Frit sealing system and method of manufacturing organic light emitting display device
    71.
    发明授权
    Frit sealing system and method of manufacturing organic light emitting display device 有权
    玻璃料密封系统和制造有机发光显示装置的方法

    公开(公告)号:US07942716B2

    公开(公告)日:2011-05-17

    申请号:US12378463

    申请日:2009-02-13

    Abstract: A frit sealing system and a method of manufacturing an organic light emitting display device by using the frit sealing system, and more particularly, a frit sealing system and a method of manufacturing an organic light emitting display device by using the frit sealing system, which includes a pressure member so as to physically pressurize a first substrate and a second substrate, thereby increasing adhesion of a frit when the first substrate and the second substrate are adhered to each other by using the frit. The frit sealing system, adhering the first substrate and the second substrate by using the frit, includes: a bed member on which the first substrate is placed; a laser irradiation member irradiating a laser to the frit between the first substrate and the second substrate; and a pressure member disposed on an upper part of the first substrate and the second substrate irradiated with the laser and adhered, thereby pressurizing the first substrate and the second substrate irradiated with the laser and adhered.

    Abstract translation: 玻璃料密封系统和通过使用玻璃料密封系统制造有机发光显示装置的方法,更具体地说,是玻璃料密封系统和使用玻璃料密封系统制造有机发光显示装置的方法,其包括 压力构件,以便对第一基板和第二基板进行物理加压,由此通过使用玻璃料将第一基板和第二基板彼此粘合时增加玻璃料的粘合。 玻璃料密封系统通过使用玻璃料粘合第一基板和第二基板,包括:第一基板放置在其上的床构件; 将激光照射到第一基板和第二基板之间的玻璃料的激光照射部件; 以及压力构件,其设置在所述第一基板的上部,并且所述第二基板被照射激光并粘合,从而对被所述激光照射的所述第一基板和所述第二基板加压并粘附。

    COVERING FOR PAPER MACHINE
    78.
    发明申请
    COVERING FOR PAPER MACHINE 审中-公开
    纸机盖

    公开(公告)号:US20100136286A1

    公开(公告)日:2010-06-03

    申请号:US12626071

    申请日:2009-11-25

    Abstract: A covering for use with a paper, cardboard, tissue or fibrous web making machine, the covering including a plurality of films laminated together, the films including a polymer material. The plurality of films each having a plurality of perforations penetrating a thickness of each film. The perforations being configured to form drainage channels through the covering. At least one of the films having perforations had filler particulates distributed through the polymer material of the film. The filler particulates having been substantially removed from the polymer material to form the perforations in the films.

    Abstract translation: 一种用于纸,纸板,纸巾或纤维幅材制造机的覆盖物,所述覆盖物包括层叠在一起的多个膜,所述膜包括聚合物材料。 多个薄膜各自具有贯穿每个薄膜厚度的多个穿孔。 穿孔构造成通过覆盖物形成排水通道。 具有穿孔的至少一个膜具有通过膜的聚合物材料分布的填充剂颗粒。 已经从聚合物材料基本上除去了填料颗粒,以在薄膜中形成穿孔。

    FABRICATION METHOD OF RIGID-FLEX CIRCUIT BOARD
    79.
    发明申请
    FABRICATION METHOD OF RIGID-FLEX CIRCUIT BOARD 有权
    刚性电路板的制造方法

    公开(公告)号:US20100043962A1

    公开(公告)日:2010-02-25

    申请号:US12196868

    申请日:2008-08-22

    Abstract: A fabrication method of a rigid-flex circuit board is described as follows. Firstly, a flexible circuit board and at least a cover layer are provided. The cover layer covers a surface of the flexible circuit board. A protection layer is then formed on the cover layer. Next, a substrate is laminated to the surface of the flexible circuit board. The substrate has a conductive layer and a prepreg disposed between the conductive layer and the cover layer. The prepreg has an opening for accommodating the protection layer. Thereafter, the conductive layer is patterned for forming a patterned conductive layer. Afterwards, the protection layer is removed.

    Abstract translation: 刚挠电路板的制造方法如下所述。 首先,提供柔性电路板和至少覆盖层。 覆盖层覆盖柔性电路板的表面。 然后在覆盖层上形成保护层。 接下来,将基板层压到柔性电路板的表面。 衬底具有导电层和设置在导电层和覆盖层之间的预浸料。 预浸料坯具有用于容纳保护层的开口。 此后,对导电层进行图案化以形成图案化的导电层。 之后,保护层被去除。

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