公开(公告)号：US09673381B2

公开(公告)日：2017-06-06

申请号：US14803197

申请日：2015-07-20

Applicant: Haidou Wang ,  Zhiguo Xing ,  Binshi Xu

Inventor： Haidou Wang ,  Zhiguo Xing ,  Binshi Xu

IPC: G01L3/08 ,  H01L41/187 ,  G01L1/16 ,  H01L41/08 ,  H01L41/314 ,  C23C4/06 ,  C23C28/02 ,  C23C4/134 ,  G01M99/00 ,  G01N29/24 ,  G01N27/04 ,  G01L5/00 ,  G01M5/00 ,  G01N3/36

CPC classification number: H01L41/1875 ,  C23C4/06 ,  C23C4/134 ,  C23C28/021 ,  C23C28/027 ,  G01L1/16 ,  G01L5/0019 ,  G01M5/0033 ,  G01M99/00 ,  G01N3/36 ,  G01N27/041 ,  G01N29/24 ,  G01N2203/0623 ,  H01L41/0805 ,  H01L41/314

Abstract: The invention provides a lead titanate coating and a preparing method thereof. According to the method, mixed powder is sprayed on the surface of a matrix, and through polarization, the lead titanate coating is acquired. The mixed powder comprises PbTiO3 powder, PbO powder and Al powder. Lead titanate (PbTiO3) is a kind of ferroelectric material, and can be used for preparing a piezoelectric sensor. Besides, the PbO powder and the Al powder are added, so that the piezoelectric property of the lead titanate coating can be improved. Since the lead titanate coating prepared by the present invention can be combined with the matrix closely and the intensity of piezoelectric signal is high, it can be widely applied to mechanical parts, such as a piston ring, a cylinder, a gear, and the like, to dynamically monitor the service situations of the parts better.

公开(公告)号：US20170096006A1

公开(公告)日：2017-04-06

申请号：US15278673

申请日：2016-09-28

Applicant: SEIKO EPSON CORPORATION

Inventor： Masao NAKAYAMA ,  Eiju HIRAI ,  Naoto YOKOYAMA ,  Motoki TAKABE ,  Toshihiro SHIMIZU

IPC: B41J2/14 ,  H01L41/314 ,  H01L41/187 ,  H01L41/047 ,  H01L41/08

CPC classification number: B41J2/14209 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2002/14241 ,  B41J2002/14419 ,  B41J2002/14491 ,  H01L41/0471 ,  H01L41/0472 ,  H01L41/0477 ,  H01L41/0478 ,  H01L41/0805 ,  H01L41/0815 ,  H01L41/1876 ,  H01L41/314 ,  H01L41/319 ,  H01L41/332

Abstract: Provided is a piezoelectric element including: a first electrode; a piezoelectric layer which is provided over the first electrode; and a second electrode provided on a side of the piezoelectric layer opposite to the first electrode, in which the second electrode includes a first layer which is provided on the piezoelectric layer side, and a second layer which is provided on a side of the first layer opposite to the piezoelectric layer, and the second layer does not contain platinum and covers an end portion of the first layer.

公开(公告)号：US09608589B2

公开(公告)日：2017-03-28

申请号：US12911986

申请日：2010-10-26

Applicant: Kevin J. Grannen ,  Chris Feng ,  Phil Nikkel ,  John Choy

Inventor： Kevin J. Grannen ,  Chris Feng ,  Phil Nikkel ,  John Choy

IPC: H03H3/02 ,  H01L41/314 ,  H01L41/317 ,  H03H9/17

CPC classification number: H03H3/02 ,  H01L41/314 ,  H01L41/317 ,  H01L41/319 ,  H03H9/173 ,  H03H9/175 ,  H03H2003/021 ,  H03H2003/025 ,  Y10T29/42

Abstract: A method of forming an acoustic resonator includes forming a seed layer on a first electrode layer, forming a piezoelectric layer directly on a surface of the seed layer, and forming a second electrode layer on the piezoelectric layer. The piezoelectric layer includes multiple crystals of piezoelectric material, and the seed layer causes crystal axis orientations of the crystals to be substantially perpendicular to the surface of the seed layer.

公开(公告)号：US20160339702A1

公开(公告)日：2016-11-24

申请号：US15230969

申请日：2016-08-08

Applicant: CANON KABUSHIKI KAISHA

Inventor： Motokazu Kobayashi ,  Yoshinori Kotani ,  Naoyuki Koketsu

IPC: B41J2/14 ,  H01L41/08 ,  H01L41/314 ,  H01L41/187

CPC classification number: B41J2/14233 ,  B41J2/161 ,  B41J2/164 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2002/1425 ,  H01L41/0805 ,  H01L41/0973 ,  H01L41/1876 ,  H01L41/314 ,  H01L41/317

Abstract: A piezoelectric thin film is manufactured by sequentially executing: a step of coating a substrate by applying a coating solution containing an organic solvent and a piezoelectric thin film precursor to form a coating layer; a step of evaporating the organic solvent from the coating layer in a windless environment to obtain a dried coating layer containing the piezoelectric thin film precursor; and a step of heating the dried coating layer to form a piezoelectric thin film from the dried coating layer containing the piezoelectric thin film precursor.

公开(公告)号：US09461239B2

公开(公告)日：2016-10-04

申请号：US14160701

申请日：2014-01-22

Applicant: Xianfeng Chen

Inventor： Xianfeng Chen

IPC: H01L41/314 ,  H01L41/318 ,  H01L41/331 ,  H01L41/09 ,  H01L41/187

CPC classification number: H01L41/314 ,  H01L41/0973 ,  H01L41/1876 ,  H01L41/318 ,  H01L41/331

Abstract: A method of heating includes a process of forming a layer to be heated on one surface of a light absorption layer; and a process of heating the light absorption layer by irradiating light onto the other surface of the light absorption layer. The other surface of the light absorption layer is a surface opposite to the one surface of the light absorption layer.

Abstract translation: 加热方法包括在光吸收层的一个表面上形成被加热层的工序; 以及通过将光照射到光吸收层的另一个表面上来加热光吸收层的工艺。 光吸收层的另一个表面是与光吸收层的一个表面相对的表面。

公开(公告)号：US09437831B2

公开(公告)日：2016-09-06

申请号：US14553251

申请日：2014-11-25

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Masakatsu Ohno ,  Hiroki Adachi ,  Satoru Idojiri ,  Koichi Takeshima

IPC: H01L23/52 ,  H01L51/00 ,  H01L51/56 ,  H01L51/52 ,  H01L51/50 ,  H01L41/314 ,  H01L27/32

CPC classification number: H01L27/3272 ,  B23K26/04 ,  B23K26/0617 ,  B23K26/0622 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/083 ,  H01L27/1225 ,  H01L27/1266 ,  H01L27/322 ,  H01L27/3244 ,  H01L27/3258 ,  H01L27/3262 ,  H01L29/24 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/7869 ,  H01L41/314 ,  H01L51/0024 ,  H01L51/0027 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/5096 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5284 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  H01L2251/558 ,  Y02E10/549 ,  Y02P70/521

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

Abstract translation: 在第一基板上形成第一有机树脂层; 在第一有机树脂层上形成第一绝缘膜; 第一元件层形成在第一绝缘膜上; 在第二基板上形成第二有机树脂层; 在第二有机树脂层上形成第二绝缘膜; 第二元件层形成在第二绝缘膜上; 第一基板和第二基板接合; 第一分离步骤，其中第一有机树脂层和第一基板之间的粘合力减小; 第一有机树脂层和第一柔性基板与第一接合层接合; 第二分离步骤，其中所述第二有机树脂层和所述第二基板之间的粘合减小; 并且第二有机树脂层和第二柔性基板与第二接合层接合。

公开(公告)号：US09385303B2

公开(公告)日：2016-07-05

申请号：US14073509

申请日：2013-11-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： In Sang Song ,  Ho Soo Park ,  Duck Hwan Kim ,  Chul Soo Kim ,  Sang Uk Son ,  Jea Shik Shin ,  Moon Chul Lee

IPC: H03H9/15 ,  H03H9/00 ,  H01L41/22 ,  H01L41/314 ,  H03H9/13 ,  H03H9/17

CPC classification number: H01L41/314 ,  H03H9/132 ,  H03H9/174 ,  H03H9/175

Abstract: Provided are a resonator and a method of fabricating the same. The resonator may include a first electrode disposed on a substrate, a piezoelectric layer disposed on the first electrode, a second electrode disposed on the piezoelectric layer, and a control layer disposed on the second electrode and having a frame with an uneven surface.

Abstract translation: 提供一种谐振器及其制造方法。 谐振器可以包括设置在基板上的第一电极，设置在第一电极上的压电层，设置在压电层上的第二电极，以及设置在第二电极上并具有不平坦表面的框架的控制层。

公开(公告)号：US09263664B1

公开(公告)日：2016-02-16

申请号：US14529886

申请日：2014-10-31

Applicant: International Business Machines Corporation

Inventor： Brian A. Bryce ,  Josephine B. Chang ,  Matthew W. Copel ,  Marcelo A. Kuroda

IPC: H01L29/84 ,  H01L41/314 ,  H01L41/08 ,  H01L41/083

CPC classification number: H01L41/0805 ,  H01L41/02 ,  H01L41/0477 ,  H01L41/314 ,  H01L49/00

Abstract: A semiconductor device, a piezoelectronic transistor (PET) device, and a method of fabricating the PET device are described. The method includes forming a first stack of dielectric layers, forming a first metal layer over the first stack, forming a piezoelectric (PE) material on the first metal layer, and forming a second metal layer on the PE material. The method also includes forming a piezoresistive (PR) element on the second metal layer through a gap in a first membrane formed a distance d above the second metal layer.

公开(公告)号：US09231185B2

公开(公告)日：2016-01-05

申请号：US13137202

申请日：2011-07-27

Applicant: Fumimasa Horikiri ,  Kenji Shibata ,  Kazufumi Suenaga ,  Kazutoshi Watanabe ,  Akira Nomoto

Inventor： Fumimasa Horikiri ,  Kenji Shibata ,  Kazufumi Suenaga ,  Kazutoshi Watanabe ,  Akira Nomoto

IPC: H01B13/00 ,  H01L41/08 ,  H05K3/10 ,  H01L21/67 ,  H01L41/187 ,  H01L41/332 ,  H01L41/314 ,  H01L41/316 ,  H01L41/318

CPC classification number: H01L41/0805 ,  H01L21/67069 ,  H01L41/1873 ,  H01L41/314 ,  H01L41/316 ,  H01L41/318 ,  H01L41/332 ,  H05K3/108 ,  Y10T428/24479

Abstract: A method for manufacturing a piezoelectric film wafer includes a first processing step for carrying out an ion etching on a KNN piezoelectric film formed on a substrate by using a gas containing Ar, and a second processing step for carrying out a reactive ion etching by using a mixed etching gas containing a fluorine-based reactive gas and Ar after the first processing step.

Abstract translation: 一种压电薄膜晶片的制造方法，其特征在于，包括：通过使用含有Ar的气体，在形成于基板上的KNN压电薄膜进行离子蚀刻的第一加工工序;以及第二加工工序， 含有氟系反应性气体的混合蚀刻气体和第一处理工序后的Ar。

公开(公告)号：US09190598B2

公开(公告)日：2015-11-17

申请号：US14417936

申请日：2012-07-31

Applicant: James Elmer Abbott, Jr. ,  Peter Mardilovich ,  Christopher Shelton

Inventor： James Elmer Abbott, Jr. ,  Peter Mardilovich ,  Christopher Shelton

IPC: B41J2/45 ,  H01L41/08 ,  B41J2/14 ,  H01L41/314

CPC classification number: H01L41/0815 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2002/14266 ,  B41J2202/03 ,  H01L41/0973 ,  H01L41/314 ,  H01L41/319

Abstract: The present disclosure is drawn to a thin film stack, which includes a substrate, a metal layer, and an adhesive layer comprising a blend of from 3 at % to 94 at % indium oxide, from 3 at % to 94 at % gallium oxide, and from 3 at % to 94 at % zinc oxide. The adhesive layer is adhered between the substrate and the metal layer.

Abstract translation: 本公开涉及薄膜堆叠，其包括基底，金属层和包含3at％至94at％氧化铟，3at％至94at％氧化镓的共混物的粘合剂层， 和3at％至94at％的氧化锌。 粘合剂层粘附在基材和金属层之间。