substrate according to the area of the surface of the substrate from the processing module.

Abstract translation: 用于湿处理基本上矩形的基板的示例性装置包括传送器，支撑机构，调节机构，处理模块和定量给料系统。 输送机构造成将基底输送到湿法加工工位。 支撑机构构造成用于将基板远离输送机支撑。 调整机构构造成用于调整基板的取向。 处理模块被配置为获得基板的表面的面积。 配量系统与处理单元连通，并且被配置为将相应量的湿处理液体分配到基板，以根据来自处理模块的基板表面的面积来湿处理基板。

公开(公告)号：US20100051331A1

公开(公告)日：2010-03-04

申请号：US12468841

申请日：2009-05-19

Applicant: CHUNG-JEN TSAI ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN ,  CHENG-HSIEN LIN

IPC: H05K1/03

CPC classification number: H05K1/056 ,  B82Y10/00 ,  H01L23/373 ,  H01L23/4985 ,  H01L2224/48091 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/026 ,  H05K2201/0323 ,  H01L2924/00014

Abstract: A circuit substrate for mounting electronic components includes a metal base layer, an electrically conductive layer having electrically conductive traces, and a composite layer disposed between the metal base layer and the electrically conductive layer. The composite layer includes a polymer matrix and a number of carbon nanotubes embedded in the polymer matrix. The composite layer has a first surface in contact with the metal substrate and an opposite second surface. Each of the carbon nanotubes extends from the first surface to the second surface inclined at an angle of from 80° to 100° relative to the first surface.

Abstract translation: 用于安装电子部件的电路基板包括金属基底层，具有导电迹线的导电层和设置在金属基底层和导电层之间的复合层。 复合层包括聚合物基质和嵌入聚合物基质中的多个碳纳米管。 复合层具有与金属基底接触的第一表面和相对的第二表面。 每个碳纳米管从第一表面延伸到第二表面，相对于第一表面以80°至100°的角度倾斜。

公开(公告)号：US20100038116A1

公开(公告)日：2010-02-18

申请号：US12389521

申请日：2009-02-20

Applicant: CHUNG-JEN TSAI ,  CHIA-CHENG CHEN ,  HUNG-YI CHANG ,  TUNG-YAO KUO ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  CHIA-CHENG CHEN ,  HUNG-YI CHANG ,  TUNG-YAO KUO ,  CHENG-HSIEN LIN

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/46 ,  C25D5/16

CPC classification number: H05K1/0271 ,  H05K3/243 ,  H05K2201/09136 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/2009

Abstract: A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.

Abstract translation: 印刷电路板包括绝缘层，形成在绝缘层上的铜层和在给定部分的相对侧的铜层上形成的增强层。 铜层在其给定部分包括多个电迹线。 加强层的厚度在远离给定部分的方向上增加。 在本公开中还提供了制造印刷电路板的方法。

公开(公告)号：US20100021652A1

公开(公告)日：2010-01-28

申请号：US12494279

申请日：2009-06-30

Applicant: CHENG-HSIEN LIN ,  YAO-WEN BAI ,  RUI ZHANG

Inventor： CHENG-HSIEN LIN ,  YAO-WEN BAI ,  RUI ZHANG

IPC: B05D3/06

CPC classification number: H05K3/185 ,  H05K3/105 ,  H05K2203/013 ,  H05K2203/125

Abstract: A method of forming electrical traces includes the steps of: providing a substrate; printing an ink pattern using a silver containing ink on the substrate, the ink comprising an aqueous carrier medium having dissolved therein a water-soluble light sensitive silver salt; irradiating the ink pattern to reduce silver salt therein to silver particles thereby forming an underlayer; and electroless plating a metal overcoat layer on the underlayer thereby obtaining electrical traces.

Abstract translation: 形成电迹线的方法包括以下步骤：提供衬底; 在基材上使用含银墨水印刷油墨图案，该油墨包含其中溶解有水溶性光敏银盐的水性载体介质; 照射油墨图案以将其中的银盐还原成银颗粒，从而形成底层; 并在底层上无电镀覆金属外涂层，从而获得电迹线。

公开(公告)号：US20100003784A1

公开(公告)日：2010-01-07

申请号：US12466361

申请日：2009-05-14

Applicant: CHUNG-JEN TSAI ,  CHIA-CHENG CHEN ,  HUNG-YI CHANG ,  TUNG-YAO KUO ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  CHIA-CHENG CHEN ,  HUNG-YI CHANG ,  TUNG-YAO KUO ,  CHENG-HSIEN LIN

IPC: H01L21/52

CPC classification number: H05K1/0271 ,  H05K3/0052 ,  H05K3/303 ,  H05K3/341 ,  H05K2201/09127 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2009

Abstract: A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.

Abstract translation: 一种用于在印刷电路板上组装电子部件的方法包括以下步骤。 首先，提供包括中央主要部分和外围不想要的部分的印刷电路板基板。 其次，分别在主要部分和不想要的部分上形成导电图案和加强图案。 第三，电子部件安装在主体部分上并与导电图形电连接。 第五，去除不想要的部分。

公开(公告)号：US20090277680A1

公开(公告)日：2009-11-12

申请号：US12346804

申请日：2008-12-30

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H05K9/00 ,  B32B27/06

CPC classification number: H05K3/4641 ,  B82Y10/00 ,  H05K1/056 ,  H05K9/0088 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10S977/70 ,  Y10S977/701 ,  Y10S977/712 ,  Y10S977/734 ,  Y10T428/24116 ,  Y10T428/30 ,  Y10T442/10

Abstract: An insulating film includes a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer. The electromagnetic shielding layer includes a number of carbon nanotube films that are substantially parallel to the first and second polymer layer. Each of the carbon nanotube films includes a number of carbon nanotubes that are substantially parallel to each other. The insulating film can provide anti-EMI effect in printed circuit boards without employing additional electromagnetic shielding layers.

Abstract translation: 绝缘膜包括第一聚合物层，第二聚合物层和夹在第一聚合物层和第二聚合物层之间的电磁屏蔽层。 电磁屏蔽层包括大致平行于第一和第二聚合物层的多个碳纳米管薄膜。 每个碳纳米管膜包括基本上彼此平行的多个碳纳米管。 绝缘膜可以在印刷电路板中提供抗电磁效应，而不需要额外的电磁屏蔽层。

公开(公告)号：US20090246357A1

公开(公告)日：2009-10-01

申请号：US12235994

申请日：2008-09-23

Applicant: Shing-Tza Liou ,  Qiu-Yur Zhang ,  Cheng-Hsien Lin

Inventor： Shing-Tza Liou ,  Qiu-Yur Zhang ,  Cheng-Hsien Lin

IPC: H05K3/12

CPC classification number: H05K3/105 ,  H05K3/125 ,  H05K3/246 ,  H05K2201/0257 ,  H05K2201/0347 ,  H05K2203/013 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10T29/49155

Abstract: A method of forming a circuit on a circuit board includes the steps of: forming a first circuit pattern made of a nano-scale metal oxide material on a surface of an insulating substrate; reducing the nano-scale metal oxide material into a nano-scale deoxidized metal material, thus obtaining a second circuit pattern; and forming an electrically conductive metal layer on the second circuit pattern.

Abstract translation: 一种在电路板上形成电路的方法包括以下步骤：在绝缘衬底的表面上形成由纳米级金属氧化物材料制成的第一电路图案; 将纳米级金属氧化物材料还原成纳米级脱氧金属材料，从而获得第二电路图案; 以及在所述第二电路图案上形成导电金属层。

公开(公告)号：US20090242246A1

公开(公告)日：2009-10-01

申请号：US12253869

申请日：2008-10-17

Applicant: SHING-TZA LIOU ,  YAO-WEN BAI ,  CHENG-HSIEN LIN

Inventor： SHING-TZA LIOU ,  YAO-WEN BAI ,  CHENG-HSIEN LIN

IPC: H05K3/10 ,  H05K1/03

CPC classification number: H05K1/097 ,  B82Y10/00 ,  H05K3/125 ,  H05K3/246 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2203/013 ,  Y10T29/49155 ,  Y10T428/2462 ,  Y10T428/30 ,  Y10T428/32

Abstract: A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.

Abstract translation: 印刷电路板包括具有表面的基板，具有形成在表面上的多个电迹线的电路层和形成在电路层上的导电金属层。 电路层由碳纳米管和金属纳米颗粒组成。

公开(公告)号：US20090183823A1

公开(公告)日：2009-07-23

申请号：US12270612

申请日：2008-11-13

Applicant: LIN REN ,  YING SU ,  CHENG-HSIEN LIN

Inventor： LIN REN ,  YING SU ,  CHENG-HSIEN LIN

IPC: B32B37/00

CPC classification number: H05K3/4691 ,  H05K3/0052 ,  H05K3/4611 ,  H05K2201/0909 ,  H05K2201/09127 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T156/1064

Abstract: A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.

Abstract translation: 制造刚柔柔性印刷电路板的方法包括以下步骤。 首先，提供柔性基板。 其次，在柔性基板中限定至少一个狭缝。 第三，提供具有对应于柔性基板的结构的刚性基板。 第四，将柔性基板层合到刚性基板上以获得层压基板。 第五，去除刚性基板的一部分。 第六，层叠基板沿着假想边界线切割以去除层叠基板的废弃部分。 因此，获得刚性柔性印刷电路板。

公开(公告)号：US20090159559A1

公开(公告)日：2009-06-25

申请号：US12164422

申请日：2008-06-30

Applicant: YUN-LI ZHU ,  YUNG-WEI LAI ,  SHING-TZA LIOU

Inventor： YUN-LI ZHU ,  YUNG-WEI LAI ,  SHING-TZA LIOU

IPC: H01B13/00 ,  B32B37/00

CPC classification number: H05K3/4638 ,  H05K1/0269 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/09063 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0156 ,  H05K2203/166 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T156/10

Abstract: A method for manufacturing a multilayer printed circuit board includes the following steps. A number of laminate units are provided. Each of the laminate units includes an electrically conductive layer with a circuit pattern defined therein, and a release layer releasably attached to the electrically conductive layer. A number of insulation layers are provided. Each of the insulation layers definies a metalized through hole therein. The electrically conductive layers and the insulation layers are stacked alternately one on another such that adjacent electrically conductive layers are insulated by one insulation layer and the metalized through holes electrically connects the circuit patterns of the adjacent electrically conductive layers. In the stacking step, the release layer is removed from the laminate unit after the electrically conductive layer is stacked onto the respective insulation layer, thereby obtaining a pre-laminated multilayer printed circuit board. The stacked electrically conductive layers and the insulation layers are laminated together to achieve a multilayer printed circuit board.

Abstract translation: 一种制造多层印刷电路板的方法包括以下步骤。 提供了许多层压单元。 每个层压单元包括其中限定有电路图案的导电层和可剥离地附接到导电层的剥离层。 提供了许多绝缘层。 每个绝缘层在其中确定了金属化的通孔。 导电层和绝缘层交替地堆叠在一起，使得相邻的导电层被一个绝缘层绝缘，并且金属化的通孔电连接相邻的导电层的电路图案。 在堆叠步骤中，在将导电层堆叠在各绝缘层上之后，从层压单元中去除剥离层，从而获得预层压多层印刷电路板。 层叠的导电层和绝缘层被层叠在一起以实现多层印刷电路板。