公开(公告)号：US06332539B2

公开(公告)日：2001-12-25

申请号：US09404658

申请日：1999-09-24

申请人： Yoshio Maruyama ,  Yoshinori Wada ,  Shinji Kadoriku ,  Osamu Yamazaki ,  Osamu Hikita ,  Daisuke Nagano

发明人： Yoshio Maruyama ,  Yoshinori Wada ,  Shinji Kadoriku ,  Osamu Yamazaki ,  Osamu Hikita ,  Daisuke Nagano

IPC分类号： B65D8586

CPC分类号： H05K13/0084

摘要： The present invention is a part retainer for housing and retaining various electronic and mechanical parts wherein a retaining unit has an engaging piece that stably stops at both a position at which it protrudes toward the opening of a part housing space and a position at which it withdraws, and which can move between these two positions under a specified or more amount of force, and wherein when protruding toward the opening, the engaging piece prevents the part housed in the housing space from falling out.

摘要翻译： 本发明是用于容纳和保持各种电子和机械部件的部件保持器，其中保持单元具有接合件，该接合件在其朝向部件容纳空间的开口突出的位置处稳定地停止， 并且能够在规定的或更多的力作用下在这两个位置之间移动，并且其中当朝向开口突出时，接合件防止容纳在容纳空间中的部分脱落。

公开(公告)号：US6145734A

公开(公告)日：2000-11-14

申请号：US835989

申请日：1997-04-11

申请人： Masahiro Taniguchi ,  Kazumi Ishimoto ,  Koichi Nagai ,  Osamu Yamazaki ,  Tatsuaki Kitagawa ,  Osamu Matsushima ,  Kazuhiro Uji ,  Seizo Nemoto

发明人： Masahiro Taniguchi ,  Kazumi Ishimoto ,  Koichi Nagai ,  Osamu Yamazaki ,  Tatsuaki Kitagawa ,  Osamu Matsushima ,  Kazuhiro Uji ,  Seizo Nemoto

IPC分类号： B23K1/008 ,  B23K3/08 ,  H05K3/34 ,  B23K1/005 ,  B23K1/012

CPC分类号： B23K3/085 ,  B23K1/008 ,  H05K3/3494 ,  B23K2201/42 ,  H05K2203/087 ,  H05K2203/304 ,  H05K3/3415 ,  H05K3/3447

摘要： For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-connected points on said one surface of the printed circuit board. This reflow method permits secure soldering even if the hot air is set at a temperature not exceeding the heat resistance of the electronic components, which is possilbe because of its combination with the radiant heat. Moreover, this reflow method can permit soldering in such a manner that only the to-be-connected points are heated selectively, because the hot air is blown locally and roughly perpendicular to the points to be connected. Thus, this reflow method prevents heat damage to other sections than the to-be-connected points and ensures that the solder at the to-be-connected points is melted.

公开(公告)号：US5999920A

公开(公告)日：1999-12-07

申请号：US837100

申请日：1997-04-14

申请人： Kenichi Sato ,  Osamu Yamazaki ,  Koichi Kanematsu ,  Yasuhiro Okada

发明人： Kenichi Sato ,  Osamu Yamazaki ,  Koichi Kanematsu ,  Yasuhiro Okada

IPC分类号： H05K13/00 ,  B65G61/00 ,  G05B19/418 ,  G06Q10/00 ,  G06Q10/06 ,  G06Q10/10 ,  G06Q50/00 ,  G06Q50/04 ,  H05K13/08 ,  G06F17/60

CPC分类号： G06Q10/043 ,  G06Q10/04 ,  G06Q10/063 ,  G06Q30/0283

摘要： A system for assisting in management of a packaging plant, according to which such information as on packaging cost, machine characteristics and surface packaging method is transformed into database, whereby the packaging cost calculation, production capacity calculation, line arrangement method, packaging method, and packaging arrangement investigation method are translated into numeral equations or software. With this system, highly accurate investigation results can be output in a short time period, thereby assisting in making an optimum management decision.

摘要翻译： 一种用于协助管理包装设备的系统，根据该系统将包装成本，机器特性和表面包装方法等信息转化为数据库，由此进行包装成本计算，生产能力计算，排线方法，包装方法和 包装安排调查方法被翻译成数字方程式或软件。 利用该系统，可以在短时间内输出高精度的调查结果，从而有助于做出最佳的管理决策。

公开(公告)号：US5562473A

公开(公告)日：1996-10-08

申请号：US294299

申请日：1994-08-23

申请人： Kiyokaza Ikeya ,  Osamu Yamazaki

发明人： Kiyokaza Ikeya ,  Osamu Yamazaki

IPC分类号： H01R33/76 ,  H01L23/32 ,  H01R13/24 ,  H05K7/10 ,  H01R13/62

CPC分类号： H01R13/2442 ,  H05K7/1023

摘要： A socket (100) for the temporary mounting of an electric part such as an IC package (130) for burn-in testing and the like is shown in which a plurality of contact elements (10, 10') are mounted in the socket each having a stationary part (10a), a spring cantilever arm part (10b) and a contact edge part (10e). The contact elements (10, 10') are mounted so that the leads (130a) of an IC package (130) are each received on a respective contact edge part (10e). When the cover (102) of the socket is closed, wall member (105a) engages the top portion of the leads (130a) and exerts a generally vertical downward force on the contact edges (10e) causing them to be depressed to effect electrical connection between leads (130a) and respective contact elements (10, 10').

摘要翻译： 示出了用于临时安装诸如用于老化测试的IC封装（130）的电气部件的插座（100）等，其中多个接触元件（10,10'）安装在插座中 具有固定部分（10a），弹簧悬臂臂部分（10b）和接触边缘部分（10e）。 接触元件（10,10'）被安装成使得IC封装（130）的引线（130a）各自容纳在相应的接触边缘部分（10e）上。 当插座的盖（102）关闭时，壁构件（105a）接合引线（130a）的顶部并且在接触边缘（10e）上施加大体上垂直的向下的力，使其被压下以实现电连接 引线（130a）和相应的接触元件（10,10'）之间。

公开(公告)号：US4731172A

公开(公告)日：1988-03-15

申请号：US856783

申请日：1986-04-17

申请人： Hideaki Adachi ,  Hidetaka Higashino ,  Tsuneo Mitsuyu ,  Osamu Yamazaki

发明人： Hideaki Adachi ,  Hidetaka Higashino ,  Tsuneo Mitsuyu ,  Osamu Yamazaki

IPC分类号： C23C14/02 ,  C23C14/08 ,  C23C14/22 ,  C23C14/35 ,  H01L21/314 ,  H01L21/316 ,  C23C14/34

CPC分类号： C23C14/225 ,  C23C14/024 ,  C23C14/088 ,  C23C14/352 ,  H01L21/02197 ,  H01L21/02266 ,  H01L21/31691

摘要： A underlying layer of multi-component material of a first formula is deposited on a substrate by controlling the amounts of sputtering materials evaporated respectively from a plurality of sputtering sources. A transition layer of multi-component material is subsequently formed on the underlying layer by controlling the amounts of the sputtering materials so that the transition layer is given a second, variable formula varying in a range from the first formula at the boundary between the underlying layer and the transition layer to a third formula. An overlying layer of multi-component material of the third formula is subsequently formed on the transition layer by controlling the amounts of the sputtering materials. Specifically, the first formula is [Pb.sub.1-(x/100) La.sub.x/100 ][Zr.sub.y/100 Ti.sub.z/100 ].sub.w O.sub.3, in which 10.ltoreq.x.ltoreq.40, y.ltoreq.5, w=1-(x/400) and y+z=100, and the third formula is [Pb.sub.1-(X/100) La.sub.X/100 ] [Zr.sub.Y/100 Ti.sub.Z/100 ].sub.W O.sub.3, in which X.ltoreq.20, 40.ltoreq.Y.ltoreq.90, W=1-(X/400) and Y+Z=100.

摘要翻译： 通过控制分别从多个溅射源蒸发的溅射材料的量，将第一配方的多组分材料的下层沉积在基板上。 随后通过控制溅射材料的量，在底层上形成多组分材料的过渡层，使得过渡层被赋予第二个可变公式，其变化范围从第一公式在下层 和过渡层到第三个公式。 随后通过控制溅射材料的量在过渡层上形成第三配方的多组分材料的上覆层。 具体地说，第一公式为[Pb1-（x / 100）Lax / 100] [Zry / 100Tiz / 100] wO3，其中10≤x≤40，y = 5，w = 1-（ x / 400）和y + z = 100，第三式为[Pb1-（X / 100）LaX / 100] [ZrY / 100TiZ / 100] WO3，其中X = 20,40 <

公开(公告)号：US4610894A

公开(公告)日：1986-09-09

申请号：US623131

申请日：1984-06-19

申请人： Kentaro Setsune ,  Osamu Yamazaki ,  Kiyotaka Wasa ,  Kazuo Tazuke

发明人： Kentaro Setsune ,  Osamu Yamazaki ,  Kiyotaka Wasa ,  Kazuo Tazuke

IPC分类号： H03H3/08 ,  H03H3/10 ,  B05D3/06

CPC分类号： H03H3/10 ,  Y10T29/42

摘要： In a method of manufacturing a surface-acoustic-wave device composed of, at least, a substrate through which a surface acoustic wave is propagated, the propagation velocity of the surface acoustic wave is adjusted by applying light directly to the surface of the substrate constituting the device or through a thin film of asymmetric lattice configuration deposited thereon by sputtering, the thin film having a thickness not exceeding a value of 0.03 times as large as the wavelength of the surface acoustic wave propagated through the substrate.

摘要翻译： 在制造表面弹性波装置的至少由表面声波传播的基板构成的表面声波装置的方法中，通过将光直接施加到构成的基板的表面来调节声表面波的传播速度 该装置或通过溅射沉积在其上的不对称晶格构造的薄膜，所述薄膜的厚度不超过通过衬底传播的声表面波的波长的0.03倍。

公开(公告)号：US4338282A

公开(公告)日：1982-07-06

申请号：US167765

申请日：1980-07-14

申请人： Setsuzo Motooka ,  Yukihiro Karigane ,  Osamu Yamazaki ,  Osamu Ochiai

发明人： Setsuzo Motooka ,  Yukihiro Karigane ,  Osamu Yamazaki ,  Osamu Ochiai

IPC分类号： D06F95/00 ,  B08B3/04 ,  A61L2/06

CPC分类号： D06F95/00

摘要： A system for selectively collecting washed articles with a washing device and conveyor to convey the articles therethrough, first and second detectors for detecting fabric faults and improperly washed articles, respectively, a device to roll the articles, a control device for controlling the washing treatment and a distributing device in response to signals generated by the detectors.

摘要翻译： 一种用洗涤装置和输送机选择性地收集被洗涤物品的系统，用于分别输送物品，第一和第二检测器，分别用于检测织物的缺陷和不正确地洗涤物品;卷装物品的装置;用于控制洗涤处理的控制装置; 响应于由检测器产生的信号的分配装置。

公开(公告)号：US4223286A

公开(公告)日：1980-09-16

申请号：US940510

申请日：1978-09-05

申请人： Shusuke Ono ,  Kenzo Ohji ,  Osamu Yamazaki ,  Kiyotaka Wasa

发明人： Shusuke Ono ,  Kenzo Ohji ,  Osamu Yamazaki ,  Kiyotaka Wasa

IPC分类号： H03H3/08 ,  H03H9/02 ,  H03H9/145 ,  H03H9/20 ,  H01L41/10 ,  H01L41/18 ,  H03H9/32

CPC分类号： H03H9/02834 ,  H03H9/02574 ,  H03H9/02779 ,  H03H9/14541

摘要： A surface acoustic wave resonator includes a base plate made of glass and a layer of piezoelectric material which has a plurality of strips extending parallel to each other for forming a reflector. A surface acoustic wave excited from a transducer reflects at each of the strips. The reflectance of such surface acoustic wave is improved by the arrangement of the strips and the thickness of the layer. On the other hand, the temperature coefficient of the resonance frequency is also improved by the arrangement of the strips and the thickness of the layer, and by the amount of the alkali metal oxide contained in the base plate, and further by the thickness of silicon oxide film laminated on the surface of the base plate.

摘要翻译： 表面声波谐振器包括由玻璃制成的基板和具有彼此平行延伸以形成反射器的多个条带的压电材料层。 从换能器激发的表面声波在每个条上反射。 这种表面声波的反射率通过条带的布置和层的厚度得到改善。 另一方面，共振频率的温度系数也通过条的排列和层的厚度以及基板中所含的碱金属氧化物的量以及硅的厚度而得到改善 氧化膜层叠在基板的表面上。

公开(公告)号：US3988232A

公开(公告)日：1976-10-26

申请号：US586754

申请日：1975-06-13

申请人： Kiyotaka Wasa ,  Kenzo Ohji ,  Osamu Yamazaki ,  Shigeru Hayakawa

发明人： Kiyotaka Wasa ,  Kenzo Ohji ,  Osamu Yamazaki ,  Shigeru Hayakawa

IPC分类号： C23C14/24 ,  C23C14/35 ,  H01J37/34 ,  H01L41/316 ,  C23C15/00

CPC分类号： C23C14/24 ,  C23C14/35 ,  H01J37/3402 ,  H01L41/316

摘要： A crystal film such as a piezoelectric crystal film is formed by sputtering of source material which is in the form of a convex curved surface or a polyhedral surface, and the formed film has crystallographic properties which can be very well controlled.

摘要翻译： 通过溅射形成凸曲面或多面体形状的源材料形成诸如压电晶体膜的晶体膜，并且所形成的膜具有可以非常好地控制的晶体学特性。

公开(公告)号：US08545663B2

公开(公告)日：2013-10-01

申请号：US11835606

申请日：2007-08-08

申请人： Osamu Yamazaki ,  Isao Ichikawa ,  Naoya Saiki

发明人： Osamu Yamazaki ,  Isao Ichikawa ,  Naoya Saiki

IPC分类号： B29C65/00 ,  C09J5/02 ,  B32B37/00 ,  C08J5/00 ,  H01L21/00

CPC分类号： H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/16 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/0715 ,  H01L2924/0675 ,  H01L2924/069 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： In a process for manufacturing a semiconductor device comprising heating a wiring board on which a chip and an uncured adhesive layer are laminated for curing the adhesive layer, the improvement includes performing a statically pressurizing step before the adhesive layer is cured, in which step the wiring board on which the chip and the uncured adhesive layer are laminated is subjected to a static pressure greater than atmospheric pressure by not less than 0.05 MPa. According to the process, voids are easily eliminated irrespective of the design of the wiring board, and the adhesive is prevented from curling up on the chip.

摘要翻译： 在制造半导体器件的方法中，包括加热其上层叠有芯片和未固化的粘合剂层的布线板以固化粘合剂层，其改进包括在粘合剂层固化之前执行静态加压步骤，其中布线 将芯片和未固化的粘合剂层层叠的板经受大于0.05MPa的大气压的静压。 根据该方法，无论布线板的设计如何，容易消除空隙，并且防止粘合剂在芯片上卷曲。