公开(公告)号：US3194876A

公开(公告)日：1965-07-13

申请号：US25540863

申请日：1963-01-31

Applicant: SPRAGUE ELECTRIC CO

Inventor： HARRISON REGINALD J

IPC: H01C1/14 ,  H01G2/06 ,  H05K1/18 ,  H05K3/30 ,  H05K7/12

CPC classification number: H01G2/06 ,  H01C1/14 ,  H05K1/18 ,  H05K3/301 ,  H05K7/12 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10651

公开(公告)号：US3039177A

公开(公告)日：1962-06-19

申请号：US67484557

申请日：1957-07-29

Applicant: ITT

Inventor： BURDETT RHODES B

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/20 ,  H05K3/28

CPC classification number: H05K3/0014 ,  H05K1/145 ,  H05K1/189 ,  H05K3/205 ,  H05K3/284 ,  H05K2201/046 ,  H05K2201/052 ,  H05K2201/09118 ,  H05K2201/10651 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0726 ,  H05K2203/1105 ,  H05K2203/1316 ,  H05K2203/302 ,  Y10T29/49158 ,  Y10T29/4981 ,  Y10T29/49812

公开(公告)号：US2958065A

公开(公告)日：1960-10-25

申请号：US79999359

申请日：1959-03-17

Applicant: FLANAGAN JR WILLIAM H

Inventor： FLANAGAN JR WILLIAM H

IPC: H01R12/00 ,  H01R12/50 ,  H01R12/70 ,  H05K3/30

CPC classification number: H05K3/308 ,  H01R12/7076 ,  H05K2201/10053 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2203/1446

公开(公告)号：US2927251A

公开(公告)日：1960-03-01

申请号：US50455655

申请日：1955-04-28

Applicant: BURROUGHS CORP

Inventor： PAUL JONES JOHN ,  SPRUDE EDGAR O

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K3/3405 ,  H05K1/18 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/09172 ,  H05K2201/10287 ,  H05K2201/10446 ,  H05K2201/10651

公开(公告)号：US2893006A

公开(公告)日：1959-07-07

申请号：US73248658

申请日：1958-05-02

Applicant: PHILCO CORP

Inventor： WALTER STUHRE

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2203/1446 ,  Y10T29/4914 ,  Y10T29/49908

公开(公告)号：US2892131A

公开(公告)日：1959-06-23

申请号：US40454954

申请日：1954-01-18

Applicant: DIGITAL CONTROL SYSTEMS INC

Inventor： MACDONNELL GORDON S

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/189 ,  H05K3/0058 ,  H05K2201/09018 ,  H05K2201/10651 ,  H05K2201/2009

公开(公告)号：US12051547B2

公开(公告)日：2024-07-30

申请号：US18124620

申请日：2023-03-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuichiro Tanaka ,  Hiroki Awata

IPC: H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H05K1/18

CPC classification number: H01G4/2325 ,  H01G4/248 ,  H05K1/185 ,  H01G4/30 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651

Abstract: A component built-in substrate includes a multilayer body and a substrate including a multilayer ceramic electronic component embedded therein. The multilayer ceramic electronic component includes a first connection portion that protrudes from the first external electrode, and a second connection portion that protrudes from the second external electrode. The substrate includes a core material. The multilayer ceramic electronic component including the first connection portion and the second connection portion includes a surface covered by the core material and embedded in the substrate. The first connection portion protrudes toward a surface of the substrate, and is not exposed at the surface of the substrate. The second connection portion protrudes toward the surface of the substrate, and is not exposed at the surface of the substrate.

公开(公告)号：US20240206074A1

公开(公告)日：2024-06-20

申请号：US18459316

申请日：2023-08-31

Applicant: Kioxia Corporation

Inventor： Koji UENO

IPC: H05K1/18

CPC classification number: H05K1/182 ,  H05K2201/09072 ,  H05K2201/09163 ,  H05K2201/10015 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/10757

Abstract: A semiconductor storage device including a board, an electronic component, and a holder. The board has a region with an opening. The electronic component includes a component body disposed in the opening and a lead protruding from the component body and connected to the board. The holder is disposed in the opening and supports the component body. The region includes first and second edges on either side of the opening, the first and second edges extending along a first direction and separated from each other in a second direction crossing the first direction. The holder includes a holder body at least partially formed in an annular shape and into which the component body is inserted, a first groove extending along the first direction and engaged with the first edge, and a second groove extending along the first direction and engaged with the second edge.

公开(公告)号：US20240107661A1

公开(公告)日：2024-03-28

申请号：US18472051

申请日：2023-09-21

Applicant: KYOCERA Document Solutions Inc.

Inventor： Shotaro Ikegami

IPC: H05K1/02

CPC classification number: H05K1/0231 ,  H05K2201/09345 ,  H05K2201/09618 ,  H05K2201/09636 ,  H05K2201/10159 ,  H05K2201/10651

Abstract: A signal processing board includes a six-layer substrate. A plurality of signal transmission planes are formed in a first layer, a third layer, a fourth layer, and a sixth layer. A first ground plane is formed in a second layer. A first power supply plane is formed in a fifth layer and electrically connected to the first semiconductor element. A second power supply plane is formed in the fifth layer and electrically connected to the second semiconductor element. A second ground plane is formed in the fifth layer. A first bypass capacitor is electrically connected to the first power supply plane and the second ground plane. A second bypass capacitor is electrically connected to the second power supply plane and the second ground plane.

公开(公告)号：US11665831B2

公开(公告)日：2023-05-30

申请号：US17027932

申请日：2020-09-22

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

Inventor： Jian Wang ,  Mei Yang

IPC: H05K3/30 ,  H05K3/00 ,  H05K3/24 ,  H05K3/32

CPC classification number: H05K3/305 ,  H05K3/0017 ,  H05K3/241 ,  H05K3/321 ,  H05K2201/10651

Abstract: A method for manufacturing a circuit board with nickel resistor embedded therein provides a copper substrate, the copper substrate includes a copper foil. A nickel resistance layer is formed on the copper foil. A first dielectric layer and a first copper layer are formed on the nickel resistance layer. The copper foil and the first copper layer are etched to form a first conductive wiring layer and a second conductive wiring layer respectively, the nickel layer not being subjected to an etching process, to obtain the finished circuit board.