公开(公告)号：US20100096163A1

公开(公告)日：2010-04-22

申请号：US12582224

申请日：2009-10-20

Applicant: Hideaki SAKAGUCHI ,  Kei Murayama

Inventor： Hideaki SAKAGUCHI ,  Kei Murayama

IPC: H05K1/11 ,  B32B38/04

CPC classification number: H05K1/0201 ,  H01L21/486 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/10329 ,  H01L2924/15311 ,  H05K1/053 ,  H05K2201/062 ,  H05K2201/09663 ,  H05K2201/10522 ,  H05K2201/10674 ,  Y10T156/1056 ,  Y10T156/1064 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A wiring board comprises a first pad which is provided on a first surface side of a substrate and on which a first electronic component is to be mounted, and a second pad which is provided on the first surface side of the substrate and on which a second electronic component having a larger amount of heat generation in an operation than that of the first electronic component is to be mounted, a first through electrode which penetrates the substrate and has one of ends connected electrically to the first pad, a second through electrode which penetrates the substrate and has one of ends connected electrically to the second pad, a through trench penetrating the substrate in a portion positioned between a first mounting region for the first electronic component and a second mounting region for the second electronic component, and a heat intercepting member provided in the through trench.

Abstract translation: 布线板包括：第一垫，其设置在基板的第一表面侧上并且第一电子部件将被安装在该第一焊盘上;第二焊盘，设置在所述基板的第一表面侧上， 要安装比第一电子部件更大量的发热量的电子部件，穿过基板并具有与第一焊盘电连接的一端的第一贯通电极，穿过第一贯通电极的第二贯通电极 所述基板具有电连接到所述第二焊盘的端部之一，穿过所述基板的通孔，位于所述第一电子部件的第一安装区域和所述第二电子部件的第二安装区域之间的部分中， 设置在通沟中。

公开(公告)号：US20100089628A1

公开(公告)日：2010-04-15

申请号：US12576572

申请日：2009-10-09

Applicant: Yoshiyuki WADA ,  Tadahiko SAKAI

Inventor： Yoshiyuki WADA ,  Tadahiko SAKAI

IPC: H05K1/16 ,  B23K37/00

CPC classification number: H05K3/3442 ,  H05K1/0227 ,  H05K1/0231 ,  H05K1/186 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613

Abstract: A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of connecting terminals; a solder part joining between electrodes and connecting terminals; and a sealing resin part filling a gap between the bottom surface of the electronic component and the front surface of the core layer and covering the resist and the solder part, to prevent a defect of a component built-in printed circuit substrate.

Abstract translation: 核心层在其前表面上形成一对形成布线图案的连接电极和形成在该对电极之间的抗蚀剂; 具有一对连接端子的电子部件; 连接电极和连接端子之间的焊料部分; 以及密封树脂部分，填充电子部件的底表面和芯层的前表面之间的间隙并覆盖抗蚀剂和焊料部分，以防止组件内置印刷电路基板的缺陷。

公开(公告)号：US20100084176A1

公开(公告)日：2010-04-08

申请号：US12244854

申请日：2008-10-03

Applicant: Tae Hong Kim

Inventor： Tae Hong Kim

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/09663 ,  Y10T29/49155

Abstract: The stopband characteristics of an electromagnetic bandgap structure in a printed circuit board may be preserved by selectively forming slots in an additional conductive layer of the printed circuit board. For example, an electromagnetic bandgap structure may include a layer with a continuous conductive region and another layer with a periodically patterned region having a plurality of spaced-apart patches interconnected by branches. Additional conductive layers may be included within the printed circuit board without neutralizing the bandgap by forming slots in the conductive layers in general alignment with spaces between the patches.

Abstract translation: 可以通过在印刷电路板的附加导电层中选择性地形成槽来保留印刷电路板中的电磁带隙结构的阻带特性。 例如，电磁带隙结构可以包括具有连续导电区域的层和具有周期性图案化区域的另一层，其具有通过分支互连的多个间隔开的贴片。 附加的导电层可以包括在印刷电路板中，而不会通过在导电层中形成与填隙之间的空间对准的槽而中和带隙。

公开(公告)号：US07685704B2

公开(公告)日：2010-03-30

申请号：US11760004

申请日：2007-06-08

Applicant: Bong Hwan Kim ,  Jong Bok Kim

Inventor： Bong Hwan Kim ,  Jong Bok Kim

IPC: H01R9/00 ,  H05K3/00

CPC classification number: H05K3/4007 ,  G01R1/07342 ,  G01R3/00 ,  H05K3/4092 ,  H05K2201/0367 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: A method for manufacturing a bump of a probe card is disclosed. In accordance with the present invention, the bump has a high aspect ratio, a high elasticity, a high durability suitable for testing a high speed device. The bump is formed using a sacrificial substrate as a mold to have a shape of Π or II for elasticity and durability.

Abstract translation: 公开了一种用于制造探针卡的凸块的方法。 根据本发明，凸块具有高纵横比，高弹性，适合于测试高速装置的高耐久性。 使用牺牲基板作为模具形成凸起以具有＆Pgr的形状; 或II弹性和耐久性。

公开(公告)号：US20100033272A1

公开(公告)日：2010-02-11

申请号：US12228380

申请日：2008-08-11

Applicant: John B. O'Connell ,  Bruce L. Blaser

Inventor： John B. O'Connell ,  Bruce L. Blaser

IPC: H01P1/16 ,  H01P11/00

CPC classification number: H01P5/103 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  Y10T29/49016

Abstract: A bandgap surface for use in a waveguide transition module. The surface may be constructed with a ground plane; a capacitive layer including a plurality of capacitive elements arranged in a polar configuration within a common plane, and spaced apart from said ground plane; and a plurality of electrically conductive vias formed within a dielectric layer of material that conductively couple said ground plane to each of said capacitive elements.

Abstract translation: 用于波导过渡模块的带隙表面。 表面可以用地平面构成; 电容层，包括以公共平面内的极性配置布置并与所述接地平面间隔开的多个电容元件; 以及形成在材料的电介质层内的多个导电通孔，其导电地将所述接地平面耦合到每个所述电容元件。

公开(公告)号：US20100030513A1

公开(公告)日：2010-02-04

申请号：US12329730

申请日：2008-12-08

Applicant: Ming-Chin TSAI

Inventor： Ming-Chin TSAI

IPC: G01B21/00 ,  G06F15/00

CPC classification number: H05K3/0005 ,  H05K1/0262 ,  H05K1/115 ,  H05K2201/093 ,  H05K2201/09663

Abstract: A method for disposing power planes and ground planes of a printed circuit board (PCB), said method comprising the steps of: providing a PCB on which is disposed with a geometric layout and a via hole; providing a line on said PCB for intersecting said geometric layout to form a plurality of points of intersection; defining line segments by segmenting said line at each of said points of intersection to form a plurality of line segments; deleting some of said line segments having one end not being point of intersection for said geometric layout to form a plurality of segmented regions; searching a closed region by repeatedly searching region from any one of the points in said plurality of segmented regions; determining whether a closed region is a smallest closed region; determining whether a via hole is located within said smallest closed region.

Abstract translation: 一种用于布置印刷电路板（PCB）的电源平面和接地平面的方法，所述方法包括以下步骤：提供PCB，其上布置有几何布局和通孔; 在所述PCB上提供一条线，用于与所述几何布局相交以形成多个交点; 通过在每个所述交叉点处分割所述线来形成多个线段来定义线段; 删除一些所述线段，其一端不是所述几何布局的交点，以形成多个分段区域; 通过从所述多个分割区域中的任何一个点反复搜索区域来搜索封闭区域; 确定封闭区域是否是最小的封闭区域; 确定通孔是否位于所述最小封闭区域内。

公开(公告)号：US20100014035A1

公开(公告)日：2010-01-21

申请号：US12505132

申请日：2009-07-17

Applicant: Ryujiro TAKAMATSU

Inventor： Ryujiro TAKAMATSU

IPC: G02F1/1333 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/0216 ,  H05K1/0215 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/10409 ,  Y10T29/49124

Abstract: A printed circuit board for mounting electronic parts thereon includes a ground portion formed on the printed circuit board and connected to an outer ground. A plurality of conductive ground layers are stacked so as to interpose an insulation layer therebetween. An upper conductive ground layer includes first and second conductive ground portions. The first and second ground portions are connected by a connecting element. Another conductive ground layer under the upper conductive ground layer is grounded via the first and second ground portions of the upper conductive ground layer via a through hole provided in the ground portion.

Abstract translation: 用于在其上安装电子部件的印刷电路板包括形成在印刷电路板上并连接到外部接地的接地部分。 堆叠多个导电接地层，以便在它们之间插入绝缘层。 上导电接地层包括第一和第二导电接地部分。 第一和第二接地部分通过连接元件连接。 上导电接地层下的另一导电接地层经由设置在接地部分中的通孔经由上导电接地层的第一和第二接地部分接地。

公开(公告)号：US20090284484A1

公开(公告)日：2009-11-19

申请号：US12318282

申请日：2008-12-23

Applicant: Min Woo Hwang ,  Tae Hoon Kim ,  Hyeong Dong Kim

Inventor： Min Woo Hwang ,  Tae Hoon Kim ,  Hyeong Dong Kim

IPC: G06F3/041

CPC classification number: H05K3/361 ,  G06F3/0416 ,  H05K1/117 ,  H05K3/323 ,  H05K2201/09663

Abstract: A touch panel integrated flat display device capable of improving reliability is disclosed.The touch panel integrated flat display device includes a display panel, a touch panel disposed on the display panel, and a flexible circuit board electrically connecting a drive PCB and the touch panel to supply a drive signal of the touch panel. In the touch panel integrated flat display device, a plurality of touch panel pads contacting a plurality of flexible circuit board pads are formed at a side of the touch panel, and each of the touch panel pads has at least two contact areas with each of the flexible circuit board pads.

Abstract translation: 公开了一种能够提高可靠性的触摸面板集成平板显示装置。 触摸面板集成平板显示装置包括显示面板，设置在显示面板上的触摸面板，以及柔性电路板，电连接驱动PCB和触摸面板，以提供触摸面板的驱动信号。 在触摸面板集成平板显示装置中，在触摸面板的一侧形成有与多个柔性电路板焊盘接触的多个触摸面板焊盘，并且每个触摸面板焊盘具有至少两个接触区域 柔性电路板焊盘。

公开(公告)号：US20090255720A1

公开(公告)日：2009-10-15

申请号：US12284677

申请日：2008-09-24

Applicant: Hsin-Chia Lu ,  Tsung-Yi Chou

Inventor： Hsin-Chia Lu ,  Tsung-Yi Chou

IPC: H05K1/11

CPC classification number: H05K1/0253 ,  H05K1/0219 ,  H05K2201/09236 ,  H05K2201/09663

Abstract: A ground-plane slotted type signal transmission circuit board is proposed, which is designed for use with a high-speed digital signal processing system for providing a low-loss signal transmission function. The proposed circuit board structure is characterized by the formation of a slotted structure (i.e., elongated cutaway portion) in the ground plane at the beneath of each signal line. Since the slotted structure is a void portion, the electric field of a gigahertz signal being transmitting through the overlaying signal line would be unable to induce electric currents in the void portion of the ground plane. This feature allows the prevention of a leakage current that would otherwise flow from the signal line to the ground plane, and therefore can help prevent unnecessary power loss of the transmitted signal.

Abstract translation: 提出了一种地平面开槽型信号传输电路板，其设计用于与用于提供低损耗信号传输功能的高速数字信号处理系统一起使用。 所提出的电路板结构的特征在于在每个信号线的下方的接地平面中形成开槽结构（即，细长的切除部分）。 由于开槽结构是空隙部分，通过覆盖信号线传输的千兆赫信号的电场将不能在接地平面的空隙部分中感应出电流。 该特征允许防止否则将从信号线流向接地平面的漏电流，因此可以有助于防止发射信号的不必要的功率损失。

公开(公告)号：US20090237903A1

公开(公告)日：2009-09-24

申请号：US12400076

申请日：2009-03-09

Applicant: Hiroyuki Onodera

Inventor： Hiroyuki Onodera

IPC: H05K7/00

CPC classification number: H05K3/361 ,  G02F1/1345 ,  G02F2001/13456 ,  H05K1/0219 ,  H05K1/117 ,  H05K2201/0769 ,  H05K2201/094 ,  H05K2201/09663 ,  H05K2201/09781

Abstract: A mounting structure includes: a first substrate; a second substrate; a first terminal being formed on the first substrate and having a plurality of terminal portions arranged with a gap therebetween; a different terminal being formed on the first substrate and being adjacent to the first terminal; and a second terminal being formed on the second substrate and being electrically connected to at least one of the terminal portions of the first terminal. Here, the first terminal is supplied with a potential higher than that supplied to the different terminal.

Abstract translation: 安装结构包括：第一基板; 第二基板; 第一端子形成在第一基板上，并且具有多个端子部分，间隔开间隔开; 不同的端子形成在第一基板上并且与第一端子相邻; 以及第二端子，形成在所述第二基板上并且电连接到所述第一端子的至少一个端子部分。 这里，第一端子被提供有比提供给不同端子的电位更高的电位。