Abstract:
A frit sealing system and a method of manufacturing an organic light emitting display device by using the frit sealing system, and more particularly, a frit sealing system and a method of manufacturing an organic light emitting display device by using the frit sealing system, which includes a pressure member so as to physically pressurize a first substrate and a second substrate, thereby increasing adhesion of a frit when the first substrate and the second substrate are adhered to each other by using the frit. The frit sealing system, adhering the first substrate and the second substrate by using the frit, includes: a bed member on which the first substrate is placed; a laser irradiation member irradiating a laser to the frit between the first substrate and the second substrate; and a pressure member disposed on an upper part of the first substrate and the second substrate irradiated with the laser and adhered, thereby pressurizing the first substrate and the second substrate irradiated with the laser and adhered.
Abstract:
A strip-shaped polarizing film has a protective film strip conformably adhered to one surface thereof and a releasable liner conformably adhered to the other surface thereof and delivered from a film delivering station 1. After an appearance inspection, a lamination of the protective film strip and the polarizing film strip F is half-cut using a laser unit 11 to form an array of laminations each consisting of a protective film and a polarizing film F, with the releasable liner being left intact. Then, the polarizing films F are fed to a peeling mechanism 4. The peeling mechanism 4 feeds a forwardmost one the polarizing films F to a laminating mechanism 5 while peeling off the releasable liner therefrom by a knife-edged member. The forwardmost polarizing film F is laminated to a liquid-crystal panel W conveyed to the laminating mechanism by a panel transport apparatus 18 in synchronization of the feeding of the forwardmost polarizing film F.
Abstract:
A strip-shaped polarizing film has a protective film strip conformably adhered to one surface thereof and a releasable liner conformably adhered to the other surface thereof and delivered from a film delivering station 1. After an appearance inspection, a lamination of the protective film strip and the polarizing film strip F is half-cut using a laser unit 11 to form an array of laminations each consisting of a protective film and a polarizing film F, with the releasable liner being left intact. Then, the polarizing films F are fed to a peeling mechanism 4. The peeling mechanism 4 feeds a forwardmost one the polarizing films F to a laminating mechanism 5 while peeling off the releasable liner therefrom by a knife-edged member. The forwardmost polarizing film F is laminated to a liquid-crystal panel W conveyed to the laminating mechanism by a panel transport apparatus 18 in synchronization of the feeding of the forwardmost polarizing film F.
Abstract:
A method of manufacturing a substrate for use in electronic packaging having a core, m buildup layers on a first surface of the core and n buildup layers on a second surface of the core, where m≠n is disclosed. The method includes forming (m−n) of the m buildup layers on the first surface, and then forming n pairs of buildup layers, with each one of the pairs including one of the n buildup layers formed on the second surface and one of the remaining n of the m buildup layers formed on the first surface. Each buildup layer includes a dielectric layer and a conductive layer formed thereon. The disclosed method protects the dielectric layer in each of buildup layers from becoming overdesmeared during substrate manufacturing by avoiding repeated desmearing of dielectric materials.
Abstract:
[Objects] To make it possible to carry out automatically and accurately a laminating operation of an optical element to a sheet-shaped body.[Means for Accomplishing the Objects] A strip-shaped polarizing film has a protective film strip conformably adhered to one surface thereof and a releasable liner conformably adhered to the other surface thereof and delivered from a film delivering station 1. After an appearance inspection, a lamination of the protective film strip and the polarizing film strip F is half-cut using a laser unit 11 to form an array of laminations each consisting of a protective film and a polarizing film F, with the releasable liner being left intact. Then, the polarizing films F are fed to a peeling mechanism 4. The peeling mechanism 4 feeds a forwardmost one the polarizing films F to a laminating mechanism 5 while peeling off the releasable liner therefrom by a knife-edged member. The forwardmost polarizing film F is laminated to a liquid-crystal panel W conveyed to the laminating mechanism by a panel transport apparatus 18 in synchronization of the feeding of the forwardmost polarizing film F.
Abstract:
Provided herein are methods of polishing and texturing surfaces thin-film photovoltaic cell substrates. The methods involve laser irradiation of a surface having a high frequency roughness in an area of 5-200 microns to form a shallow and rapidly expanding melt pool, followed by rapid cooling of the material surface. The minimization of surface tension causes the surface to re-solidify in a locally smooth surface. the high frequency roughness drops over the surface with a lower frequency bump or texture pattern remaining from the re-solidification.
Abstract:
Provided herein are methods of incorporating additives into thin-film solar cell substrates and back contacts. In certain embodiments, sodium is incorporated into a substrate or a back contact of a thin-film photovoltaic stack where it can diffuse into a CIGS or other absorber layer to improve efficiency and/or growth of the layer. The methods involve laser treating the substrate or back contact in the presence of a sodium (or sodium-containing) solid or vapor to thereby incorporate sodium into the surface of the substrate or back contact. In certain embodiments, the surface is simultaneously smoothed.
Abstract:
A covering for use with a paper, cardboard, tissue or fibrous web making machine, the covering including a plurality of films laminated together, the films including a polymer material. The plurality of films each having a plurality of perforations penetrating a thickness of each film. The perforations being configured to form drainage channels through the covering. At least one of the films having perforations had filler particulates distributed through the polymer material of the film. The filler particulates having been substantially removed from the polymer material to form the perforations in the films.
Abstract:
A fabrication method of a rigid-flex circuit board is described as follows. Firstly, a flexible circuit board and at least a cover layer are provided. The cover layer covers a surface of the flexible circuit board. A protection layer is then formed on the cover layer. Next, a substrate is laminated to the surface of the flexible circuit board. The substrate has a conductive layer and a prepreg disposed between the conductive layer and the cover layer. The prepreg has an opening for accommodating the protection layer. Thereafter, the conductive layer is patterned for forming a patterned conductive layer. Afterwards, the protection layer is removed.
Abstract:
Laminated structures for use in building construction are fabricated by a manufacturing process such that the laminating steps to not require elevated drying temperatures or an extended dwell time at any point. The process employs stock materials that simultaneously reduce cost and improve performance. This is accomplished using a specially formulated viscoelastic glue and ambient temperature drying apparatus. As a result, the production capacity of the manufacturing facility, cost of goods, and delivered performance are greatly improved over existing methods.