公开(公告)号：US20100055847A1

公开(公告)日：2010-03-04

申请号：US12614960

申请日：2009-11-09

申请人： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Jack Chang Chien ,  Ning Liu

发明人： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Jack Chang Chien ,  Ning Liu

IPC分类号： H01L21/56

CPC分类号： G06K19/077 ,  B29C45/14311 ,  B29C45/14647 ,  B29C2045/14327 ,  G06K19/07724 ,  G06K19/07732 ,  H01L23/10 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.

公开(公告)号：US20090263969A1

公开(公告)日：2009-10-22

申请号：US12493582

申请日：2009-06-29

申请人： Hem Takiar ,  Cheemen Yu ,  Ken Jian Ming Wang ,  Chin-Tien Chiu ,  Han-Shiao Chen ,  Chih-Chin Liao

发明人： Hem Takiar ,  Cheemen Yu ,  Ken Jian Ming Wang ,  Chin-Tien Chiu ,  Han-Shiao Chen ,  Chih-Chin Liao

IPC分类号： H01L21/3205

CPC分类号： H01L25/0657 ,  H01L21/3205 ,  H01L23/04 ,  H01L23/3121 ,  H01L23/5386 ,  H01L24/48 ,  H01L24/64 ,  H01L24/65 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise occur with straight edges to the contact fingers. The substrate may additionally or alternatively include plating traces extending at an angle from the contact fingers. Extending at an angle, at least the ends of the plating traces at the edge of the substrate are covered beneath a lid in which the semiconductor package is encased. Thus, when in use with a host device, contact between the ends of the plating traces beneath the lid and contact pins of the host device is avoided.

摘要翻译： 公开了一种加强的半导体管芯基板和封装。 衬底可以包括形成有非线性边缘的接触指状物。 向接触指边缘提供非线性轮廓减少了施加在半导体管芯上的机械应力，否则这些应力将以直接接触指的边缘发生。 衬底可以附加地或可选地包括从接触指一定角度延伸的电镀迹线。 以一定角度延伸，至少衬底边缘处的电镀迹线的端部被覆盖在半导体封装被封装的盖子的下方。 因此，当与主机设备一起使用时，避免了盖子下方的电镀痕迹的端部和主机设备的接触销之间的接触。

公开(公告)号：US20090165294A1

公开(公告)日：2009-07-02

申请号：US11965691

申请日：2007-12-27

申请人： Suresh Upadhyayula ,  Robert C. Miller ,  Hem Takiar ,  Steven Sprouse ,  Ka Ian Yung

发明人： Suresh Upadhyayula ,  Robert C. Miller ,  Hem Takiar ,  Steven Sprouse ,  Ka Ian Yung

IPC分类号： H01R43/00 ,  H01R33/90

CPC分类号： H01L21/02 ,  G06K19/07732 ,  G06K19/07735 ,  G06K19/07743 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/85 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y10T29/41 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.

摘要翻译： 公开了一种低调USB闪存设备及其形成方法。 USB闪存设备包括集成电路存储器部分和USB连接器。 存储器部分和USB连接器可以整体地形成在同一基板上。 USB闪存设备包括一个基板，在该基板上安装有一个或多个闪存芯片，控制器芯片，无源元件和LED，用于指示何时访问存储器。 与使用安装在印刷电路板上的TSOP封装的现有技术的USB存储器装置相比，本发明的半导体管芯被固定到衬底上并以SIP构造接合。 省略封装的TSOP封装允许减少USB闪存设备的总体厚度。

公开(公告)号：US20090085232A1

公开(公告)日：2009-04-02

申请号：US11863809

申请日：2007-09-28

申请人： Ong King Hoo ,  Java Zhu ,  Ning Ye ,  Hem Takiar

发明人： Ong King Hoo ,  Java Zhu ,  Ning Ye ,  Hem Takiar

IPC分类号： H01L23/29 ,  H01L21/00

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or more edges of the semiconductor package. The one or more edges may be smoothed by applying a laminate to the edges. The edges receiving the laminate may include any edge between a top and bottom surface of the package.

摘要翻译： 公开了一种形成具有平滑边缘的半导体封装的方法，以及由此形成的半导体封装。 在实施例中，在封装之后，通过使一个或多个切口穿过面板来限定半导体封装的一个或多个边缘，半导体封装可以至少部分地从面板上单独化。 可以通过将层压板施加到边缘来使一个或多个边缘平滑。 接收层压体的边缘可以包括在包装的顶部和底部表面之间的任何边缘。

公开(公告)号：US20090065902A1

公开(公告)日：2009-03-12

申请号：US11853428

申请日：2007-09-11

申请人： Cheemen Yu ,  Chih-Chin Liao ,  Hem Takiar

发明人： Cheemen Yu ,  Chih-Chin Liao ,  Hem Takiar

IPC分类号： H01L29/06 ,  H01L21/304 ,  H01L21/56

CPC分类号： H01L21/3043 ,  H01L21/78 ,  H01L23/3121 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of forming a low profile semiconductor package, and a semiconductor package formed thereby, is disclosed. The semiconductor die is formed with one or more sloped edges on which electrically conductive traces may be deposited to allow the semiconductor die to be coupled to another die and/or a substrate on which the die is mounted. Depositing the electrical traces directly on the surface and sloped edge of the die allows the die to be electrically coupled without bond wires, thereby allowing a reduction in the overall thickness of the package.

摘要翻译： 公开了一种形成低轮廓半导体封装的方法，以及由此形成的半导体封装。 半导体管芯形成有一个或多个倾斜边缘，导电迹线可以沉积在其上，以允许半导体管芯耦合到另一管芯和/或其上安装管芯的衬底。 将电迹线直接沉积在模具的表面和倾斜边缘上，使得模具能够电耦合而没有接合线，从而允许减小包装的整体厚度。

公开(公告)号：US20090004785A1

公开(公告)日：2009-01-01

申请号：US11770078

申请日：2007-06-28

申请人： Chin-Tien Chiu ,  Hem Takiar ,  Chih-Chin Liao ,  Cheemen Yu ,  Ning Ye ,  Jack Chang Chien

发明人： Chin-Tien Chiu ,  Hem Takiar ,  Chih-Chin Liao ,  Cheemen Yu ,  Ning Ye ,  Jack Chang Chien

IPC分类号： H01L21/56

CPC分类号： H01L21/56 ,  G06K19/077 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the holes, and down into a recessed section formed in the bottom mold cap plate to form a projection of mold compound on the bottom surface of the substrate.

摘要翻译： 公开了便携式存储卡及其制造方法。 便携式存储器包括其中形成有多个孔的基板。 在封装过程中，模塑料在衬底的顶表面上通过孔流动，并向下流入形成在底模盖板中的凹陷部分，以在基底的底表面上形成模具化合物的突起。

公开(公告)号：US20090004776A1

公开(公告)日：2009-01-01

申请号：US11769942

申请日：2007-06-28

申请人： Ning Ye ,  Robert C. Miller ,  Cheemen Yu ,  Hem Takiar ,  Andre McKenzie

发明人： Ning Ye ,  Robert C. Miller ,  Cheemen Yu ,  Hem Takiar ,  Andre McKenzie

IPC分类号： H01L21/60

CPC分类号： H01L21/50 ,  B82Y10/00 ,  G11C29/1201 ,  G11C29/48 ,  H01L23/5388 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K1/117 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/10159 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.

摘要翻译： 公开了一种由多模组件形成的便携式存储卡及其制造方法。 一个这样的多模组件包括LGA SiP半导体封装和两个贴在PCB上的基于引线框架的SMT封装。 如此形成的多模组件可以被封装在标准盖中以形成完整的便携式存储卡，例如标准SD（TM）卡。 LGA SiP封装上用于测试封装制造后的操作的测试焊盘也可用于物理和电气耦合LGA SiP封装到PCB。

公开(公告)号：US20070267759A1

公开(公告)日：2007-11-22

申请号：US11435518

申请日：2006-05-17

申请人： Chih-Chin Liao ,  Han-Shiao Chen ,  Chin-Tien Chiu ,  Cheemen Yu ,  Hem Takiar

发明人： Chih-Chin Liao ,  Han-Shiao Chen ,  Chin-Tien Chiu ,  Cheemen Yu ,  Hem Takiar

IPC分类号： H01L23/48

CPC分类号： H05K3/243 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K3/28 ,  H05K2201/09781 ,  H05K2201/0989 ,  H01L2924/00

摘要： A substrate, and a semiconductor die package formed therefrom, are disclosed which include a distributed plating pattern for reducing mechanical stress on the semiconductor die. The substrate according to embodiments of the invention may include traces and contact pads plated in a double image plating process. Additionally, the substrate may include dummy plating areas including plating material. The plated vias and/or traces and the plating material within the dummy plating areas provide a plating pattern which is evenly distributed across the surface of the substrate. The even distribution of the plating pattern prevents peaks and valleys in the finished substrate.

摘要翻译： 公开了一种基板和由其形成的半导体管芯封装，其包括用于减小半导体管芯上的机械应力的分布电镀图案。 根据本发明的实施例的衬底可以包括以双映像电镀工艺电镀的迹线和接触焊盘。 此外，基板可以包括包括电镀材料的虚拟电镀区域。 电镀通孔和/或迹线以及虚拟电镀区域内的电镀材料提供均匀分布在基板表面上的电镀图案。 电镀图案的均匀分布防止成品基板中的峰和谷。

公开(公告)号：US20070132066A1

公开(公告)日：2007-06-14

申请号：US11301715

申请日：2005-12-13

申请人： Hem Takiar ,  Ken Wang ,  Chih-Chin Liao ,  Han-Shiao Chen

发明人： Hem Takiar ,  Ken Wang ,  Chih-Chin Liao ,  Han-Shiao Chen

IPC分类号： H01L23/544

CPC分类号： H05K3/242 ,  H01L21/4846 ,  H01L23/49838 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H05K3/0052 ,  H05K2201/09263 ,  H01L2924/00

摘要： A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.

摘要翻译： 公开了半导体管芯衬底面板，其包括在面板上相邻的半导体封装轮廓之间的最小间隙宽度，同时确保电镀电端子的电隔离。 通过减小相邻封装轮廓之间的边界的宽度，在半导体封装的衬底面板上获得额外的空间。

公开(公告)号：US5621635A

公开(公告)日：1997-04-15

申请号：US397950

申请日：1995-03-03

申请人： Hem Takiar

发明人： Hem Takiar

IPC分类号： H01L23/495 ,  H01L23/64 ,  H05K7/20

CPC分类号： H01L23/645 ,  H01L23/495 ,  H01L23/642 ,  H01L2224/32245 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13091

摘要： A design for and method of assembling a power supply or power converter. The design is based on mounting the heat generating elements of the device, such as an integrated circuit or other switching device in a manner which provides a direct thermal coupling between those devices and the inductors or transformers which are part of the power supply or converter Using packaging techniques similar to those used in the semiconductor industry, the inductor or transformer is attached to one side of a lead frame. The heat generating elements are then mounted on top of the inductor or transformer. Passive components, such as capacitors, may be mounted on the lead frame. Additional heat generating components may also be mounted on the inductor or transformer. The resulting combination is then encapsulated in plastic or a molding compound typically used in the industry.

摘要翻译： 组合电源或电源转换器的设计和方法。 该设计基于以这样的方式安装装置的发热元件，例如集成电路或其他开关装置，这些装置与作为电源或转换器一部分的电感器或变压器之间的直接热耦合使用 封装技术与半导体工业中使用的封装技术相似，电感器或变压器连接到引线框架的一侧。 然后将发热元件安装在电感器或变压器的顶部。 诸如电容器的被动元件可以安装在引线框架上。 另外的发热部件也可以安装在电感器或变压器上。 然后将所得组合物包封在塑料或通常用于工业中的模​​塑料中。