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    HYDROPHOBIC METALLIC SURFACE WITH A TUNABLE PORE-SIZE
    72.
    发明申请
    HYDROPHOBIC METALLIC SURFACE WITH A TUNABLE PORE-SIZE 审中-公开

    公开(公告)号：US20180126703A1

    公开(公告)日：2018-05-10

    申请号：US15345196

    申请日：2016-11-07

    Applicant: International Business Machines Corporation

    Inventor： Brandon M. Kobilka ,  Joseph Kuczynski ,  Jacob T. Porter ,  Jason T. Wertz

    IPC: B32B15/16 ,  C23C30/00 ,  B32B15/01

    Abstract: A process of providing a coating having a hydrophobic, electrically conductive porous metallic surface on a substrate includes forming a metal-infused plastic lattice that includes a plastic lattice infused with metal particles, and then removing the plastic lattice from the metal-infused plastic lattice. A surface of at least some of the metal particles is textured to increase hydrophobicity by exposing the surface to laser light. In some embodiments, the metal particles are exposed to laser light from a femtosecond pulse laser to produce hydrophobic metal particles before the metal-infused plastic lattice is formed. In other embodiments, the surface of at least some of the metal particles is exposed to laser light from a femtosecond pulse laser after the metal-infused plastic lattice is formed.

    SELF-HEATING SEALANT OR ADHESIVE EMPLOYING MULTI-COMPARTMENT MICROCAPSULES
    79.
    发明申请
    SELF-HEATING SEALANT OR ADHESIVE EMPLOYING MULTI-COMPARTMENT MICROCAPSULES 审中-公开

    公开(公告)号：US20180066164A1

    公开(公告)日：2018-03-08

    申请号：US15808995

    申请日：2017-11-10

    Applicant: International Business Machines Corporation

    Inventor： Eric J. Campbell ,  Joseph Kuczynski ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

    IPC: C09J11/04 ,  A61K9/50 ,  B01J13/02 ,  B01J13/22

    CPC classification number: C09J11/04 ,  A61K9/5094 ,  B01J13/02 ,  B01J13/22

    Abstract: A self-heating sealant or adhesive may be formed using multi-compartment microcapsules dispersed within a sealant or adhesive. The multi-compartment microcapsules produce heat when subjected to a stimulus (e.g., a compressive force, a magnetic field, or combinations thereof). In some embodiments, the multi-compartment microcapsules have first and second compartments separated by an isolating structure adapted to rupture in response to the stimulus, wherein the first and second compartments contain reactants that come in contact and react to produce heat when the isolating structure ruptures. In some embodiments, the multi-compartment microcapsules are shell-in-shell microcapsules each having an inner shell contained within an outer shell, wherein the inner shell defines the isolating structure and the outer shell does not allow the heat-generating chemistry to escape the microcapsule upon rupture of the inner shell.

    Active perforation for advanced server cooling
    80.
    发明授权
    Active perforation for advanced server cooling 有权

    公开(公告)号：US09907210B2

    公开(公告)日：2018-02-27

    申请号：US14751039

    申请日：2015-06-25

    Applicant: International Business Machines Corporation

    Inventor： Daniel J. Buvid ,  Eric J. Campbell ,  Tyler Jandt ,  Joseph Kuczynski

    IPC: H05K7/20

    CPC classification number: H05K7/20618 ,  H05K7/20718 ,  H05K7/20836

    Abstract: Embodiments of the present disclosure generally relate to the thermal management and regulation of electronic equipment. Microfluidic channels are utilized to actively change the aerodynamics of a surface, which may allow for the ability to change a surface texture from flat to raised, or dimpled, or from open to closed. The changing of the surface texture influences the fluid flow over or through the surface, thus allowing for thermal regulation of the surface. The thermal regulation system further controls fluid flow through an electronic device via a coating, or layer, having a plurality of active perforations thereon. The active perforations may open and close to increase and decrease the inlet of air to the system in order to help balance the back pressure in the system and redirect airflow to more sensitive system components. Active perforations may be individually opened and/or closed depending on location and system component utilization.

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