公开(公告)号：US20080283288A1

公开(公告)日：2008-11-20

申请号：US12219381

申请日：2008-07-21

Applicant: Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

Inventor： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

IPC: H05K1/11

CPC classification number: H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

Abstract: A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

Abstract translation: 公开了一种使用糊状凸块的印刷电路板及其制造方法。 使用糊状凸块制造印刷电路板的方法包括：（a）穿孔芯板以形成至少一个通孔，（b）通过填充电镀填充至少一个通孔并在其上形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路，结构稳定的全层 由于镀层芯板的BVH的强度增加，可以实现IVH结构，由于并行处理和集体堆叠，制造时间可以减少，由于糊状凸块的铜箔堆叠而实现微电路变得容易 在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且可以获得凹坑覆盖 d。

公开(公告)号：US20080225501A1

公开(公告)日：2008-09-18

申请号：US12076274

申请日：2008-03-14

Applicant: Chung-Woo Cho ,  Chang-Sup Ryu ,  Soon-Jin Cho ,  Seung-Chul Kim

Inventor： Chung-Woo Cho ,  Chang-Sup Ryu ,  Soon-Jin Cho ,  Seung-Chul Kim

IPC: H05K7/10 ,  H01K3/10

CPC classification number: H05K3/421 ,  H05K3/108 ,  H05K3/423 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49165

Abstract: A printed circuit board and a manufacturing method thereof are disclosed. The printed circuit board, which includes a first insulation layer, a first via that penetrates the first insulation layer, and a first pad formed on one surface of the first insulation layer, where a whole of or a portion of the first pad is buried in the first via, has a portion of or the whole of the pad buried in the via, so that the contact area between the pad and the via may be increased, and the printed circuit board can be given greater reliability.

Abstract translation: 公开了印刷电路板及其制造方法。 印刷电路板包括第一绝缘层，穿过第一绝缘层的第一通孔和形成在第一绝缘层的一个表面上的第一焊盘，其中第一焊盘的整体或一部分被埋在 第一通孔具有埋在通孔中的焊盘的一部分或全部，从而可以增加焊盘和通孔之间的接触面积，并且可以赋予印刷电路板更高的可靠性。

公开(公告)号：US20080123308A1

公开(公告)日：2008-05-29

申请号：US12023616

申请日：2008-01-31

Applicant: Chang Sup Ryu ,  Myung Sam Kang

Inventor： Chang Sup Ryu ,  Myung Sam Kang

IPC: H05K7/06

CPC classification number: H05K1/185 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49101 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

Abstract translation: 公开了一种包括嵌入式无源元件的PCB及其制造方法。 PCB包括形成电路图案的至少两个电路层。 在电路层之间插入至少一个绝缘层。 一对端子通过绝缘层垂直地形成，电镀有第一导电材料，并且彼此分开预定距离。 嵌入式无源部件插入在端子之间，并且具有形成在其两侧的电极。 电极与端子分开预定距离，并通过第二导电材料与端子电连接。

公开(公告)号：US07350296B2

公开(公告)日：2008-04-01

申请号：US11020466

申请日：2004-12-22

Applicant: Chang Sup Ryu ,  Myung Sam Kang

Inventor： Chang Sup Ryu ,  Myung Sam Kang

IPC: H01K3/10

CPC classification number: H05K1/185 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49101 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

Abstract translation: 公开了一种制造包括嵌入式无源元件的PCB的方法及其制造方法及其制造方法。 PCB包括形成电路图案的至少两个电路层。 在电路层之间插入至少一个绝缘层。 一对端子通过绝缘层垂直地形成，电镀有第一导电材料，并且彼此分开预定距离。 嵌入式无源部件插入在端子之间，并且具有形成在其两侧的电极。 电极与端子分开预定距离，并通过第二导电材料与端子电连接。

公开(公告)号：US20060014327A1

公开(公告)日：2006-01-19

申请号：US10976732

申请日：2004-10-29

Applicant: Suk-Hyeon Cho ,  Seok-Kyu Lee ,  Jong-Kuk Hong ,  Ho-Sik Jun ,  Jin-Soo Jeong ,  Chang-Sup Ryu ,  Jin-Yong Ahn

Inventor： Suk-Hyeon Cho ,  Seok-Kyu Lee ,  Jong-Kuk Hong ,  Ho-Sik Jun ,  Jin-Soo Jeong ,  Chang-Sup Ryu ,  Jin-Yong Ahn

IPC: H01L21/50

CPC classification number: H05K1/186 ,  H01L2224/82039 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H05K1/023 ,  H05K1/185 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10636 ,  H05K2203/1189 ,  Y02P70/611

Abstract: Disclosed is a method of fabricating a PCB including an embedded passive chip, in which the passive chip is mounted on the PCB and an insulator is then laminated on the PCB, or in which a blind hole for receiving the passive chip is formed in the PCB and the passive chip is mounted in the blind hole.

Abstract translation: 公开了一种制造包括嵌入式无源芯片的PCB的方法，其中无源芯片安装在PCB上，然后将绝缘体层合在PCB上，或者在PCB中形成用于接收无源芯片的盲孔 无源芯片安装在盲孔中。

公开(公告)号：US20050060732A1

公开(公告)日：2005-03-17

申请号：US10704811

申请日：2003-11-12

Applicant: Myung-Sam Kang ,  Kyung-Sik Shin ,  Won-Cheol Bae ,  Chang-Sup Ryu

Inventor： Myung-Sam Kang ,  Kyung-Sik Shin ,  Won-Cheol Bae ,  Chang-Sup Ryu

IPC: G11B7/09 ,  G11B7/08 ,  G11B7/085 ,  G11B7/22 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00

CPC classification number: H05K1/165 ,  G11B7/08582 ,  G11B7/0933 ,  G11B7/0935 ,  H05K1/115 ,  H05K2201/097 ,  H05K2201/10121

Abstract: An optical pickup actuator and a method thereof includes a bobbin having a lens to scan a laser beam on a track of a disc, a winding coil moving the bobbin on the track in focusing and tracking directions, and an integrated circuit board used as the bobbin using a printed circuit board manufacturing technology and integrally formed with the winding coil in a monolithic body. The bobbin used with the optical pickup actuator includes the printed circuit board, a plurality of tracking circuit patterns formed on both surfaces of the PCB, a plurality of focusing circuit patterns formed on the both surfaces of the PCB, a plurality of via holes formed on the PCB to electrically connect the tracking circuit patterns and the focusing circuit patterns, an objective lens mounting unit formed on the PCB, and a connecting pad through which a power is supplied to the tracking and focusing circuit patterns.

Abstract translation: 一种光学拾取器致动器及其方法包括：具有用于扫描光盘轨道上的激光束的透镜的绕线管，在聚焦和跟踪方向上将线轴移动到轨道上的绕组线圈，以及用作线轴的集成电路板 使用印刷电路板制造技术，并且与卷绕线圈整体形成在一体的单体中。 与光拾取器致动器一起使用的筒管包括印刷电路板，形成在PCB的两个表面上的多个跟踪电路图案，形成在PCB的两个表面上的多个聚焦电路图案，多个通孔形成在 所述PCB用于电连接所述跟踪电路图案和所述聚焦电路图案，形成在所述PCB上的物镜安装单元和连接焊盘，通过所述连接焊盘向所述跟踪和聚焦电路图案供电。

公开(公告)号：US08981549B2

公开(公告)日：2015-03-17

申请号：US13340436

申请日：2011-12-29

Applicant: Hye Jin Kim ,  Going Sik Kim ,  Chang Sup Ryu

Inventor： Hye Jin Kim ,  Going Sik Kim ,  Chang Sup Ryu

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L23/13 ,  H01L23/31

CPC classification number: H01L24/48 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/45 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2225/0651 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: The preferred embodiment of the present invention can prevent signal distortions such as stress, or the like, occurring at the time of power delivery due to the difference in the lengths of the metal wires for electrically connecting each of the plurality of semiconductor chips formed on the dual die package substrate.

Abstract translation: 本发明的优选实施例可以防止由于用于电连接形成在多个半导体芯片上的多个半导体芯片中的每一个的金属线的长度差而在发电时发生的诸如应力等的信号失真 双模封装基板。

公开(公告)号：US08377748B2

公开(公告)日：2013-02-19

申请号：US13137669

申请日：2011-09-01

Applicant: Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

Inventor： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

IPC: H01L23/467

CPC classification number: H01L23/373 ,  B82Y30/00 ,  C04B35/80 ,  C04B2235/3217 ,  C04B2235/3418 ,  C04B2235/407 ,  C04B2235/408 ,  C04B2235/5288 ,  F28F3/02 ,  F28F21/02 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49002 ,  Y10T29/4935 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.

Abstract translation: 一种冷却翅片和封装基板的制造方法，其特征在于，包括：准备模具，所述模具具有支撑基体和树脂层，所述支撑基部和树脂层形成在所述支撑基部上，并且在其一侧包括凹槽，所述凹槽被构造成形成冷却翅片; 在所述模具的侧面上印刷含有碳成分的可燃性糊料，所述成型体具有形成冷却翅片的所述凹槽; 移除支撑底座以留下冷却物体; 并发射冷却对象。

公开(公告)号：US20120222299A1

公开(公告)日：2012-09-06

申请号：US13474388

申请日：2012-05-17

Applicant: Jee Soo MOK ,  Je Gwang Yoo ,  Chang Sup Ryu

Inventor： Jee Soo MOK ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC: H05K3/10

CPC classification number: H05K3/4069 ,  H05K3/06 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/09481 ,  H05K2203/0278 ,  H05K2203/1461 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The printed circuit board is made slim, and reliability and the degree of design freedom are increased.

Abstract translation: 一种印刷电路板和印刷电路板的制造方法，其中印刷电路板包括绝缘层，嵌入绝缘层中的电路层，并且具有嵌入在绝缘层中的连接焊盘，使得 所述连接垫与所述绝缘层的表面齐平，以及被配置为保护所述电路层免受外部环境并且具有所述连接焊盘暴露的开口的绝缘材料。 印刷电路板变薄，可靠性和设计自由度提高。

公开(公告)号：US20120005894A1

公开(公告)日：2012-01-12

申请号：US13137934

申请日：2011-09-21

Applicant: Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

Inventor： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC: H05K3/06 ,  H05K3/46

CPC classification number: H05K3/1258 ,  H01L2224/11 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2203/0568 ,  H05K2203/1152 ,  Y10T29/49156

Abstract: A method of manufacturing a multilayered circuit board, including: providing a double-sided copper clad laminate including via holes formed therethrough and openings for forming circuit patterns, formed by patterning copper foil formed on one side thereof; filling the via holes and the openings with conductive paste; removing the copper foil from the double-sided copper clad laminate to form a first circuit layer including circuit patterns on one side thereof and to form a second circuit layer including connecting pads for attaching solder balls thereto on the other side thereof; forming a build-up layer on the first circuit layer, the build-up layer including a plurality of insulating layers and a plurality of circuit layers; and forming a solder resist layer on an outermost layer of the build-up layer.

Abstract translation: 一种制造多层电路板的方法，包括：提供一种双面铜箔层压板，其包括形成的通孔和用于形成电路图案的开口，其形成在其一侧形成的铜箔; 用导电浆填充通孔和开孔; 从双面覆铜层压板上除去铜箔，以形成包括其一侧上的电路图案的第一电路层，并形成第二电路层，该第二电路层包括在其另一侧上附着焊球的连接焊盘; 在第一电路层上形成堆积层，所述堆积层包括多个绝缘层和多个电路层; 以及在积层层的最外层上形成阻焊层。