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    Modular information technology (IT) rack and air flow system
    72.
    发明授权
    Modular information technology (IT) rack and air flow system 有权
    模块化信息技术（IT）机架和空气流量系统

    公开(公告)号：US09380727B2

    公开(公告)日：2016-06-28

    申请号：US14506325

    申请日：2014-10-03

    Applicant: DELL PRODUCTS, L.P.

    Inventor： Edmond I. Bailey ,  Steven Embleton

    IPC: G06F1/20 ,  H05K5/00 ,  H05K7/20 ,  H05K7/14 ,  H05K13/00 ,  A47B47/00 ,  B65B13/02 ,  B65B5/06

    CPC classification number: H05K7/20736 ,  A47B47/0091 ,  B65B5/068 ,  B65B13/02 ,  H05K7/1488 ,  H05K7/1489 ,  H05K7/1491 ,  H05K7/20709 ,  H05K13/00

    Abstract: A method for designing and assembling a modular IT rack includes a manufacturer designing and constructing lightweight, modular corrugated cardboard modules/segments and corresponding banding and corner components that can be used to assemble the modular IT rack. A user/assembler of the modular IT rack assembles modular tray grouping and enclosure (MTGE) casing units using a first set of cardboard modules. The user constructs trays using a second set of cardboard modules. The user affixes cable support components to the sides of sub-groups of the constructed trays. The user encloses sub-groups of trays having the affixed cable support components within the assembled MTGE casing units to create MTGE blocks. The user vertically stacks the MTGE blocks having the tray sub-groups and the affixed cable support components enclosed within. The user aligns and secures the vertically stacked MTGE blocks in a fixed position using banding and corner components.

    Abstract translation: 一种用于设计和组装模块化IT机架的方法包括制造商设计和构造轻型，模块化瓦楞纸板模块/分段以及可用于组装模块化IT机架的相应的带状和角部组件。 模块化IT机架的用户/汇编程序使用第一组纸板模块组装模块化托盘分组和机箱（MTGE）套管单元。 用户使用第二组纸板模块构建纸盘。 用户将电缆支撑部件固定在构造的托盘的子组的侧面。 用户将具有固定的电缆支撑部件的托盘的子组包围在组装的MTGE壳体单元内以产生MTGE块。 用户垂直堆叠具有托盘子组的MTGE块和附在其中的固定电缆支撑组件。 用户使用条带和角部组件将垂直堆叠的MTGE块对齐并固定在固定位置。

    ELECTRONIC MODULE WITH LATERALLY-CONDUCTING HEAT DISTRIBUTOR LAYER
    73.
    发明申请
    ELECTRONIC MODULE WITH LATERALLY-CONDUCTING HEAT DISTRIBUTOR LAYER 有权
    具有导热热分布层的电子模块

    公开(公告)号：US20160174416A1

    公开(公告)日：2016-06-16

    申请号：US15049210

    申请日：2016-02-22

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Arvind K. SINHA ,  Kory W. WECKMAN

    IPC: H05K7/20 ,  H05K3/32

    CPC classification number: H05K7/20509 ,  H01L21/563 ,  H01L23/36 ,  H01L23/433 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/01029 ,  H01L2924/14 ,  H05K3/32 ,  H05K7/205 ,  H05K13/00 ,  Y10T29/49117 ,  H01L2924/00

    Abstract: An electronic module is provided in which a chip is disposed over a substrate and electrically connected to the substrate by a plurality of electrical connect structures disposed between the chip and the substrate. A heat distributor, fabricated of a thermally conductive material, is disposed between the chip and the substrate and sized to extend beyond an edge of the chip to facilitate conduction of heat laterally out from between the chip and substrate. The heat distributor includes openings sized and positioned to allow the electrical connect structures to pass through the heat distributor without electrically contacting the heat distributor. The heat distributor is electrically isolated from the electrical connect structures, the chip and the substrate. In one implementation, the heat distributor physically contacts a thermally conductive enclosure of the electronic module to facilitate conduction of heat from between the chip and substrate to the enclosure.

    Abstract translation: 提供了一种电子模块，其中芯片设置在衬底上并且通过设置在芯片和衬底之间的多个电连接结构电连接到衬底。 由导热材料制成的热分布器设置在芯片和基板之间，其尺寸设计成延伸超过芯片的边缘，以便于从芯片和基板之间横向导出热量。 热分配器包括尺寸和定位的开口，以允许电连接结构通过热分布器而不与热分布器电接触。 热分配器与电连接结构，芯片和基板电隔离。 在一个实施方式中，热分配器物理地接触电子模块的导热外壳，以便将热量从芯片和衬底之间传导到外壳。

    APPARATUS AND METHOD FOR UTILIZING COMMERCIAL OFF THE SHELF CIRCUIT BOARDS IN A HIGHLY KINEMATIC ENVIRONMENT
    75.
    发明申请
    APPARATUS AND METHOD FOR UTILIZING COMMERCIAL OFF THE SHELF CIRCUIT BOARDS IN A HIGHLY KINEMATIC ENVIRONMENT 有权
    在高动力环境中使用商业关闭电路板的装置和方法

    公开(公告)号：US20160128219A1

    公开(公告)日：2016-05-05

    申请号：US14926449

    申请日：2015-10-29

    Applicant: Crystal Group Inc.

    Inventor： James E. Shaw ,  Moji Hosseini

    IPC: H05K7/14 ,  H05K13/00

    CPC classification number: H05K13/00 ,  H05K7/142 ,  H05K7/1434

    Abstract: A system is disclosed which utilizes a stabilization disk 30 or rigid cup containing adhesive which is bonded to an underside of a circuit board and then bolted to a chassis of a piece of military electronic equipment, so as to create a mounting location between the circuit board and the chassis where the circuit board is lacking a regular fastener receiving mounting hole therethrough.

    Abstract translation: 公开了一种使用稳定盘30或刚性杯容纳粘合剂的系统，其结合到电路板的下侧，然后螺栓连接到一块军事电子设备的底盘，以便在电路板 以及电路板缺少通过其的安装孔的正常紧固件的底盘。

    Adjustable EMI baffling apparatus for data storage systems
    80.
    发明授权
    Adjustable EMI baffling apparatus for data storage systems 有权
    用于数据存储系统的可调式EMI挡板装置

    公开(公告)号：US09307683B2

    公开(公告)日：2016-04-05

    申请号：US14161480

    申请日：2014-01-22

    Applicant: NetApp, Inc.

    Inventor： Justin B. Mortensen ,  Robert Harvey

    IPC: G06F1/16 ,  H05K9/00 ,  G11B33/14 ,  H05K13/00

    CPC classification number: H05K9/002 ,  G11B33/1493 ,  H05K9/0018 ,  H05K13/00 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49826

    Abstract: The present invention is directed to an apparatus for reducing and constraining EMI (electronic magnetic radiation) emissions without affecting the internals of data storage system components. A baffle is attached to the exterior of the housing of a data storage system component by baffle mounts. The baffle is operable between a closed position, where the baffle blocks EMI emitted by connectors on the data storage system component, and an open position, where the connectors are not blocked allowing for servicing and cable management. The baffle may comprise an EMI absorbing material and be tuned to meet specific EMI requirements. The baffle mounts offsets the baffle from the data storage system component and the baffle includes a number of holes to allow airflow. The adjustable EMI baffling apparatus does not interfere with other mounted components while the data storage system component is mounted in a cabinet.

    Abstract translation: 本发明涉及一种用于减少和约束EMI（电子磁辐射）发射的装置，而不影响数据存储系统组件的内部。 挡板通过挡板安装在数据存储系统部件的外壳的外部。 挡板可在闭合位置（其中挡板阻挡由数据存储系统部件上的连接器发出的EMI）和打开位置之间操作，其中连接器不被阻塞，从而允许维修和电缆管理。 挡板可以包括EMI吸收材料并且被调整以满足特定的EMI要求。 挡板安装件将挡板与数据存储系统部件抵消，挡板包括许多孔以允许气流。 当数据存储系统组件安装在机柜中时，可调节EMI挡板装置不会干扰其他安装的组件。

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