公开(公告)号：US20080314619A1

公开(公告)日：2008-12-25

申请号：US12076117

申请日：2008-03-13

Applicant: Ki-Hwan Kim ,  Jee-Soo Mok ,  Myung-Sam Kang

Inventor： Ki-Hwan Kim ,  Jee-Soo Mok ,  Myung-Sam Kang

IPC: B05D5/12 ,  H01B1/00 ,  B05D3/00 ,  H05K1/00 ,  H01B1/02

CPC classification number: H05K1/095 ,  H05K3/4069 ,  H05K3/4647 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2203/1461

Abstract: A conductive paste, a printed circuit board using the conductive paste, and a method of manufacturing the printed circuit board are disclosed. A conductive paste that includes conductive particles, a polymer, and a polymer foam, can reduce the number of printing repetitions, to simplify the manufacturing process, decrease process times, and improve reliability.

Abstract translation: 公开了一种导电浆料，使用导电浆料的印刷电路板以及印刷电路板的制造方法。 包括导电颗粒，聚合物和聚合物泡沫的导电糊可以减少打印重复次数，从而简化制造过程，缩短处理时间并提高可靠性。

公开(公告)号：US20080123308A1

公开(公告)日：2008-05-29

申请号：US12023616

申请日：2008-01-31

Applicant: Chang Sup Ryu ,  Myung Sam Kang

Inventor： Chang Sup Ryu ,  Myung Sam Kang

IPC: H05K7/06

CPC classification number: H05K1/185 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49101 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

Abstract translation: 公开了一种包括嵌入式无源元件的PCB及其制造方法。 PCB包括形成电路图案的至少两个电路层。 在电路层之间插入至少一个绝缘层。 一对端子通过绝缘层垂直地形成，电镀有第一导电材料，并且彼此分开预定距离。 嵌入式无源部件插入在端子之间，并且具有形成在其两侧的电极。 电极与端子分开预定距离，并通过第二导电材料与端子电连接。

公开(公告)号：US07372261B2

公开(公告)日：2008-05-13

申请号：US10629614

申请日：2003-07-30

Applicant: Won-youl Choi ,  Sang-on Choi ,  Jun-sik Hwang ,  Myung-sam Kang

Inventor： Won-youl Choi ,  Sang-on Choi ,  Jun-sik Hwang ,  Myung-sam Kang

IPC: G01R33/04

CPC classification number: G01R33/04 ,  Y10T29/49073

Abstract: A printed circuit board integrated with a two-axis fluxgate sensor includes a first soft magnetic core formed lengthwise in a first axial direction, a first excitation coil formed of a metal film and wound around the first soft magnetic core, a first pick-up coil formed of a metal film and wound around the first soft magnetic core and the first excitation coil, a second soft magnetic core formed lengthwise in a second axial direction, the second axial direction being perpendicular to the first axial direction, a second excitation coil formed of a metal film and wound around the second soft magnetic core, a second pick-up coil formed of a metal film and wound around the second soft magnetic core and the second excitation coil, and a pad for establishing conductivity between the first and second excitation coils and the first and second pick-up coils and an external circuit.

Abstract translation: 与双轴磁通门传感器集成的印刷电路板包括沿第一轴向长度形成的第一软磁芯，由金属膜形成并围绕第一软磁芯缠绕的第一励磁线圈，第一拾取线圈 由金属膜形成并缠绕在第一软磁芯和第一励磁线圈周围，第二软磁芯沿第二轴向长度方向形成，第二轴向垂直于第一轴向;第二励磁线圈，由 金属薄膜，围绕第二软磁芯缠绕，由金属薄膜构成并缠绕在第二软磁芯和第二激励线圈周围的第二拾取线圈，以及用于在第一和第二激磁线圈之间建立导电性的焊盘 以及第一和第二拾取线圈和外部电路。

公开(公告)号：US20080102410A1

公开(公告)日：2008-05-01

申请号：US11976211

申请日：2007-10-22

Applicant: Ji-Eun Kim ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Jeong-Woo Park ,  Sang-Duck Kim

Inventor： Ji-Eun Kim ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Jeong-Woo Park ,  Sang-Duck Kim

IPC: G03C5/00

CPC classification number: H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K3/108 ,  H05K3/20 ,  H05K3/4658 ,  H05K3/4697 ,  H05K2203/308 ,  H01L2224/0401

Abstract: A method of manufacturing a printed circuit board is disclosed, in which a cavity is formed for embedding a component, which includes: providing a core board, in which an inner circuit is buried; forming a first via in the core board for interlayer conduction; selectively forming a first photoresist in a position on the core board in correspondence with a position of the cavity; stacking a first build-up layer, on which a first outer circuit is formed, on the core board; and selectively removing the first build-up layer in correspondence with the position of the cavity and removing the first photoresist. Utilizing the method, a board can be manufactured with greater precision, as the thickness tolerance of the cavity may be obtained by controlling the thickness of the photoresist, and the overall thickness of the board can be controlled by controlling the height of the cavity.

Abstract translation: 公开了一种制造印刷电路板的方法，其中形成用于嵌入部件的空腔，其包括：提供其中埋入内部电路的芯板; 在芯板中形成层间导电的第一通孔; 在所述芯板上与所述腔的位置对应地选择性地形成第一光致抗蚀剂; 在芯板上堆叠形成有第一外部电路的第一堆积层; 并且与空腔的位置相对应地选择性地去除第一堆积层并除去第一光致抗蚀剂。 利用该方法，可以通过控制光致抗蚀剂的厚度来获得更高精度的板，因为通过控制光致抗蚀剂的厚度可以获得空腔的厚度公差，并且可以通过控制空腔的高度来控制板的整体厚度。

公开(公告)号：US07350296B2

公开(公告)日：2008-04-01

申请号：US11020466

申请日：2004-12-22

Applicant: Chang Sup Ryu ,  Myung Sam Kang

Inventor： Chang Sup Ryu ,  Myung Sam Kang

IPC: H01K3/10

CPC classification number: H05K1/185 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49101 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

Abstract translation: 公开了一种制造包括嵌入式无源元件的PCB的方法及其制造方法及其制造方法。 PCB包括形成电路图案的至少两个电路层。 在电路层之间插入至少一个绝缘层。 一对端子通过绝缘层垂直地形成，电镀有第一导电材料，并且彼此分开预定距离。 嵌入式无源部件插入在端子之间，并且具有形成在其两侧的电极。 电极与端子分开预定距离，并通过第二导电材料与端子电连接。

公开(公告)号：US20070065988A1

公开(公告)日：2007-03-22

申请号：US11524403

申请日：2006-09-21

Applicant: Hoe-Ku Jung ,  Myung-Sam Kang ,  Jung-Hyun Park

Inventor： Hoe-Ku Jung ,  Myung-Sam Kang ,  Jung-Hyun Park

IPC: H01L21/00

CPC classification number: H05K3/4652 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/183 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/4697 ,  H05K2201/09536 ,  H05K2203/0191 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

Abstract: A method for manufacturing a substrate having a cavity is disclosed. The method comprises: (a) forming a first circuit patter on both sides of a seed layer by use of a first dry film, the seed layer being for forming a circuit pattern on both sides; (b) laminating a second dry film on the first dry film on both sides of the seed layer, the thickness of the second dry film corresponding to the depth of the cavity to be formed; (c) laminating a dielectric layer on an area outside of where the cavity is to be formed on both sides of the seed layer, the thickness of the dielectric layer corresponding to the depth of the cavity to be formed; (d) laminating on the seed layer a copper foil laminated master having a second circuit pattern; and (e) forming the cavity by peeling off the first dry film and the second dry film after removing the seed layer. The method for manufacturing a substrate with a cavity in accordance with the present invention can improve the efficiency of a substrate manufacturing process by using both sides of a seed layer to manufacture the substrate with a cavity.

Abstract translation: 公开了一种用于制造具有空腔的衬底的方法。 该方法包括：（a）通过使用第一干膜在种子层的两侧形成第一电路图案，种子层用于在两侧形成电路图案; （b）在种子层两侧的第一干膜上层叠第二干膜，第二干膜的厚度对应于待形成的空腔的深度; （c）在种子层的两侧上在要形成空腔的区域之外的区域层叠电介质层，电介质层的厚度对应于待形成的空腔的深度; （d）在种子层上层叠具有第二电路图案的铜箔层叠主板; 和（e）通过在去除种子层之后剥离第一干膜和第二干膜来形成空腔。 根据本发明的用于制造具有空腔的基板的方法可以通过使用种子层的两面来制造具有空腔的基板来提高基板制造工艺的效率。

公开(公告)号：US20050060732A1

公开(公告)日：2005-03-17

申请号：US10704811

申请日：2003-11-12

Applicant: Myung-Sam Kang ,  Kyung-Sik Shin ,  Won-Cheol Bae ,  Chang-Sup Ryu

Inventor： Myung-Sam Kang ,  Kyung-Sik Shin ,  Won-Cheol Bae ,  Chang-Sup Ryu

IPC: G11B7/09 ,  G11B7/08 ,  G11B7/085 ,  G11B7/22 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00

CPC classification number: H05K1/165 ,  G11B7/08582 ,  G11B7/0933 ,  G11B7/0935 ,  H05K1/115 ,  H05K2201/097 ,  H05K2201/10121

Abstract: An optical pickup actuator and a method thereof includes a bobbin having a lens to scan a laser beam on a track of a disc, a winding coil moving the bobbin on the track in focusing and tracking directions, and an integrated circuit board used as the bobbin using a printed circuit board manufacturing technology and integrally formed with the winding coil in a monolithic body. The bobbin used with the optical pickup actuator includes the printed circuit board, a plurality of tracking circuit patterns formed on both surfaces of the PCB, a plurality of focusing circuit patterns formed on the both surfaces of the PCB, a plurality of via holes formed on the PCB to electrically connect the tracking circuit patterns and the focusing circuit patterns, an objective lens mounting unit formed on the PCB, and a connecting pad through which a power is supplied to the tracking and focusing circuit patterns.

Abstract translation: 一种光学拾取器致动器及其方法包括：具有用于扫描光盘轨道上的激光束的透镜的绕线管，在聚焦和跟踪方向上将线轴移动到轨道上的绕组线圈，以及用作线轴的集成电路板 使用印刷电路板制造技术，并且与卷绕线圈整体形成在一体的单体中。 与光拾取器致动器一起使用的筒管包括印刷电路板，形成在PCB的两个表面上的多个跟踪电路图案，形成在PCB的两个表面上的多个聚焦电路图案，多个通孔形成在 所述PCB用于电连接所述跟踪电路图案和所述聚焦电路图案，形成在所述PCB上的物镜安装单元和连接焊盘，通过所述连接焊盘向所述跟踪和聚焦电路图案供电。

公开(公告)号：US08677618B2

公开(公告)日：2014-03-25

申请号：US13137631

申请日：2011-08-30

Applicant: Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

Inventor： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

IPC: H05K3/02 ,  H05K3/10

CPC classification number: H05K3/0097 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/1536

Abstract: A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

Abstract translation: 使用载体制造衬底的方法，其包括制备具有释放层的载体，以及顺序地设置在释放层两侧的绝缘层和金属层; 图案化金属层以形成基极电路层; 在基极电路层上形成积层; 执行布线过程以将绝缘层与释放层分离; 以及在堆积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。

公开(公告)号：US08256112B2

公开(公告)日：2012-09-04

申请号：US12314783

申请日：2008-12-16

Applicant: Myung Sam Kang

Inventor： Myung Sam Kang

IPC: H01K3/10

CPC classification number: H05K3/205 ,  H05K3/421 ,  H05K3/428 ,  H05K2201/0376 ,  H05K2203/0156 ,  H05K2203/0353 ,  H05K2203/0376 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The present invention relates to a high density printed circuit board and a method of manufacturing the same which enable a thin printed circuit board to be manufactured and can overcome problems occurring in a conventional method of manufacturing a printed circuit board because a conventional CCL is not used as a raw material. The high density printed circuit board includes a first insulating layer having a constant thickness, and a pair of first circuit layers embedded in two sides of the first insulating layer, respectively.

Abstract translation: 高密度印刷电路板及其制造方法技术领域本发明涉及能够制造薄印刷电路板的高密度印刷电路板及其制造方法，并且可克服传统的印刷电路板的制造方法中出现的问题，因为不使用传统的CCL 作为原料。 高密度印刷电路板包括具有恒定厚度的第一绝缘层和分别嵌入第一绝缘层两侧的一对第一电路层。

公开(公告)号：US08197702B2

公开(公告)日：2012-06-12

申请号：US12508224

申请日：2009-07-23

Applicant: Myung-Sam Kang ,  Jung-Hyun Park ,  Ji-Eun Kim

Inventor： Myung-Sam Kang ,  Jung-Hyun Park ,  Ji-Eun Kim

IPC: C25D5/02 ,  B32B37/00 ,  B32B38/00

CPC classification number: B32B37/02 ,  B32B2457/08 ,  C25D5/022 ,  H05K3/205 ,  H05K3/428 ,  H05K3/4658 ,  H05K2201/0376 ,  H05K2203/0384

Abstract: Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for interlayer connection can include forming a circuit pattern on one side of a carrier, pressing one side of the carrier into one side of the insulator, removing the carrier, forming a hole penetrating through the insulator by processing one end of the circuit pattern, and forming a conductive material inside the hole to have the conductive material correspond to the via.

Abstract translation: 公开了印刷电路板的制造方法。 制造具有用于层间连接的通孔的印刷电路板的方法可以包括在载体的一侧上形成电路图案，将载体的一侧压在绝缘体的一侧，去除载体，形成贯穿该载体的孔 通过处理电路图案的一端，并且在孔内形成导电材料以使导电材料对应于通孔。