公开(公告)号：US06724661B2

公开(公告)日：2004-04-20

申请号：US10090902

申请日：2002-05-31

申请人： Yong-Kyu Lee ,  Dong-Jun Kim ,  Min-Soo Cho ,  Eui-Youl Ryu ,  Jin-Ho Kim

发明人： Yong-Kyu Lee ,  Dong-Jun Kim ,  Min-Soo Cho ,  Eui-Youl Ryu ,  Jin-Ho Kim

IPC分类号： G11C1604

CPC分类号： G11C16/14

摘要： A method for performing an erase operation in a memory cell. A first voltage and a second voltage are applied to the source and drain regions, respectively, for a predetermined erase time; and the first and second voltages are switched with each other between the source and drain regions at least one time for the erase time. Thereby, hole is easily injected to the source and drain regions and a channel lateral surface, and a uniform and high-speed erase operation is archived.

摘要翻译： 一种在存储单元中执行擦除操作的方法。 分别在源极和漏极区域施加第一电压和第二电压达预定的擦除时间; 并且第一和第二电压在源极和漏极区之间彼此切换至少一次以用于擦除时间。 因此，孔容易地注入到源极和漏极区域以及沟道横向表面，并且存储均匀且高速的擦除操作。

公开(公告)号：US09412720B2

公开(公告)日：2016-08-09

申请号：US14184951

申请日：2014-02-20

申请人： Tae-Duk Nam ,  Jin-Ho Kim ,  Hyuk-Su Kim ,  Hyoung-Suk Kim ,  Tae-Young Lee

发明人： Tae-Duk Nam ,  Jin-Ho Kim ,  Hyuk-Su Kim ,  Hyoung-Suk Kim ,  Tae-Young Lee

IPC分类号： H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L23/00 ,  H01L25/18

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32265 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/01013 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/014 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.

摘要翻译： 半导体封装可以包括封装衬底，封装衬底上的第一半导体芯片，以及封装衬底上的支撑板。 支撑板可以在相对于包装基板的表面平行的方向上与第一半导体芯片间隔开。 可以在第一半导体芯片和支撑板上设置第二半导体芯片，使得第一半导体芯片在第二半导体芯片和封装基板之间，并且支撑板位于第二半导体芯片和封装基板之间。 粘合层可以将第二半导体芯片接合到第一半导体芯片，并且可以将第二半导体芯片接合到支撑板。 此外，可以在第一半导体芯片和封装基板之间设置电耦合。

公开(公告)号：US08947468B2

公开(公告)日：2015-02-03

申请号：US13039857

申请日：2011-03-03

申请人： Jong-Man Kim ,  Kee-Hyon Park ,  Ji-Young Yi ,  Byung-Seok Min ,  Dong-Hoon Jang ,  Sung-Dae Cho ,  Hyun-Hee Park ,  Dong-Wook Kwon ,  Jin-Ho Kim

发明人： Jong-Man Kim ,  Kee-Hyon Park ,  Ji-Young Yi ,  Byung-Seok Min ,  Dong-Hoon Jang ,  Sung-Dae Cho ,  Hyun-Hee Park ,  Dong-Wook Kwon ,  Jin-Ho Kim

IPC分类号： G06F3/038 ,  G06K9/34 ,  G06K9/36 ,  G06K9/00 ,  G09G3/20

CPC分类号： G09G3/20 ,  G09G2340/145 ,  G09G2360/144 ,  G09G2360/16

摘要： A method and apparatus are provided for enhancing the readability of a character. The method includes determining ambient light of a mobile terminal and controlling background color and character color of a character image according to the determined ambient light. The method may further include performing an additional control according to the types of displays when controlling the background color and character color. Through this, it is possible to display a character image with enhanced visibility, while minimizing current consumption.

摘要翻译： 提供了一种提高字符的可读性的方法和装置。 该方法包括根据确定的环境光来确定移动终端的环境光并控制字符图像的背景颜色和字符颜色。 该方法还可以包括当控制背景颜色和字符颜色时，根据显示器的类型执行附加控制。 通过这种方式，可以显示具有增强的可视性的字符图像，同时最小化电流消耗。

公开(公告)号：US08704910B2

公开(公告)日：2014-04-22

申请号：US12704291

申请日：2010-02-11

申请人： Ji-Hye Kim ,  Sung-Dae Cho ,  Min-Kyu Park ,  Hee-Chan Park ,  Jin-Ho Kim ,  Yun-Je Oh ,  Kyoung-Tae Kim ,  Choon-Woo Kim ,  Seul-Ki Jang

发明人： Ji-Hye Kim ,  Sung-Dae Cho ,  Min-Kyu Park ,  Hee-Chan Park ,  Jin-Ho Kim ,  Yun-Je Oh ,  Kyoung-Tae Kim ,  Choon-Woo Kim ,  Seul-Ki Jang

IPC分类号： H04N9/73 ,  G06K9/00

CPC分类号： H04N9/735

摘要： An image classification apparatus and method for Automatic White Balance (AWB) are provided. An input image is divided into blocks including pluralities of pixels. A hue value and a chroma value are calculated for each of the blocks. A color-changed block is detected by calculating, for each one of the blocks, differences between the hue and chroma values calculated for all blocks adjacent to the one of the blocks and the hue and chroma values calculated for the one of the blocks. A hue variance and a chroma variance are calculated for the entire input image if a number of the detected color-changed blocks is greater than or equal to a first threshold. The input image is determined as a non-monochromatic image, if the hue variance is greater than or equal to a second threshold or the chroma variance is greater than or equal to a third threshold.

摘要翻译： 提供了一种用于自动白平衡（AWB）的图像分类装置和方法。 输入图像被分成包括多个像素的块。 为每个块计算色调值和色度值。 通过针对每个块计算针对与该一个块相邻的所有块计算的色调和色度值之间的差异以及为该块中的一个块计算的色调和色度值来检测颜色变化块。 如果检测到的颜色变化块的数量大于或等于第一阈值，则针对整个输入图像计算色调方差和色度方差。 如果色调方差大于或等于第二阈值或色度方差大于或等于第三阈值，则输入图像被确定为非单色图像。

公开(公告)号：US20140104694A1

公开(公告)日：2014-04-17

申请号：US14106084

申请日：2013-12-13

申请人： Hee-Joong Lee ,  Jin-Ho Kim ,  Sung-Hoon Hwang ,  Seung-Ki Hong

发明人： Hee-Joong Lee ,  Jin-Ho Kim ,  Sung-Hoon Hwang ,  Seung-Ki Hong

IPC分类号： G02B3/00

CPC分类号： G02B3/0006 ,  G02B7/028 ,  G02B13/0045

摘要： A projection lens unit for a pico-projector includes a plurality of plastic lenses and a single glass lens to minimize a change in focal length due to the heat generated inside the pico-projector. The lens array includes: a 1st lens with negative (−) refractive power, a 2nd lens with positive (+) refractive power, a 3rd lens with negative (−) refractive power, a 4th lens with negative (−) refractive power, and a 5th lens with positive (+) refractive power, wherein the 1st to 5th lenses are arranged in order from a screen upon which an image is projected, the 1st to 4th lenses are plastic lenses and the 5th lens is a glass lens.

摘要翻译： 用于微型投影仪的投影透镜单元包括多个塑料透镜和单个玻璃透镜，以最小化由于微型投影仪内部产生的热量引起的焦距变化。 透镜阵列包括：具有负（ - ）屈光力的第一透镜，具有正（+）屈光力的第二透镜，具有负（ - ）屈光力的第三透镜，具有负（ - ）屈光力的第四透镜，以及 具有正（+）屈光力的第5透镜，其中第1至第5透镜从投影图像的屏幕顺序排列，第1至第4透镜为塑料透镜，第5透镜为玻璃透镜。

公开(公告)号：US08455359B2

公开(公告)日：2013-06-04

申请号：US13289107

申请日：2011-11-04

申请人： Kook-Joo Kim ,  Jin-Ho Kim ,  Seung-Ki Chae ,  Pil-Kwon Jun ,  Sun-Hee Park ,  Gyoung-Eun Byun

发明人： Kook-Joo Kim ,  Jin-Ho Kim ,  Seung-Ki Chae ,  Pil-Kwon Jun ,  Sun-Hee Park ,  Gyoung-Eun Byun

IPC分类号： H01L21/44 ,  H01L21/4763

CPC分类号： H01L23/522 ,  H01L21/76829 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a method of forming a conductive pattern structure of a semiconductor device, a first insulating interlayer is formed on a substrate. A first wiring is formed to pass through the first insulating interlayer. An etch stop layer and a second insulating interlayer are sequentially formed on the first insulating interlayer. A second wiring is formed to pass through the second insulating interlayer and the etch stop layer. A dummy pattern is formed to pass through the second insulating layer and the etch stop layer at the same time as forming the second wiring. The second wiring is electrically connected to the first wiring. The dummy pattern is electrically isolated from the second wiring.

摘要翻译： 在形成半导体器件的导电图案结构的方法中，在基板上形成第一绝缘中间层。 形成第一布线以通过第一绝缘中间层。 在第一绝缘中间层上依次形成蚀刻停止层和第二绝缘中间层。 形成第二布线以通过第二绝缘中间层和蚀刻停止层。 在形成第二布线的同时，形成虚设图形以通过第二绝缘层和蚀刻停止层。 第二布线电连接到第一布线。 虚设图案与第二布线电隔离。

公开(公告)号：US08450788B2

公开(公告)日：2013-05-28

申请号：US13300818

申请日：2011-11-21

申请人： Sun-Il Shim ,  Sung-Hoi Hur ,  Jin-Ho Kim ,  Su-Youn Yi

发明人： Sun-Il Shim ,  Sung-Hoi Hur ,  Jin-Ho Kim ,  Su-Youn Yi

IPC分类号： H01L29/76

CPC分类号： H01L27/1158 ,  H01L27/11521 ,  H01L27/11524 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/11568 ,  H01L27/11578 ,  H01L29/66825 ,  H01L29/66833 ,  H01L29/7881 ,  H01L29/792 ,  H01L29/7926

摘要： A vertical NAND flash memory device includes a substrate having a face and a string of serially connected flash memory cells on the substrate. A first flash memory cell is adjacent the face, and a last flash memory cell is remote from the face. The flash memory cells include repeating layer patterns that are stacked on the face, and a pillar that extends through the series of repeating layer patterns. The pillar includes at least one oblique wall. At least two of the series of repeating layer patterns in the string are of different thicknesses. Other vertical microelectronic devices and related fabrication methods are also described.

公开(公告)号：US08406557B2

公开(公告)日：2013-03-26

申请号：US12832631

申请日：2010-07-08

申请人： Min-Kyu Park ,  Hee-Chan Park ,  Jin-Ho Kim ,  Ji-Hye Kim ,  Sung-Dae Cho ,  Moon-Gi Kang ,  Chang-Won Kim ,  Hyun-Mook Oh

发明人： Min-Kyu Park ,  Hee-Chan Park ,  Jin-Ho Kim ,  Ji-Hye Kim ,  Sung-Dae Cho ,  Moon-Gi Kang ,  Chang-Won Kim ,  Hyun-Mook Oh

IPC分类号： G06K9/40 ,  H04N9/64 ,  H04N5/217

CPC分类号： H04N5/3572

摘要： A lens shading correction method and apparatus are provided for removing vignetting occurring in digital images due to lens shading. A white image captured by an image pickup device and an image pickup unit is separated into reference white images corresponding to color channels. A vignetting center having a maximum light intensity is estimated in each of the reference white images. Multiple reference segments on each of the reference white images are defined. A lens shading correction value corresponding to each pixel constituting the reference segments are calculated using a corresponding light intensity. A lens shading correction function corresponding to each reference segment is derived using a corresponding lens shading correction value. Vignetting of a general image received in a general image processing mode is removed, using the derived multiple lens shading correction functions.

摘要翻译： 提供了一种透镜阴影校正方法和装置，用于消除由于透镜阴影而在数字图像中发生的渐晕。 由图像拾取装置和图像拾取单元拍摄的白色图像被分离为与颜色通道对应的参考白色图像。 在每个参考白色图像中估计具有最大光强度的渐晕中心。 定义每个参考白图像上的多个参考段。 使用对应的光强度计算与构成基准片段的每个像素对应的镜片阴影校正值。 使用相应的透镜阴影校正值导出与每个参考片段对应的镜片遮蔽校正功能。 使用导出的多个透镜阴影校正功能来消除在一般图像处理模式中接收的一般图像的渐晕。

公开(公告)号：US20120170133A1

公开(公告)日：2012-07-05

申请号：US13110169

申请日：2011-05-18

申请人： Hee-Joong Lee ,  Jin-Ho Kim ,  Sung-Hoon Hwang ,  Seung-Ki Hong

发明人： Hee-Joong Lee ,  Jin-Ho Kim ,  Sung-Hoon Hwang ,  Seung-Ki Hong

IPC分类号： G02B3/00

CPC分类号： G02B3/0006 ,  G02B7/028 ,  G02B13/0045

摘要： A projection lens unit for a pica-projector includes a plurality of plastic lenses and a single glass lens to minimize a change in focal length due to the heat generated inside the pico-projector. The lens array includes: a 1st lens with negative (−) refractive power, a 2nd lens with positive (+) refractive power, a 3rd fens with negative (−) refractive power, a 4th lens with negative (−) refractive power, and a 5th lens with positive (+) refractive power, wherein the 1st to 5th lenses are arranged in order from a screen upon which an image is projected, the 1st to 4th lenses are plastic lenses and the 5th lens is a glass lens.

摘要翻译： 用于微型投影仪的投影透镜单元包括多个塑料透镜和单个玻璃透镜，以最小化由于微型投影仪内部产生的热量引起的焦距变化。 透镜阵列包括：具有负（ - ）屈光力的第一透镜，具有正（+）屈光力的第二透镜，具有负（ - ）屈光力的第三透镜，具有负（ - ）屈光力的第四透镜，以及 具有正（+）屈光力的第5透镜，其中第1至第5透镜从投影图像的屏幕顺序排列，第1至第4透镜为塑料透镜，第5透镜为玻璃透镜。

公开(公告)号：US20120139125A1

公开(公告)日：2012-06-07

申请号：US13230052

申请日：2011-09-12

申请人： Tae-Ho Kang ,  Jin-Ho Kim ,  Bo-Seong Kim

发明人： Tae-Ho Kang ,  Jin-Ho Kim ,  Bo-Seong Kim

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L24/85 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/838 ,  H01L2224/85138 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Provided are a multi-chip package and a method of manufacturing the same, which can facilitate wire bonding even when an upper chip is larger than a lower chip or overhangs a lower chip. A multi-chip package includes a substrate having first and second bonding pads on a top surface thereof, a first chip connected to the first bonding pads on the substrate, an insulating layer formed on the substrate so as to surround lateral surfaces of the first chip, a set of openings formed in the insulating layer so as to expose the second bonding pads, and a second chip formed on the insulating layer and the first chip, the second chip having a larger area than the first chip and connected to the second bonding pads using wires that pass through the second openings.

摘要翻译： 提供一种多芯片封装及其制造方法，即使当上芯片大于下芯片或悬垂下芯片时，也可以促进引线键合。 一种多芯片封装，包括在其顶表面上具有第一和第二焊盘的基板，与基板上的第一焊盘连接的第一芯片，形成在基板上以围绕第一芯片的侧表面的绝缘层 ，形成在所述绝缘层中以露出所述第二接合焊盘的一组开口，以及形成在所述绝缘层和所述第一芯片上的第二芯片，所述第二芯片具有比所述第一芯片更大的面积并且连接到所述第二接合 垫使用穿过第二开口的线。