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    Adaptive chuck for planar bonding between substrates
    81.
    发明授权
    Adaptive chuck for planar bonding between substrates 失效
    用于基板之间的平面粘合的自适应卡盘

    公开(公告)号：US08408262B2

    公开(公告)日：2013-04-02

    申请号：US12575968

    申请日：2009-10-08

    申请人： Dechao Guo ,  Fei Liu ,  Leathen Shi ,  Keith Kwong Hon Wong

    发明人： Dechao Guo ,  Fei Liu ,  Leathen Shi ,  Keith Kwong Hon Wong

    IPC分类号： B32B41/00

    CPC分类号： H01L21/6833 ,  B32B37/0007 ,  B32B2457/14 ,  Y10T156/1002

    摘要： An electrostatic chuck includes an array of independently biased conductive chuck elements, an array of sensor-conductor assemblies, and/or a combination of an array of sensor-conductor assemblies and at least one motorized chuck. Conductive chuck elements, either standing alone or embedded in a sensor-conductor assembly, are independently biased electrostatically to compensate for bowing and/or warping of a substrate thereupon so that the substrate can be bonded with a planar surface. A single electrostatic chuck can be employed to reduce the bowing and warping of one of the two substrates to be bonded, or two electrostatic chucks can be employed to minimize the bowing and warping of two substrates to be bonded.

    摘要翻译： 静电卡盘包括独立偏置的导电卡盘元件的阵列，传感器 - 导体组件的阵列，和/或传感器 - 导体组件阵列和至少一个电动卡盘的组合。 独立地或嵌入传感器 - 导体组件中的导电卡盘元件被静电地独立地偏置以补偿其上的衬底的弯曲和/或翘曲，使得衬底可以与平坦表面结合。 可以使用单个静电卡盘来减少要接合的两个基板中的一个的弯曲和翘曲，或者可以使用两个静电卡盘来最小化要接合的两个基板的弯曲和翘曲。

    Nanoelectromechanical Structures Exhibiting Tensile Stress And Techniques For Fabrication Thereof
    82.
    发明申请
    Nanoelectromechanical Structures Exhibiting Tensile Stress And Techniques For Fabrication Thereof 审中-公开
    展示拉伸应力的纳米机电结构及其制造技术

    公开(公告)号：US20120286377A1

    公开(公告)日：2012-11-15

    申请号：US13103193

    申请日：2011-05-09

    申请人： Josephine B. Chang ,  Sebastian U. Engelmann ,  Michael A. Guillorn ,  Fei Liu ,  Conal E. Murray

    发明人： Josephine B. Chang ,  Sebastian U. Engelmann ,  Michael A. Guillorn ,  Fei Liu ,  Conal E. Murray

    IPC分类号： H01L29/84 ,  H01L21/3105 ,  H01L29/06

    CPC分类号： H01L29/84 ,  B81B3/0072 ,  B81B2203/0109 ,  B81B2203/0307 ,  H01L29/0673

    摘要： Improved nano-electromechanical system devices and structures and systems and techniques for their fabrication. In one embodiment, a structure comprises an underlying substrate separated from first and second anchor points by first and second insulating support points, respectively. The first and second anchor points are joined by a beam. First and second deposition regions overlie the first and second anchor points, respectively, and the first and second deposition regions exert compression on the first and second anchor points, respectively. The compression on the first and second anchor points causes opposing forces on the beam, subjecting the beam to a tensile stress. The first and second deposition regions suitably exhibit an internal tensile stress having an achievable maximum varying with their thickness, so that the tensile stress exerted on the beam depends at least on part on the thickness of the first and second deposition regions.

    摘要翻译： 改进的纳米机电系统设备及其制造的结构及系统和技术。 在一个实施例中，结构包括分别通过第一和第二绝缘支撑点从第一和第二锚定点分离的下面的基底。 第一和第二锚定点通过梁连接。 第一和第二沉积区域分别覆盖在第一和第二锚定点上，并且第一和第二沉积区域分别在第一和第二锚定点上施加压缩。 第一和第二锚固点上的压缩在梁上产生相反的力，使梁受到拉伸应力。 第一和第二沉积区域适当地呈现具有随其厚度变化的可实现最大值的内部拉伸应力，使得施加在梁上的拉伸应力至少部分地取决于第一和第二沉积区域的厚度。

    Local multivariable solver for optical proximity correction in lithographic processing method, and device manufactured thereby
    83.
    发明授权
    Local multivariable solver for optical proximity correction in lithographic processing method, and device manufactured thereby 有权
    用于光刻处理方法中的光学邻近校正的局部多变量求解器，以及由此制造的器件

    公开(公告)号：US08239786B2

    公开(公告)日：2012-08-07

    申请号：US12644790

    申请日：2009-12-22

    申请人： William S. Wong ,  Fei Liu ,  Been-Der Chen ,  Yen-Wen Lu

    发明人： William S. Wong ,  Fei Liu ,  Been-Der Chen ,  Yen-Wen Lu

    IPC分类号： G06F17/50

    CPC分类号： G03F1/36

    摘要： A multivariable solver for proximity correction uses a Jacobian matrix to approximate effects of perturbations of segment locations in successive iterations of a design loop. The problem is formulated as a constrained minimization problem with box, linear equality, and linear inequality constraints. To improve computational efficiency, non-local interactions are ignored, which results in a sparse Jacobian matrix.

    摘要翻译： 用于近程校正的多变量求解器使用雅可比矩阵近似设计循环的连续迭代中的段位置的扰动效应。 该问题被形成为具有框，线性等式和线性不等式约束的约束最小化问题。 为了提高计算效率，忽略非局部相互作用，这导致了稀疏的雅可比矩阵。

    Electric motor
    84.
    发明授权
    Electric motor 失效
    电动马达

    公开(公告)号：US08232704B2

    公开(公告)日：2012-07-31

    申请号：US12623043

    申请日：2009-11-20

    申请人： Rui Feng Qin ,  Fei Liu

    发明人： Rui Feng Qin ,  Fei Liu

    IPC分类号： H02K1/26

    CPC分类号： H02K1/265 ,  H02K23/405

    摘要： An electric motor comprises a stator and a rotor rotatably mounted confronting the stator. The rotor has a rotor core which comprises at least a first tooth, a second tooth and a third tooth which are adjacent. Each of the teeth comprises a rib section radially and outwardly extending from a core and a tooth section located at an outer end of the rib section. The angle between the first tooth and the second tooth is n degrees, wherein when the rotor core is rotated n degrees to move the first tooth towards the second tooth, the rotated second tooth does not coincide with the pre-rotated third tooth.

    摘要翻译： 电动机包括定子和与该定子相对转动地安装的转子。 转子具有至少包括相邻的第一齿，第二齿和第三齿的转子芯。 每个齿包括从芯部径向向外延伸的肋部分和位于肋部分的外端处的齿部分。 第一齿和第二齿之间的角度为n度，其中当转子芯旋转n度以使第一齿朝向第二齿移动时，旋转的第二齿不与预旋转的第三齿重合。

    HIGH-VOLTAGE, SUPER-VOLTAGE AND HEAVY CURRENT BREAKER
    85.
    发明申请
    HIGH-VOLTAGE, SUPER-VOLTAGE AND HEAVY CURRENT BREAKER 审中-公开
    高电压，超电流和重电流断路器

    公开(公告)号：US20120187089A1

    公开(公告)日：2012-07-26

    申请号：US13393225

    申请日：2009-10-27

    申请人： Xuanshu Chen ,  Yuan Pan ,  Fei Liu ,  Junjia He ,  Zhao Yuan ,  Ting Yin ,  Yan Du ,  Yan He

    发明人： Xuanshu Chen ,  Yuan Pan ,  Fei Liu ,  Junjia He ,  Zhao Yuan ,  Ting Yin ,  Yan Du ,  Yan He

    IPC分类号： H01H33/14

    CPC分类号： H01H33/14 ,  H01H9/167 ,  H01H9/563 ,  H01H33/16 ,  H01H33/59 ,  H01H33/6662 ,  H01H2009/543

    摘要： A high-voltage, super-voltage and heavy current breaker is formed by combining intelligent optical vacuum breaker modules (21) with phase selection function in series and/or parallel connection. Each vacuum breaker module (21) is connected each other in series after being connected in parallel with a resistance capacitance device or with a resistance capacitance device and a zinc oxide arrester valve plate (22). Tight coupling reactors are connected with several serial branches of the vacuum breaker module (21) simultaneously to achieve parallel connection of several serial branches of the vacuum breaker module (21). The breaker distributes the high-voltage and heavy current into the low voltage and low current serial and parallel vacuum breaker modules (21) to share.

    摘要翻译： 通过将智能光学真空断路器模块（21）与串联和/或并联的相位选择功能相结合，形成高压，超电压和大电流断路器。 每个真空断路器模块（21）在与电阻电容器件或电阻电容器件和氧化锌避雷器阀板（22）并联连接之后彼此串联连接。 紧耦合电抗器同时与真空断路器模块（21）的几个串联连接，以实现真空断路器模块（21）的几个串联分支的并联连接。 断路器将高压和大电流分配到低压和低电流串联和并联真空断路器模块（21）中以共享。

    Precise-Aligned Lock-and-Key Bonding Structures
    88.
    发明申请
    Precise-Aligned Lock-and-Key Bonding Structures 失效
    精确锁定和键键合结构

    公开(公告)号：US20110278063A1

    公开(公告)日：2011-11-17

    申请号：US12780086

    申请日：2010-05-14

    申请人： Kuan-Neng Chen ,  Fei Liu

    发明人： Kuan-Neng Chen ,  Fei Liu

    IPC分类号： H01R4/02 ,  B23K31/02

    CPC分类号： H01L24/81 ,  B23K20/02 ,  B23K2101/38 ,  B23K2103/12 ,  H01L24/03 ,  H01L24/14 ,  H01L2224/0401 ,  H01L2224/8114

    摘要： Copper (Cu)-to-Cu bonding techniques are provided. In one aspect, a bonding method is provided. The method includes the following steps. A first bonding structure is provided having at least one copper pad embedded in a first insulator and at least one via in the first insulator over the copper pad, wherein the via has tapered sidewalls. A second bonding structure is provided having at least one copper stud embedded in a second insulator, wherein a portion of the copper stud is exposed for bonding and has a domed shape. The first bonding structure is bonded to the second bonding structure by way of a copper-to-copper bonding between the copper pad and the copper stud, wherein the via and the copper stud fit together like a lock-and-key. A bonded structure is also provided.

    摘要翻译： 提供了铜（Cu）与Cu的结合技术。 一方面，提供了接合方法。 该方法包括以下步骤。 提供了第一接合结构，其具有嵌入在第一绝缘体中的至少一个铜焊盘和位于铜焊盘上的第一绝缘体中的至少一个通孔，其中该通孔具有锥形侧壁。 提供了第二接合结构，其具有嵌入在第二绝缘体中的至少一个铜螺柱，其中铜螺柱的一部分露出用于接合并且具有圆顶形状。 第一接合结构通过在铜焊盘和铜螺柱之间的铜 - 铜接合而结合到第二接合结构，其中通孔和铜螺柱像锁和键一样安装在一起。 还提供了粘合结构。

    Method and structure for improving uniformity of passive devices in metal gate technology
    89.
    发明授权
    Method and structure for improving uniformity of passive devices in metal gate technology 有权
    用于提高金属栅极技术中无源器件均匀性的方法和结构

    公开(公告)号：US08053317B2

    公开(公告)日：2011-11-08

    申请号：US12541933

    申请日：2009-08-15

    申请人： Satya N. Chakravarti ,  Dechao Guo ,  Wilfried Ernst-August Haensch ,  Pranita Kulkarni ,  Fei Liu ,  Philip J. Oldiges ,  Keith Kwong Hon Wong

    发明人： Satya N. Chakravarti ,  Dechao Guo ,  Wilfried Ernst-August Haensch ,  Pranita Kulkarni ,  Fei Liu ,  Philip J. Oldiges ,  Keith Kwong Hon Wong

    IPC分类号： H01L21/8234

    CPC分类号： H01L27/0629 ,  H01L21/82345

    摘要： Method of forming a semiconductor device which includes the steps of obtaining a semiconductor substrate having a logic region and an STI region; sequentially depositing layers of high K material, metal gate, first silicon and hardmask; removing the hardmask and first silicon layers from the logic region; applying a second layer of silicon on the semiconductor substrate such that the logic region has layers of high K material, metal gate and second silicon and the STI region has layers of high K material, metal gate, first silicon, hardmask and second silicon. There may also be a second hardmask layer between the metal gate layer and the first silicon layer in the STI region. There may also be a hardmask layer between the metal gate layer and the first silicon layer in the STI region but no hardmask layer between the first and second layers of silicon in the STI region.

    摘要翻译： 形成半导体器件的方法包括以下步骤：获得具有逻辑区域和STI区域的半导体衬底; 依次沉积高K材料，金属栅极，第一硅和硬掩模层; 从逻辑区域去除硬掩模和第一硅层; 在半导体衬底上施加第二层硅，使得逻辑区域具有高K材料，金属栅极和第二硅层，并且STI区域具有高K材料，金属栅极，第一硅，硬掩模和第二硅层。 也可以在STI区域中的金属栅极层和第一硅层之间存在第二硬掩模层。 在STI区域中的金属栅极层和第一硅层之间也可以存在硬掩模层，但在STI区域中的第一和第二硅层之间没有硬掩模层。

    DEVICE, METHOD AND SYSTEM FOR TRANSMITTING DIGITAL BROADCASTING SIGNAL
    90.
    发明申请
    DEVICE, METHOD AND SYSTEM FOR TRANSMITTING DIGITAL BROADCASTING SIGNAL 审中-公开
    用于发送数字广播信号的装置，方法和系统

    公开(公告)号：US20110103516A1

    公开(公告)日：2011-05-05

    申请号：US13000829

    申请日：2009-06-26

    申请人： Dongshan Bao ,  Fei Liu ,  Bin Wang ,  Yang Yao

    发明人： Dongshan Bao ,  Fei Liu ,  Bin Wang ,  Yang Yao

    IPC分类号： H04L27/20 ,  H04L27/00

    CPC分类号： H04L27/2627 ,  H04L1/0041 ,  H04L1/0071 ,  H04L1/0072

    摘要： A device for transmitting digital broadcast signal comprises: at least a first encoding unit, each of which encodes data of a sub-channel with forward error correction encoding; at least a time-domain interleaving unit, each of which receives data output from a first encoding unit and performs interleaving in time-domain on the encoded data; a first multiplexing unit, which multiplexes the interleaved data output from each of the time-domain interleaving unit into Main Service Channel (MSC) data; a second encoding unit, which performs forward error correction encoding on a second set of data to obtain Fast Information Channel (FIC) data; a differential modulating unit, which performs differential modulation on the FIC data by using a first modulation mode and on the MSC data by using a second modulation mode, wherein the modulation level of the first modulation mode is lower than that of the second modulation mode; and a frame generating and transmitting unit, which generates signal unit transmission frames by using differential-modulation symbol sequences generated by the differential modulating unit and transmitting said signal unit transmission frames.

    摘要翻译： 用于发送数字广播信号的装置包括：至少第一编码单元，每个编码单元用前向纠错编码对子信道的数据进行编码; 至少一个时域交织单元，每个时域接收单元接收从第一编码单元输出的数据，并在编码数据上对时域执行交织; 第一复用单元，将从每个时域交织单元输出的交织数据复用到主服务信道（MSC）数据中; 第二编码单元，对第二组数据执行前向纠错编码以获得快速信息信道（FIC）数据; 差分调制单元，其通过使用第一调制模式对所述FIC数据进行差分调制，并且通过使用第二调制模式对所述MSC数据执行差分调制，其中所述第一调制模式的调制电平低于所述第二调制模式的调制电平; 以及帧生成和发送单元，其通过使用由差分调制单元生成的差分调制符号序列生成信号单元发送帧，并发送所述信号单元发送帧。