公开(公告)号：USRE48472E1

公开(公告)日：2021-03-16

申请号：US15689676

申请日：2017-08-29

Applicant: CYNTEC CO., LTD.

Inventor： Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh ,  Yu-Ching Kuo

IPC: H01F27/02 ,  H01F17/04

Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.

公开(公告)号：US20210074470A1

公开(公告)日：2021-03-11

申请号：US16936435

申请日：2020-07-23

Applicant: CYNTEC CO., LTD.

Inventor： Pei-I Wei ,  Cheng-Hao Chang ,  Shing Tak Li

IPC: H01F27/29 ,  H01F27/02 ,  H01F27/28 ,  H01F17/02 ,  H01F41/00 ,  H05K1/18

Abstract: An inductive component is disclosed, the inductive component comprising a metal structure, comprising a bare conductor wire, a first electrode and a second electrode, wherein the first electrode and the second electrode are integrally formed with the bare conductor wire, wherein a first thickness of the first electrode is greater than that of the bare conductor wire and a second thickness of the second electrode is greater than that of the bare conductor wire; and a magnetic body encapsulating the bare conductor wire, at least one portion of the first electrode, and at least one portion of the second electrode, wherein the first lateral surface of the first electrode and the second lateral surface of the second electrode are embedded inside the magnetic body.

公开(公告)号：US10796842B2

公开(公告)日：2020-10-06

申请号：US16709884

申请日：2019-12-10

Applicant: CYNTEC CO., LTD.

Inventor： Yi-Min Huang ,  Chih-Siang Chuang ,  Yung-Cheng Chang

IPC: H01F27/29 ,  H01F17/00 ,  H01F17/06

Abstract: A method to from an inductive component, the method including forming a metal structure having a conductor wire and a lead frame having a first part and a second part space spaced apart from the first part and forming a magnetic body encapsulating the conductor wire, a first portion of the first part and a second portion of the second part of the lead frame adjacent to the conductor wire.

公开(公告)号：US10529661B2

公开(公告)日：2020-01-07

申请号：US15585168

申请日：2017-05-03

Applicant: CYNTEC CO., LTD.

Inventor： Chih Hung Wei

IPC: H01L23/522 ,  H01F17/00 ,  H01F27/34 ,  H01L49/02 ,  H01L21/302

Abstract: A conductive element made of magnetic layers each being made of a first magnetic material, a trench is formed in each of the magnetic layer with the bottom surface of the trench being located higher than the bottom surface of the magnetic layer, wherein a second material is disposed in the trench and a conductive layer is disposed over the trench for forming the conductive element.

公开(公告)号：US10256118B2

公开(公告)日：2019-04-09

申请号：US15972247

申请日：2018-05-07

Applicant: CYNTEC CO., LTD.

Inventor： Chia Pei Chou ,  Lang-Yi Chiang ,  Jih-Hsu Yeh ,  You Chang Tseng

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/498

Abstract: A method to form an electrical component, the method comprising: providing a first lead and a second lead; forming a first conductive pillar and a second conductive pillar on a first portion of the top surface of the first lead and a first portion of the top surface of the second lead, respectively, wherein a second portion of the top surface of the first lead, a second portion of the top surface of the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one device is disposed in said 3D space and electrically connected to the at least one device to the first conductive pillar and the second conductive pillar.

公开(公告)号：US10121583B2

公开(公告)日：2018-11-06

申请号：US14697645

申请日：2015-04-28

Applicant: CYNTEC CO., LTD.

Inventor： Wei-Chien Chang ,  Chia-Chi Wu ,  Lang-Yi Chiang ,  Tsung-Chan Wu ,  Jih-Hsu Yeh

IPC: H01F5/00 ,  H01F27/28 ,  H01F5/02 ,  H01F27/29 ,  H01F41/04 ,  H01F17/04

Abstract: An electromagnetic component including a multi-layer, spiral coil structure embedded in a molded body is disclosed. Each layer of the coil structure makes approximately one and a quarter turns of a winding. Each layer of the coil structure has a loose middle segment, two slim end segments overlapping each other with a spacing therebetween, and tapered neck segments respectively connecting the loose middle segment with the two slim end segments.

公开(公告)号：US10068693B2

公开(公告)日：2018-09-04

申请号：US14931580

申请日：2015-11-03

Applicant: CYNTEC CO., LTD.

Inventor： Chun-Chih Lin ,  Yi-Wei Chen ,  Yi-Ting Lai ,  Chu-keng Lin ,  Cheng-Chang Lee

IPC: H01F27/32 ,  H01F27/28 ,  H01F27/24 ,  H05K1/16 ,  H05K1/09 ,  H05K1/02 ,  H05K3/20

CPC classification number: H01F27/2804 ,  H01F27/24 ,  H01F27/32 ,  H01F41/041 ,  H01F2027/2809 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/165 ,  H05K3/202 ,  H05K2201/086

Abstract: A multi-layer wiring structure includes a first conductive structure, a second conductive structure and an insulating layer. To manufacturing the multi-layer wiring structure, a first conductive structure and a second conductive structure are provided. The first conductive structure and the second conductive structure include a plurality of wiring patterns. Then, the insulating layer is disposed between the first conductive structure and the second conductive structure. The insulting layer is thinner than the first conductive structure or the second conductive structure. The first conductive structure, the insulating layer and the second conductive structure are laminated to form the multi-layer wiring structure. A planar magnetic element having a compact coil manufactured by the method is also provided.

公开(公告)号：US09978611B2

公开(公告)日：2018-05-22

申请号：US15654703

申请日：2017-07-20

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/495 ,  H01L21/768 ,  H01L25/00 ,  H01L25/16

CPC classification number: H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer over the top surface or the bottom surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

公开(公告)号：US09911715B2

公开(公告)日：2018-03-06

申请号：US14492085

申请日：2014-09-22

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Ming-Chia Wu ,  Shao Wei Lu

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/552 ,  H05K5/02 ,  H05K5/06 ,  H05K1/11 ,  H05K3/42 ,  H05K7/02 ,  H05K7/20 ,  H01L23/13 ,  H01L23/36 ,  H01L23/373 ,  H01L23/40 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31

CPC classification number: H01L25/0655 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/49811 ,  H01L23/5389 ,  H01L23/552 ,  H01L25/50 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/13055 ,  H05K1/115 ,  H05K3/42 ,  H05K5/0247 ,  H05K5/065 ,  H05K7/02 ,  H05K7/20509 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that the size of electronic package structure can be reduced. The three-dimensional package structure comprises a substrate, a first plurality of discrete conductive components and a connecting structure. The substrate has a top surface and a bottom surface. The first plurality of discrete conductive components are disposed over the bottom surface of the substrate. The connecting structure is disposed over the bottom surface of the substrate for encapsulating the first plurality of discrete electronic components. The connecting structure comprises at least one insulating layer and a plurality of conductive patterns separated by the at least one insulating layer. The plurality of conductive patterns are disposed over the first plurality of discrete electronic components for electrically connecting the first plurality of discrete electronic components.

公开(公告)号：US09799722B1

公开(公告)日：2017-10-24

申请号：US15285485

申请日：2016-10-05

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu

IPC: H01L23/00 ,  H01L49/02 ,  H01F27/28 ,  H01F27/29 ,  H01F27/24 ,  H01L23/522 ,  H01L23/552 ,  H01L25/065

CPC classification number: H01L28/10 ,  H01F17/0013 ,  H01F17/06 ,  H01F27/40 ,  H01F2017/008 ,  H01L23/5227 ,  H01L23/552 ,  H01L25/0652 ,  H01L25/0657

Abstract: An inductive component and package structure is provided, comprising a magnetic body having a top surface and a bottom surface, wherein a plurality of conductive through holes are formed from the top surface to the bottom surface of the magnetic body, and the plurality of conductive through holes are electrically connected via first conductive patterns disposed over the top surface of the magnetic body and second conductive patterns disposed over the bottom surface of the magnetic body so as to form at least one conductive path, each passing through a corresponding set of conductive through holes, wherein each of the at least one conductive path has two terminals and a corresponding inductance. At least one portion of a first electronic device is disposed in a first space, at least partially surrounded by the at least one conductive path.