公开(公告)号：US20080129303A1

公开(公告)日：2008-06-05

申请号：US11849069

申请日：2007-08-31

申请人： Shuichi Takeuchi ,  Hidehiko Kira

发明人： Shuichi Takeuchi ,  Hidehiko Kira

IPC分类号： G01R31/26

CPC分类号： B23K20/002 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81

摘要： When bonding a workpiece to a substrate, processed parts of the substrate and the workpiece are observed and behavior such as the production of voids and the flowing of resin is observed. An apparatus for observing an assembled state of components includes: a stage on which a substrate is set; a head mechanism that bonds, by applying heat and pressure, an observation workpiece made of a transparent material to the substrate via resin supplied between the substrate and the observation workpiece; a light source that irradiates an observed part of the substrate and the observation workpiece mounted on the stage with light; and a camera that takes, from the observation workpiece side, an image of the observed part when the observation workpiece is bonded to the substrate set on the stage.

摘要翻译： 当将工件接合到基板时，观察基板和工件的处理部分，观察到空隙的产生和树脂的流动等行为。 用于观察组件的组装状态的装置包括：设置基板的台阶; 通过将由透明材料制成的观察工件通过加热和压力粘合在基板上的树脂机构，所述树脂供应在所述基板和所述观察工件之间; 用光照射基板的观察部分和安装在台架上的观察工件的光源; 以及摄像机，当观察工件接合到设置在台架上的基板时，从观察工件侧取出观察部分的图像。

公开(公告)号：US07355285B2

公开(公告)日：2008-04-08

申请号：US11041292

申请日：2005-01-25

申请人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

发明人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

IPC分类号： H01L23/48

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/75 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/759 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00015 ,  H01L2224/13099 ,  H01L2924/00

摘要： The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.

摘要翻译： 将电子部件安装在电路板上的结构能够将具有非常短的分离的凸块的电子部件可靠地倒置接合到电路板而没有位移。 将电子部件安装在电路板上的结构的特征在于，通过对电子部件施加超声波振动，电子部件的凸起分别与电路基板的电极倒装接合， 先前相对于每个电极的宽度方向上的中心在与超声波振动的方向平行的方向上相对移位。

公开(公告)号：US07350685B2

公开(公告)日：2008-04-01

申请号：US11041301

申请日：2005-01-25

申请人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

发明人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

IPC分类号： B23K1/06

CPC分类号： H05K3/328 ,  B23K20/10 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75343 ,  H01L2224/75755 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K2201/10674 ,  H05K2203/0285 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. Portions of the circuit board, which correspond to peaks of amplitude of vibrations transmitted to the circuit board, are pressed when the ultrasonic vibrations are applied to the electronic component.

摘要翻译： 该方法能够通过施加超声波振动将电子部件牢固地安装在电路板上。 该方法包括对电子部件施加超声波振动以将电子部件倒装芯片连接到具有电极的电路板的步骤。 当将超声波振动施加到电子部件时，电路板的与发送到电路板的振动的振幅的峰值对应的部分被按压。

公开(公告)号：US07317395B2

公开(公告)日：2008-01-08

申请号：US11091935

申请日：2005-03-29

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： G08B13/14

CPC分类号： H01L23/13 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/49855 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/10165 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01Q1/2208 ,  H01Q1/36 ,  H01Q7/00 ,  Y10T29/49018 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides a radio frequency identification (RFID) tag which exchanges information with an external device in a noncontact manner, in which a paste is used as a material for an antenna, and which is designed to avoid the problem due to swelling of the paste caused by a pressing force from bumps of an IC chip. A paste escape recess is provided in which part of the paste provided to form the antenna is caused to flow therein by the pressure received from the bumps when the IC chip with the bumps is connected to the antenna.

摘要翻译： 本发明提供了一种射频识别（RFID）标签，其以非接触方式与外部设备交换信息，其中使用糊料作为天线的材料，并且被设计为避免由于 由IC芯片的凸块的压力引起的糊状物。 提供了一种糊状逃逸凹部，其中当具有凸起的IC芯片连接到天线时，通过从凸起接收的压力使得设置成形成天线的浆料的一部分流入其中。

公开(公告)号：US20070281395A1

公开(公告)日：2007-12-06

申请号：US11822978

申请日：2007-07-11

申请人： Hidehiko Kira ,  Masanao Fujii ,  Naoki Ishikawa

发明人： Hidehiko Kira ,  Masanao Fujii ,  Naoki Ishikawa

IPC分类号： H01L21/58

CPC分类号： H01L21/6835 ,  H01L24/11 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/78302 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/0781 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48

摘要： A fabrication method of a semiconductor device is disclosed. The method includes the following steps. First, a given number of projection electrodes are formed on each of a given number of semiconductor chips, and a thermosetting insulating adhesive is applied to areas of mounting parts where the semiconductor chips are to be mounted on a substrate. Second, the thermosetting insulating adhesive on the substrate is heated with a half-thermosetting temperature. Third, the semiconductor chips are aligned to the mounting parts of the substrate and a first fixing of the semiconductor chips is performed with a first pressure. Fourth, the substrate, on which the semiconductor chips are fixed, is heated with a thermosetting temperature of the thermosetting insulating adhesive, and a second fixing of the semiconductor chips is performed with a second pressure.

摘要翻译： 公开了一种半导体器件的制造方法。 该方法包括以下步骤。 首先，在给定数量的半导体芯片的每一个上形成给定数量的投影电极，并且将热固性绝缘粘合剂施加到将要安装半导体芯片的安装部分的区域上。 其次，将半固化温度加热基板上的热固性绝缘粘合剂。 第三，将半导体芯片与衬底的安装部分对准，并且以第一压力进行半导体芯片的第一固定。 第四，将半导体芯片固定在其上的基板用热固性绝缘粘合剂的热固化温度加热，并且用第二压力进行半导体芯片的第二固定。

公开(公告)号：US20070264752A1

公开(公告)日：2007-11-15

申请号：US11634119

申请日：2006-12-06

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Kimio Nakamura ,  Kuniko Ishikawa ,  Yukio Ozaki

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Kimio Nakamura ,  Kuniko Ishikawa ,  Yukio Ozaki

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2924/3512

摘要： A method of manufacturing a semiconductor device flip-chip bonds electrode terminals of a substrate and a semiconductor chip together by solid-phase diffusion and underfills a gap between the substrate and the semiconductor chip with a thermosetting resin without the bonds between the terminals breaking due to heat in an underfill hardening step. The method includes a bonding step of flip-chip bonding the electrode terminals of the substrate and the semiconductor chip by solid-phase diffusion, an underfill filling step of filling the gap between the substrate and the semiconductor chip with the underfill material, and the underfill hardening step where the underfill material is heated to the hardening temperature to harden the underfill material. During the underfill hardening step, a member with a lower coefficient of thermal expansion out of the substrate and the semiconductor chip is heated to a higher temperature than the other member.

摘要翻译： 半导体器件倒装芯片的制造方法通过固相扩散将基板和半导体芯片的电极端子连接在一起，并且用热固性树脂对基板和半导体芯片之间的间隙进行底部填充，而不会由于端子断裂而导致端子之间的结合 在底部填充硬化步骤中加热。 该方法包括通过固相扩散将基板和半导体芯片的电极端子倒装连接的接合步骤，用底部填充材料填充基板和半导体芯片之间的间隙的底部填充步骤，以及底部填充 硬化步骤，其中将底部填充材料加热至硬化温度以使底部填充材料硬化。 在底部填充硬化工序中，将从基板和半导体芯片的热膨胀系数较低的部件加热到比其他部件高的温度。

公开(公告)号：US20070180673A1

公开(公告)日：2007-08-09

申请号：US11444292

申请日：2006-05-31

申请人： Hiroshi Kobayashi ,  Hidehiko Kira ,  Naoki Ishikawa ,  Takayoshi Matsumura

发明人： Hiroshi Kobayashi ,  Hidehiko Kira ,  Naoki Ishikawa ,  Takayoshi Matsumura

IPC分类号： B23P11/00 ,  B21D39/00

CPC分类号： B23P11/005 ,  B21D39/032 ,  B21J5/006 ,  B21K25/00 ,  Y10T29/49764 ,  Y10T29/49771 ,  Y10T29/49774 ,  Y10T29/49908

摘要： There is provided a method of assembling a carriage assembly that can crimp suspensions to carriage arms by applying ultrasonic vibration to a crimping tool without causing deformation of the suspensions and the like. The method of assembling a carriage assembly aligns attachment holes provided in front ends of carriage arms and crimping portions provided on suspensions to set the suspensions on the carriage arms and then presses a metal ball through crimping holes provided in the crimping portions while applying ultrasonic vibration to a crimping tool to crimp the suspensions to the carriage arms. The suspensions are crimped to the carriage arms by detecting stress that acts on the crimping tool when the metal ball is pressed in by the crimping tool and controlling the amplitude of the ultrasonic vibration applied to the crimping tool so as to increase and decrease in accordance with the magnitude of the stress.

摘要翻译： 提供了一种组装滑架组件的方法，其可以通过对压接工具施加超声振动而不会引起悬架等的变形而将悬架压紧到滑架臂。 组装滑架组件的方法将设置在滑架臂的前端的设置孔和设置在悬架上的压接部对准，以将悬架设置在滑架臂上，然后通过设置在压接部中的压接孔将金属球压入同时施加超声波振动 压接工具，以将悬架压紧到托架臂上。 通过检测当金属球被压接工具压入时作用在压接工具上的应力，并且控制施加到压接工具的超声波振动的振幅以按照 压力的大小。

公开(公告)号：US20070020800A1

公开(公告)日：2007-01-25

申请号：US11319652

申请日：2005-12-29

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi ,  Tatsuro Tsuneno

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi ,  Tatsuro Tsuneno

IPC分类号： H01L21/00

CPC分类号： G06K19/07749 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75314 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81

摘要： An IC chip mounting method which mounts two or more IC chips on a base, includes: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; positioning the wafer to face the base in such a direction that the mounting surface to be attached to the base faces the base; sequentially pressing the IC chips on the wafer against the base and temporarily fixing the IC chips while the base is being fed in a prescribed one-dimensional direction along the wafer and while the wafer is being moved two-dimensionally along the base; and fixing the IC chips temporarily fixed on the base on the base by heating and pressurizing in a batch manner.

公开(公告)号：US20060097028A1

公开(公告)日：2006-05-11

申请号：US11062789

申请日：2005-02-23

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

IPC分类号： B23K1/06

CPC分类号： B23K20/10 ,  B23K2101/40 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

摘要翻译： 一种超声波安装方法可以通过使用高频超声波提高安装效率，还可以安装大型半导体芯片。 该方法使用包括传播超声波振动器的超声波振动的喇叭15的超声波安装装置将半导体芯片52超声波接合到基板50，喇叭15由具有比金属更高的振动传播速度的陶瓷制成。 该方法包括以下步骤：将基板50设置在台13上，将半导体芯片52配置在基板50上，将半导体芯片52与设置在喇叭15上的凸部15a接触并施加超声波振动， 半导体芯片52到基板50。

公开(公告)号：US20060091185A1

公开(公告)日：2006-05-04

申请号：US11041301

申请日：2005-01-25

申请人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

发明人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

IPC分类号： B23K1/06

CPC分类号： H05K3/328 ,  B23K20/10 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75343 ,  H01L2224/75755 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K2201/10674 ,  H05K2203/0285 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. Portions of the circuit board, which correspond to peaks of amplitude of vibrations transmitted to the circuit board, are pressed when the ultrasonic vibrations are applied to the electronic component.

摘要翻译： 该方法能够通过施加超声波振动将电子部件牢固地安装在电路板上。 该方法包括对电子部件施加超声波振动以将电子部件倒装芯片连接到具有电极的电路板的步骤。 当将超声波振动施加到电子部件时，电路板的与发送到电路板的振动的振幅的峰值对应的部分被按压。