公开(公告)号：US08795845B2

公开(公告)日：2014-08-05

申请号：US12268153

申请日：2008-11-10

Applicant: John Harry Perepezko ,  Ridwan Sakidja

Inventor： John Harry Perepezko ,  Ridwan Sakidja

IPC: B32B15/01 ,  B32B15/04 ,  B32B15/18 ,  B32B15/20 ,  C23C16/06 ,  C23C16/30 ,  C23C16/28 ,  C23C28/00 ,  C23C30/00

CPC classification number: B32B15/012 ,  C23C10/34 ,  C23C10/52 ,  C23C10/58 ,  C23C10/60 ,  C23C28/321 ,  C23C28/322 ,  C23C28/325 ,  C23C28/34 ,  C23C28/345 ,  Y10T428/12458 ,  Y10T428/12493 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/12757 ,  Y10T428/12812 ,  Y10T428/12951 ,  Y10T428/12972 ,  Y10T428/26

Abstract: Methods for the low-temperature synthesis of an integrated, corrosion-resistant coating structure for metal substrates by means of multi-component pack cementation are provided. The synthesis of the integrated coating structures at low temperatures can avoid or minimize degradation of the mechanical properties of the substrates. The integrated coating structures can increase the lifetime of high temperature steels under severe steam environments and, therefore, provide a technological enabler for the high-temperature operation of steam power generation plants.

Abstract translation: 提供了通过多组分封装胶结低温合成金属基底的综合耐腐蚀涂层结构的方法。 在低温下综合涂层结构的合成可以避免或最小化基材的机械性能的降解。 一体化涂层结构可以在严酷的蒸汽环境下提高高温钢的使用寿命，从而为蒸汽发电厂的高温运行提供技术支撑。

公开(公告)号：US20140186654A1

公开(公告)日：2014-07-03

申请号：US13936352

申请日：2013-07-08

Applicant: FIH ( Hong Kong) Limited ,  SHENZHEN FUTAIHONG PRECISION INDUSTRY CO. LTD.

Inventor： CHUN-JIE ZHANG

IPC: C23C14/35 ,  C25D11/18

CPC classification number: C25D11/18 ,  C23C14/16 ,  C23C14/165 ,  C23C14/325 ,  C23C14/5853 ,  C23C28/322 ,  C23C28/345 ,  C25D11/10 ,  Y10T428/12778

Abstract: A surface treatment method for stainless steel as a colorful and smooth housing includes the steps of: a base layer including titanium is deposited on the stainless steel substrate by multi-arc ion plating. An aluminum transition layer is deposited on the titanium base layer by multi-arc ion plating, and an outermost layer including aluminum is deposited on the transition layer by magnetron sputtering. The transition layer and the outermost layer are anodized to form an anodic aluminum oxide film; and the anodic aluminum oxide film is sealed after being dyed. An article manufactured by the method is also provided.

Abstract translation: 不锈钢作为多彩光滑外壳的表面处理方法包括以下步骤：通过多弧离子电镀将包含钛的基底层沉积在不锈钢衬底上。 通过多弧离子电镀将铝过渡层沉积在钛基底层上，并且通过磁控溅射在过渡层上沉积包括铝的最外层。 过渡层和最外层被阳极化以形成阳极氧化铝膜; 在染色后将阳极氧化铝膜密封。 还提供了通过该方法制造的制品。

公开(公告)号：US20140134351A1

公开(公告)日：2014-05-15

申请号：US13968197

申请日：2013-08-15

Applicant: Applied Materials, Inc.

Inventor： Tae Hong Ha ,  Sang Ho Yu ,  Kiejin Park

IPC: C23C16/505

CPC classification number: C23C16/46 ,  C23C16/0281 ,  C23C16/16 ,  C23C16/18 ,  C23C16/505 ,  C23C16/513 ,  C23C28/322 ,  C23C28/34 ,  H01L21/28556 ,  H01L21/76841 ,  H01L21/76873 ,  H01L2221/1089

Abstract: Methods for depositing ruthenium by a PECVD process are described herein. Methods for depositing ruthenium can include positioning a substrate in a processing chamber, the substrate having a barrier layer formed thereon, heating and maintaining the substrate at a first temperature, flowing a first deposition gas into a processing chamber, the first deposition gas comprising a ruthenium containing precursor, generating a plasma from the first deposition gas to deposit a first ruthenium layer over the barrier layer, flowing a second deposition gas into the processing chamber to deposit a second ruthenium layer over the first ruthenium layer, the second deposition gas comprising a ruthenium containing precursor, depositing a copper seed layer over the second ruthenium layer and annealing the substrate at a second temperature.

Abstract translation: 本文描述了通过PECVD工艺沉积钌的方法。 用于沉积钌的方法可以包括将衬底定位在处理室中，所述衬底具有形成在其上的阻挡层，将衬底加热并保持在第一温度，使第一沉积气体流入处理室，第一沉积气体包括钌 从所述第一沉积气体产生等离子体以在所述阻挡层上沉积第一钌层，将第二沉积气体流入所述处理室以在所述第一钌层上沉积第二钌层，所述第二沉积气体包含钌 在第二钌层上沉积铜籽晶层并在第二温度下退火衬底。

公开(公告)号：US08715981B2

公开(公告)日：2014-05-06

申请号：US12694876

申请日：2010-01-27

Applicant: Jonathan Clay Claussen ,  Aaron D. Franklin ,  Timothy S. Fisher ,  D. Marshall Porterfield

Inventor： Jonathan Clay Claussen ,  Aaron D. Franklin ,  Timothy S. Fisher ,  D. Marshall Porterfield

IPC: C12N11/00 ,  C12N11/14 ,  C12N9/02 ,  C12N9/00 ,  C12N9/04 ,  C12N13/00 ,  C12M1/00 ,  C25B11/00 ,  C12Q1/26

CPC classification number: C12Q1/006 ,  C12Q1/26 ,  C23C28/322 ,  C23C28/345 ,  G01N27/3271

Abstract: Networks of single-walled carbon nanotubes (SWCNTs) decorated with Au-coated Pd (Au/Pd) nanocubes are employed as electrochemical biosensors that exhibit excellent sensitivity (2.6 mA mM−1 cm−2) and a low estimated detection limit (2.3 nM) at a signal-to-noise ratio of 3 (S/N=3) in the amperometric sensing of hydrogen peroxide. Biofunctionalization of the Au/Pd nanocube-SWCNT biosensor is demonstrated with the selective immobilization of fluorescently labeled streptavidin on the nanocube surfaces via thiol linking. Similarly, glucose oxidase (GOx) is linked to the surface of the nanocubes for amperometric glucose sensing. The exhibited glucose detection limit of 1.3_M (S/N=3) and linear range spanning from 10 μM to 50 mM substantially surpass other CNT-based biosensors. These results, combined with the structure's compatibility with a wide range of biofunctionalization procedures, would make the nanocube-SWCNT biosensor exceptionally useful for glucose detection in diabetic patients and well suited for a wide range of amperometric detection schemes for biomarkers.

Abstract translation: 用Au涂覆的Pd（Au / Pd）纳米管装饰的单壁碳纳米管（SWCNT）的网络被用作显示出优异的灵敏度（2.6mAm-1cm-2）和低估计检测限（2.3nM）的电化学生物传感器 ）在过氧化氢的电流检测中的信噪比为3（S / N = 3）。 Au / Pd纳米管SWCNT生物传感器的生物功能化通过硫醇连接在荧光标记的链霉抗生物素蛋白选择性固定在纳米管表面上得到证明。 类似地，葡萄糖氧化酶（GOx）连接到纳米管的表面用于电流葡萄糖感测。 显示的葡萄糖检测限为1.3_M（S / N = 3）和跨越10μM至50 mM的线性范围基本上超过其他基于CNT的生物传感器。 这些结果结合结构与广泛的生物功能化程序的相容性将使得纳米管SWCNT生物传感器在糖尿病患者中非常适用于葡萄糖检测，非常适用于生物标志物的广泛电流检测方案。

公开(公告)号：US20140109389A1

公开(公告)日：2014-04-24

申请号：US14145211

申请日：2013-12-31

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kouki OKAMURA

IPC: H05K13/08 ,  G01N21/84 ,  G01J5/10

CPC classification number: G01N21/84 ,  B65B15/04 ,  C23C28/322 ,  C23C28/34 ,  G01J5/10 ,  G01N29/24 ,  G01N29/2418 ,  H05K13/022 ,  H05K13/08 ,  Y10T29/49004 ,  Y10T29/53022

Abstract: A layer direction determining method and layer direction determining apparatus for a multilayer electronic component to accurately determine the layer direction of conductor layers in the multilayer electronic component, and a method and apparatus of manufacturing a series of multilayer electronic components to align the layer direction of the conductor layers in the multilayer electronic components in a certain direction.

Abstract translation: 一种多层电子部件的层方向确定方法和层方向确定装置，用于精确地确定多层电子部件中的导体层的层方向，以及制造一系列多层电子部件的方法和装置，以使层叠方向 多层电子元件中的导体层在一定方向上。

公开(公告)号：US08697249B1

公开(公告)日：2014-04-15

申请号：US13864647

申请日：2013-04-17

Applicant: Shenzhen Futaihong Precision Industry Co., Ltd. ,  FIH (Hong Kong) Limited

Inventor： Chun-Jie Zhang

IPC: B32B15/04 ,  B32B15/18 ,  B32B15/20

CPC classification number: C23C14/0682 ,  C23C14/0015 ,  C23C14/024 ,  C23C14/025 ,  C23C28/322 ,  C23C28/34 ,  C23C28/341 ,  Y10T428/12576 ,  Y10T428/12583 ,  Y10T428/12743 ,  Y10T428/12847 ,  Y10T428/12854 ,  Y10T428/12993 ,  Y10T428/24967 ,  Y10T428/265

Abstract: A coated article includes a substrate and a color layer formed on the substrate. The color layer is a chromium-aluminum-silicon layer containing chromium atoms, aluminum atoms and silicon atoms. The color layer has an L* value between about 25 to about 28, an a* value between about −1 to about −6, and a b* value between about −5 to about −9 in the CIE L*a*b* (CIE LAB) color space. A method for making the coated article is also described.

Abstract translation: 涂覆制品包括基材和形成在基材上的着色层。 着色层是含有铬原子，铝原子和硅原子的铬铝硅层。 彩色层的L *值在约25至约28之间，a *值在约-1至约-6之间，而ab *值在约5至约-9之间的CIE L * a * b *（ CIE LAB）颜色空间。 还描述了制造涂覆制品的方法。

公开(公告)号：US20140079886A1

公开(公告)日：2014-03-20

申请号：US14086350

申请日：2013-11-21

Applicant: JFE Steel Corporation

Inventor： Takeshi Suzuki ,  Norihiko Nakamura ,  Hiroki Iwasa

IPC: C23C28/00

CPC classification number: C23C28/34 ,  C23C22/20 ,  C23C28/321 ,  C23C28/322 ,  C25D5/36 ,  C25D5/48 ,  C25D5/50 ,  C25D5/505 ,  C25D9/08 ,  C25D11/34 ,  C25D11/36 ,  Y10T428/12722

Abstract: A method of producing a tinned steel sheet that includes forming an Sn-containing plating layer on at least one surface of a steel sheet with a mass per unit area of Sn is 0.05 to 20 g/m2; immersing the steel sheet in a chemical conversion solution containing 60 g/L or more and 200 g/L or less of aluminum phosphate monobasic and which has a pH of 1.5 to 2.4 or cathodically electrolyzing the steel sheet at a current density of 10 A/dm2 or less in the chemical conversion solution; and drying the steel sheet to form a chemical conversion coating.

Abstract translation: 一种包含在每单位面积Sn的质量的钢板的至少一个表面上形成含Sn镀层的镀锡钢板的制造方法为0.05〜20g / m 2; 将钢板浸渍在含有60g / L以上200g / L以下的磷酸铝一磷酸盐的化学转化处理液中，其pH为1.5〜2.4，或以10A / cm 2的电流密度阴极电解钢板， dm2以下; 并干燥钢板以形成化学转化涂层。

公开(公告)号：US08668994B2

公开(公告)日：2014-03-11

申请号：US13142002

申请日：2009-12-22

Applicant: Keisuke Yamanishi ,  Kengo Kaminaga ,  Ryo Fukuchi

Inventor： Keisuke Yamanishi ,  Kengo Kaminaga ,  Ryo Fukuchi

IPC: B32B15/20

CPC classification number: C23F1/02 ,  B32B15/01 ,  B32B15/018 ,  C22C9/00 ,  C23C22/05 ,  C23C28/00 ,  C23C28/021 ,  C23C28/023 ,  C23C28/025 ,  C23C28/321 ,  C23C28/322 ,  C23C28/3225 ,  C23C28/345 ,  C25D1/04 ,  C25D5/022 ,  C25D5/12 ,  C25D7/0614 ,  H05K1/09 ,  H05K3/06 ,  H05K3/067 ,  H05K3/384 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12535 ,  Y10T428/12792 ,  Y10T428/12861 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/24917

Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a nickel or nickel alloy layer with a lower etching rate than copper formed on an etching side of the rolled copper foil or electrolytic copper foil, and a heat resistance layer composed of zinc or zinc alloy or its oxide formed on the nickel or nickel alloy layer. This invention aims to prevent sagging caused by the etching, to form a uniform circuit having the intended circuit width, and to shorten the time of forming a circuit by etching as much as possible, when forming a circuit by etching a copper foil of the copper-clad laminate; and also aims to make the thickness of the nickel or nickel alloy layer as thin as possible, to inhibit oxidation when exposed to heat, to prevent tarnish (discoloration) known as “YAKE”, to improve the etching properties in pattern etching, and to prevent the occurrence of short circuits and defects in the circuit width.

Abstract translation: 提供一种用于通过蚀刻形成电路的电子电路的卷绕铜箔或电解铜箔，其中铜箔包括镍或镍合金层，其蚀刻速率低于在轧制的蚀刻侧上形成的铜 铜箔或电解铜箔，以及由镍或镍合金层上形成的锌或锌合金或其氧化物构成的耐热层。 本发明旨在防止蚀刻引起的下垂，形成具有预期电路宽度的均匀电路，并且通过蚀刻形成电路时可尽可能地缩短形成电路的时间，当通过蚀刻铜箔的铜箔 单层层压板 并且还旨在使镍或镍合金层的厚度尽可能薄，以防止暴露于热时的氧化，以防止称为“YAKE”的变色（变色），以提高图案蚀刻中的蚀刻性能，并且 防止电路宽度短路和缺陷的发生。

公开(公告)号：US08642187B2

公开(公告)日：2014-02-04

申请号：US12521387

申请日：2007-12-21

Applicant: Tadahiro Ohmi ,  Minoru Tahara ,  Yasuhiro Kawase

Inventor： Tadahiro Ohmi ,  Minoru Tahara ,  Yasuhiro Kawase

IPC: B32B15/00 ,  B32B15/01 ,  B32B15/04 ,  B32B15/10 ,  B32B9/00 ,  B32B19/00

CPC classification number: C23C8/02 ,  C23C14/165 ,  C23C14/5853 ,  C23C16/20 ,  C23C16/56 ,  C23C28/322 ,  C23C28/345 ,  C25D11/04 ,  C25D11/06 ,  C25D11/18 ,  H05K1/053 ,  H05K2203/0315

Abstract: A structural member for a manufacturing apparatus has a metal base member mainly composed of aluminum, a high-purity aluminum film formed on the surface of the metal base member, and a nonporous amorphous aluminum oxide passivation film which is formed by anodizing the high-purity aluminum film. A method for producing a structural member for a manufacturing apparatus, includes forming a high-purity aluminum film on the surface of a metal base member mainly composed of aluminum, and anodizing the high-purity aluminum film in a chemical conversion liquid having a pH of 4-10 and containing a nonaqueous solvent, which has a dielectric constant lower than that of water and dissolves water, thereby converting at least a surface portion of the high-purity aluminum film into a nonporous amorphous aluminum oxide passivation film.

Abstract translation: 用于制造装置的结构件具有主要由铝构成的金属基底构件，在金属基底构件的表面上形成的高纯度铝膜和通过阳极氧化高纯度形成的无孔非晶态氧化铝钝化膜 铝膜。 一种制造装置用结构构件的制造方法，其特征在于，在主要由铝构成的金属基材的表面上形成高纯度的铝膜，并将该高纯度的铝膜阳极氧化为pH为 并且含有介电常数低于水的非水溶剂，并溶解水，从而将高纯度铝膜的至少一部分表面部分转变为无孔非晶态氧化铝钝化膜。

公开(公告)号：US08622094B2

公开(公告)日：2014-01-07

申请号：US13204110

申请日：2011-08-05

Applicant: Larry Thomas Dorsch ,  William Robert Licht ,  David R. Kerstetter

Inventor： Larry Thomas Dorsch ,  William Robert Licht ,  David R. Kerstetter

IPC: F16L9/22 ,  F16L9/14

CPC classification number: C23C28/321 ,  C23C28/00 ,  C23C28/322 ,  C23C28/325 ,  C23C28/345 ,  C23C28/3455 ,  F16L13/02 ,  F16L58/08 ,  F16L58/14 ,  F16L58/181 ,  F16L59/147 ,  F16L59/20

Abstract: A method for protecting a welded pipe assembly from metal dusting and a welded pipe assembly suitable for performing the method. The welded pipe assembly comprises two pipes, weld material joining the two pipes and insulating material. The pipes are protected from metal dusting by a protective coating. The present invention is useful for conveying gases comprising carbon monoxide at temperatures greater than 425° C. while preventing metal dusting of the welded piping assembly.

Abstract translation: 一种用于保护焊接管组件免于金属粉尘的方法和适于执行该方法的焊接管组件。 焊管组件包括两根管，焊接材料连接两根管和绝缘材料。 管道通过保护涂层防止金属粉尘。 本发明可用于在大于425℃的温度下输送包含一氧化碳的气体，同时防止焊接管道组件的金属粉尘。