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公开(公告)号：US20190201977A1
公开(公告)日：2019-07-04
申请号：US15928000
申请日：2018-03-21
Applicant: Applied Materials, Inc.
Inventor： Hou T. Ng , Nag B. Patibandla , Daihua Zhang
CPC classification number: B29C64/336 , B22F1/0059 , B22F3/008 , B22F3/10 , B22F3/1055 , B22F3/15 , B28B1/001 , B28B11/243 , B29C64/165 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y50/02 , C04B35/64
Abstract: A method of fabricating an object by additive manufacturing includes forming a green part by successively forming a plurality of layers of the green part, and processing the green part to fuse the powder into a solid mass. For each layer of the green part, a layer of powder is dispensed onto a build area on a platform, wherein the selective dispensing covers less than all of the build area, a binder material is selectively dispensed onto the layer of powder to form a combined layer of powder and binder material, and radiation is directed toward the platform so as to solidify the binder material to form a layer of the plurality of layers of the green part in which the powder is held by the solidified binder material.
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公开(公告)号：US20190201976A1
公开(公告)日：2019-07-04
申请号：US15927957
申请日：2018-03-21
Applicant: Applied Materials, Inc.
Inventor： Hou T. Ng , Nag B. Patibandla , Daihua Zhang
CPC classification number: B29C64/336 , B22F1/0059 , B22F3/008 , B22F3/10 , B22F3/1055 , B22F3/15 , B28B1/001 , B28B11/243 , B29C64/165 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y50/02 , C04B35/64
Abstract: An additive manufacturing apparatus includes a platform, one or more supports positioned above the platform, an actuator, a first dispenser system configured dispense a plurality of successive layers of powder onto a build area supported by the platform, a first binder material dispenser configured to selectively dispense a first binder material on a voxel-by-voxel basis to an uppermost layer of powder in the build area, and an energy source configured to emit radiation toward the platform so as to solidify the binder material. The first dispenser system includes a first powder dispenser that is attached to and moves with a first support from the one or more supports and is configured to selectively dispense a first powder onto the build area, and a second powder dispenser that is configured to selectively dispense the second powder onto the build area.
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公开(公告)号：US10335856B2
公开(公告)日：2019-07-02
申请号：US15195298
申请日：2016-06-28
Applicant: Applied Materials, Inc.
Inventor： Bharath Swaminathan , Eric Ng , Nag B. Patibandla , Hou T. Ng , Ashavani Kumar , Ajey M. Joshi , Bernard Frey , Kasiraman Krishnan
Abstract: An additive manufacturing system includes a platen having a top surface to support an object being manufactured, a dispenser to deliver a plurality of successive layers of precursor material over the platen, a plurality of lamps disposed below the top surface of the platen to heat the platen, and an energy source to fuse at least some of the outermost layer of precursor material.
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公开(公告)号：US20180222114A1
公开(公告)日：2018-08-09
申请号：US15942116
申请日：2018-03-30
Applicant: Applied Materials, Inc.
Inventor： Hou T. Ng , Raanan Zehavi , Nag B. Patibandla
IPC: B29C64/153 , B29C64/386 , B33Y30/00 , B33Y50/02
CPC classification number: B29C64/153 , B22F3/003 , B22F3/1055 , B22F2003/1056 , B29C64/165 , B29C64/20 , B29C64/205 , B29C64/209 , B29C64/232 , B29C64/236 , B29C64/264 , B29C64/295 , B29C64/307 , B29C64/336 , B29C64/386 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y70/00 , Y02P10/295
Abstract: An additive manufacturing system includes a platen to support an object being manufactured, a dispenser to deliver a plurality of successive layers of a powder over the platen, and energy source configured to fuse at least a portion of the powder. The dispenser is configured to deliver the powder in a linear region that extends along a first axis. The dispenser and actuator are supported by a support structure, and the actuator is coupled to the support structure to move the support structure along a second axis perpendicular to the first axis such that the dispenser and energy source move as a single unit with the support structure and the linear region sweeps along the second axis to deposit the powder along a swath over the platen to form a layer of powder.
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公开(公告)号：US10032827B2
公开(公告)日：2018-07-24
申请号：US15270763
申请日：2016-09-20
Applicant: Applied Materials, Inc.
Inventor： Mingwei Zhu , Sivapackia Ganapathiappan , Boyi Fu , Hou T. Ng , Nag B. Patibandla
IPC: H01L21/677 , H01L21/683 , H01L27/15 , H01L33/48 , H01L23/00 , H01L21/66
Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.
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Patent Agency Ranking
公开(公告)号：US20170021418A1
公开(公告)日：2017-01-26
申请号：US15213267
申请日：2016-07-18
Applicant: Applied Materials, Inc.
Inventor： Hou T. Ng , Bharath Swaminathan , Nag B. Patibandla , Ajey M. Joshi , Ashavani Kumar , Eric Ng , Bernard Frey , Kasiraman Krishnan
IPC: B22F3/105 , B28B1/00 , B33Y10/00 , B33Y30/00 , C04B35/64 , B23K15/00 , B23K26/342 , B23K26/70 , H05B3/00 , B29C67/00 , B33Y40/00
CPC classification number: B22F3/1055 , B22F2003/1056 , B22F2003/1057 , B22F2203/11 , B22F2998/10 , B22F2999/00 , B29C64/153 , B29K2105/251 , B33Y10/00 , B33Y30/00 , B33Y40/00 , H05B3/0057 , H05B3/0061 , H05B2203/032 , Y02P10/295 , B22F1/0085
Abstract: An additive manufacturing system includes a platen having a top surface to support an object being manufactured, a dispenser to deliver a plurality of successive layers of feed material over the platen, an energy source positioned above the platen to direct a beam to fuse at least some of an outermost layer of feed material, and a plurality of lamps disposed above the platen and around the energy source to radiatively heat the outermost layer of feed material.
Abstract translation: 添加剂制造系统包括具有用于支撑待制造物体的顶表面的压板，用于在压板上方输送多个连续的进料材料层的分配器，位于压板上方的能量源，以引导束熔化至少一些 的最外层进料材料，以及多个灯，其设置在压板上方和能量源周围，以辐射加热进料的最外层。
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公开(公告)号：US20160368054A1
公开(公告)日：2016-12-22
申请号：US15186060
申请日：2016-06-17
Applicant: Applied Materials, Inc.
Inventor： Hou T. Ng , Nag B. Patibandla , Ajey M. Joshi , Ashavani Kumar , Kasiraman Krishnan
Abstract: An additive manufacturing apparatus for forming a part includes a support, a first dispenser to deliver a layer of first particles on a support or an underlying layer on the support, a second dispenser to deliver second particles onto the layer of first particles such that the second particles infiltrate into the layer of first particles, an energy source to fuse the first particle and second particles to form a fused layer of the part, and a controller coupled to the first dispenser, second dispenser and energy source.
Abstract translation: 一种用于形成部件的添加剂制造设备包括支撑件，第一分配器，用于在支撑件上或支撑体上的下层上输送第一颗粒层，第二分配器，用于将第二颗粒递送到第一颗粒层上， 颗粒渗透到第一颗粒层中，能量源将第一颗粒和第二颗粒融合以形成该部分的熔融层，以及耦合到第一分配器，第二分配器和能量源的控制器。
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公开(公告)号：US12224272B2
公开(公告)日：2025-02-11
申请号：US17701599
申请日：2022-03-22
Applicant: Applied Materials, Inc.
Inventor： Lisong Xu , Byung Sung Kwak , Mingwei Zhu , Hou T. Ng , Nag B. Patibandla , Christopher Dennis Bencher
IPC: H01L25/16 , H01L25/075 , H01L33/00 , H01L33/44 , H01L33/48 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/32
Abstract: A method for manufacturing micro-LED displays includes depositing a first material over a substrate having a plurality of micro-LEDs such that the plurality of micro-LEDs are covered by the first material and the first material fills gaps laterally separating the micro-LEDs, removing a portion of the first material from the gaps that laterally separate the plurality of micro-LEDs to form trenches that extend to or below light-emitting layers of the micro-LEDs, depositing a second material over the substrate such that the second material covers the first material and extends into the trenches, and removing a portion of the first and second material over the plurality of micro-LEDs to expose top surfaces of the plurality of micro-LEDs and such that isolation walls positioned in the gaps between the plurality of micro-LEDs extend vertically higher than the top surface of the first material.
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公开(公告)号：US12033887B2
公开(公告)日：2024-07-09
申请号：US18349032
申请日：2023-07-07
Applicant: Applied Materials, Inc.
Inventor： Daihua Zhang , Yingdong Luo , Mingwei Zhu , Hou T. Ng , Sivapackia Ganapathiappan , Nag B. Patibandla
IPC: H01L21/70 , H01L21/02 , H01L21/027 , H01L25/075 , H01L27/15 , H01L33/00 , H01L33/44 , H01L33/50 , H01L33/58 , H01L33/62
CPC classification number: H01L21/70 , H01L21/02104 , H01L21/027 , H01L21/707 , H01L25/0753 , H01L27/153 , H01L33/00 , H01L33/0093 , H01L33/44 , H01L33/505 , H01L33/58 , H01L33/62 , H01L2933/0041 , H01L2933/0058 , H01L2933/0066
Abstract: A multi-color display includes a backplane having backplane circuitry, an array of micro-LEDs electrically integrated with backplane circuitry of the backplane, a color conversion layer over each of a plurality of light emitting diodes, and a plurality of isolation walls separating adjacent micro-LEDs of the array.
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公开(公告)号：US20240145623A1
公开(公告)日：2024-05-02
申请号：US18542260
申请日：2023-12-15
Applicant: Applied Materials, Inc.
Inventor： Fabio Pieralisi , Mingwei Zhu , Zihao Yang , Liang Zhao , Jeffrey L. Franklin , Hou T. Ng , Nag Patibandla
CPC classification number: H01L33/0093 , H01L25/0753 , H01L33/007 , H01L33/06 , H01L33/32 , H01L33/46 , H01L33/50 , H01L33/62 , H01L2933/0066
Abstract: Exemplary semiconductor structures may include a plurality of LED structures and a backplane layer. Exemplary semiconductor structures may also include a light barrier region positioned between the LED structures and the backplane layer. The light barrier region may be operable to absorb light at wavelengths shorter than or about 300 nm and transmit light at wavelengths greater than or about 350.
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