公开(公告)号：US09208931B2

公开(公告)日：2015-12-08

申请号：US12638360

申请日：2009-12-15

Applicant: Lex Kosowsky ,  Robert Fleming ,  Junjun Wu ,  Pragnya Saraf ,  Thangamani Ranganathan

Inventor： Lex Kosowsky ,  Robert Fleming ,  Junjun Wu ,  Pragnya Saraf ,  Thangamani Ranganathan

IPC: H01B1/22 ,  H01C7/108 ,  H01B1/20 ,  H01B1/24 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01C7/108 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0218 ,  H05K2201/0738 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: A composition of voltage switchable dielectric (VSD) material that comprises a concentration of core shelled particles that individually comprise a conductor core and a conductor shell, so as to form a conductor-on-conductor core shell particle constituent for the VSD material.

Abstract translation: 可变压电介质（VSD）材料的组合物，其包含单独包含导体芯和导体壳的芯壳颗粒的浓度，以形成用于VSD材料的导体导体芯壳颗粒成分。

公开(公告)号：US09053844B2

公开(公告)日：2015-06-09

申请号：US12878344

申请日：2010-09-09

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H02H9/00 ,  H01C7/10 ,  H02H3/22 ,  H01C7/12 ,  H05K1/02 ,  H05K1/16

CPC classification number: H01C7/10 ,  H01C7/12 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/167 ,  H05K2201/0738

Abstract: An electrical device that includes a first electrode and a second electrode that are separated from one another so as to form a gap structure. A layer of protective material spans the gap structure to contact the first electrode and the second electrode. A dimension of the gap structure, corresponding to a separation distance between the first electrode and the second electrode, is varied and includes a minimum separation distance that coincides with a critical path of the layer of protective material between the first electrode and the second electrode.

Abstract translation: 一种电气装置，包括彼此分离以形成间隙结构的第一电极和第二电极。 一层保护材料跨越间隙结构以接触第一电极和第二电极。 相应于第一电极和第二电极之间的间隔距离的间隙结构的尺寸是变化的并且包括与第一电极和第二电极之间的保护材料层的关键路径一致的最小间隔距离。

公开(公告)号：US20120318569A1

公开(公告)日：2012-12-20

申请号：US13597152

申请日：2012-08-28

Applicant: Robert Fleming ,  Lex Kosowsky ,  Shurui Shang ,  Bhret Graydon ,  Xiaofeng Chen ,  Glen Irvin

Inventor： Robert Fleming ,  Lex Kosowsky ,  Shurui Shang ,  Bhret Graydon ,  Xiaofeng Chen ,  Glen Irvin

IPC: G06F17/50 ,  H05K1/09 ,  H05K3/30

CPC classification number: H05K1/0259 ,  H05K1/0271 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0005 ,  H05K2201/068 ,  H05K2201/0738 ,  H05K2201/09136 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T156/10

Abstract: A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.

Abstract translation: 描述了一种用于设计符合规格的印刷电路板的方法。 第一电压可切换电介质材料与第一铜箔一起放置。 第二可电压切换电介质材料与第二铜箔一起放置。 第一铜箔的弓形部分与铝构件的第一侧相配合，粘合剂物质位于第一铜箔和铝构件的第一侧之间。 第二铜箔的弧形部分与铝构件的第二侧配合，粘合剂物质位于第二铜箔和铝构件的第二侧之间。

公开(公告)号：US20120256721A1

公开(公告)日：2012-10-11

申请号：US13524776

申请日：2012-06-15

Applicant: Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon

Inventor： Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon

IPC: H01C7/10

CPC classification number: H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0738 ,  H05K2203/105

Abstract: A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

Abstract translation: 衬底器件包括覆盖导电元件或层以提供接地的VSD材料的嵌入层。 连接到要被保护的电路元件的电极延伸到衬底的厚度以与VSD层接触。 当电路元件在正常电压下工作时，VSD层是电介质的，不连接到地。 当在电路元件上发生瞬态电事件时，VSD层立即切换到导通状态，使得第一电极连接到地。

公开(公告)号：US20120217450A1

公开(公告)日：2012-08-30

申请号：US13468896

申请日：2012-05-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B1/00 ,  H01B1/08 ,  H01B1/04 ,  B82Y30/00

CPC classification number: H01B3/006 ,  B82Y10/00 ,  H01B1/24 ,  H05K1/0254 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0738 ,  Y10T428/2991

Abstract: A voltage switchable dielectric material comprising a concentration of multi-component particles that are individually formed by a mechanical or mechanochemical bonding process that bonds a semiconductive or conductive-type host particle with multiple insulative, conductive, or semi-conductive guest particles.

Abstract translation: 一种电压可切换电介质材料，其包含通过机械或机械化学键合方法单独形成的多组分颗粒的浓度，所述机械或机械化学键合方法将半导体或导电型主体颗粒与多个绝缘，导电或半导电的客体颗粒结合。

公开(公告)号：US20120195018A1

公开(公告)日：2012-08-02

申请号：US11562222

申请日：2006-11-21

Applicant: Lex Kosowsky

Inventor： Lex Kosowsky

IPC: H05K9/00 ,  B82Y30/00

CPC classification number: G06K19/07345 ,  G06K19/07318 ,  G06K19/07735 ,  H05K1/0254 ,  H05K1/0373 ,  H05K2201/0738

Abstract: A wireless communication device, such as an RFID tag, is provided material that is dielectric, unless a voltage is applied that exceeds the materials characteristic voltage level. In the presence of such voltage, the material becomes conductive. The integration of such material into the device may be mechanical and/or electrical.

Abstract translation: 提供诸如RFID标签的无线通信设备，其是介电材料，除非施加超过材料特性电压电平的电压。 在存在这种电压的情况下，材料变得导电。 将这种材料整合到装置中可以是机械的和/或电的。

公开(公告)号：US08203421B2

公开(公告)日：2012-06-19

申请号：US12417589

申请日：2009-04-02

Applicant: Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon

Inventor： Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon

IPC: H01C7/10

CPC classification number: H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0738 ,  H05K2203/105

Abstract: A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

Abstract translation: 衬底器件包括覆盖导电元件或层以提供接地的VSD材料的嵌入层。 连接到要被保护的电路元件的电极延伸到衬底的厚度以与VSD层接触。 当电路元件在正常电压下工作时，VSD层是电介质的，不连接到地。 当在电路元件上发生瞬态电事件时，VSD层立即切换到导通状态，使得第一电极连接到地。

公开(公告)号：US07968014B2

公开(公告)日：2011-06-28

申请号：US12703674

申请日：2010-02-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B1/06 ,  H01B1/02 ,  H01B1/12 ,  H02H9/00 ,  H01C7/12 ,  H01C7/10

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract translation: 一个或多个实施例提供了一种使用具有半导体或导电材料的电压可切换介电材料的器件，该器件具有相对较高的纵横比，以便增强器件上的VSD材料的机械和电学特性。

公开(公告)号：US07923844B2

公开(公告)日：2011-04-12

申请号：US11602881

申请日：2006-11-21

Applicant: Lex Kosowsky

Inventor： Lex Kosowsky

IPC: H01L23/28

CPC classification number: H01L23/60 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/62 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/1132 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/8592 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Semiconductor devices are provided that employ voltage switchable materials for over-voltage protection. In various implementations, the voltage switchable materials are substituted for conventional die attach adhesives, underfill layers, and encapsulants. While the voltage switchable material normally functions as a dielectric cmaterial, during an over-voltage event the voltage switchable material becomes electrically conductive and can conduct electricity to ground. Accordingly, the voltage switchable material is in contact with a path to ground such as a grounded trace on a substrate, or a grounded solder ball in a flip-chip package.

Abstract translation: 提供了使用用于过电压保护的可切换电压材料的半导体器件。 在各种实施方案中，电压可切换材料代替常规的芯片附着粘合剂，底部填充层和密封剂。 虽然电压可切换材料通常用作电介质材料，但在过电压事件期间，电压可切换材料变得导电并且可以将电导向地电。 因此，电压可切换材料与衬底上的接地迹线或倒装芯片封装中的接地焊球接地。

公开(公告)号：US20110061230A1

公开(公告)日：2011-03-17

申请号：US12953158

申请日：2010-11-23

Applicant: Lex Kosowsky

Inventor： Lex Kosowsky

IPC: H01R43/00

CPC classification number: H05K1/0254 ,  C25D5/54 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2203/105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A method includes providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between the source and the voltage switchable dielectric material that is greater than the characteristic voltage. Electrical current is allowed to flow from the voltage switchable dielectric material, and the electrically conductive material is deposited on the voltage switchable dielectric material. A body comprises a voltage switchable dielectric material and a conductive material deposited on the voltage switchable dielectric material using an electrochemical process. In some cases, the conductive material is deposited using electroplating.

Abstract translation: 一种方法包括提供具有特征电压的电压可切换电介质材料，将电压可切换电介质材料暴露于与导电材料相关的离子源，并且产生电源和可切换电介质材料之间的电压差大于 特征电压。 允许电流从电压可切换介电材料流出，并且导电材料沉积在可开关电介质材料上。 身体包括电​​压可​​切换电介质材料和使用电化学过程沉积在可开关电介质材料上的导电材料。 在一些情况下，使用电镀沉积导电材料。