公开(公告)号：US20100009853A1

公开(公告)日：2010-01-14

申请号：US12373538

申请日：2007-07-13

申请人： Osamu Ikeda ,  Ken Kuriyama ,  Miyako Aoki ,  Masao Yamashita

发明人： Osamu Ikeda ,  Ken Kuriyama ,  Miyako Aoki ,  Masao Yamashita

IPC分类号： A01N43/40 ,  A01N43/80 ,  A01N43/72 ,  A01P13/00

CPC分类号： A01N43/82

摘要： Parasitic plants parasitizing on crops can be controlled effectively, by providing an agent for controlling parasitic plants, which comprises tiadinil or the like as the active ingredient and a method for using an agent for controlling parasitic plants, which comprises treating a parasitized plant or soil with an effective amount of agent for controlling parasitic plants. As a result, the yield of crops can be recovered to the level of parasitism-free crops. Additionally, by inhibiting parasitism of parasitic plants strongly, development of the next generation can be inhibited so that the level of pollution with parasitic plants on agricultural land can be lowered with cultivating sensitive crops.

摘要翻译： 寄生在作物上的寄生植物可以通过提供一种用于控制寄生植物的药剂来控制寄生植物，这些寄生植物包括噻替尼等作为活性成分，以及用于控制寄生植物的方法，其中包括用寄生植物或土壤 有效量的控制寄生植物的药剂。 因此，作物的产量可以恢复到无寄生作物的水平。 另外，通过强烈地抑制寄生植物的寄生，可以抑制下一代的发育，从而可以通过培育敏感作物降低农地上寄生植物的污染程度。

公开(公告)号：US07579677B2

公开(公告)日：2009-08-25

申请号：US11585879

申请日：2006-10-25

申请人： Osamu Ikeda ,  Masahide Okamoto ,  Hidemasa Kagii ,  Hiroi Oka ,  Hiroyuki Nakamura

发明人： Osamu Ikeda ,  Masahide Okamoto ,  Hidemasa Kagii ,  Hiroi Oka ,  Hiroyuki Nakamura

IPC分类号： H01L23/495

CPC分类号： C22F1/08 ,  H01L23/49513 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2908 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32507 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3754 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01063 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512

摘要： In a power semiconductor device, a joint between the power semiconductor element and frame plated with Ni is composed of a laminated structure comprising, from the power semiconductor element side, an intermetallic compound layer having a melting point of 260° C. or higher, a Cu layer, a metal layer having a melting point of 260° C. or higher, a Cu layer and an intermetallic layer having a melting point of 260° C. or higher. The structure of the joint buffers the stress generated by the secondary mounting and temperature cycle at the bond for the semiconductor element and the frame having a large difference in thermal expansion coefficient from each other.

摘要翻译： 在功率半导体装置中，功率半导体元件与镀镍的框架之间的接合部由层叠结构构成，该叠层结构由功率半导体元件侧构成，熔点为260℃以上的金属间化合物层， Cu层，熔点为260℃以上的金属层，Cu层和熔点为260℃以上的金属间化合物层。 接头的结构缓冲了在半导体元件和具有大的热膨胀系数差的框架的接合处由二次安装和温度循环产生的应力。

公开(公告)号：US20090159650A1

公开(公告)日：2009-06-25

申请号：US12232676

申请日：2008-09-22

申请人： Osamu Ikeda ,  Masato Nakamura ,  Satoshi Matsuyoshi ,  Koji Sasaki ,  Shinji Hiramitsu

发明人： Osamu Ikeda ,  Masato Nakamura ,  Satoshi Matsuyoshi ,  Koji Sasaki ,  Shinji Hiramitsu

IPC分类号： B23K35/02 ,  B23K31/00

CPC分类号： H05K3/3463 ,  B23K35/262 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29211 ,  H01L2224/29311 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32507 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/244 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01016 ,  H01L2924/01028 ,  H01L2924/01032 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material, and further including a method of producing the semiconductor device. Respective connecting parts of the support member and the lead electrode are Ni-plated and each of the first and the second bonding material is a Sn solder having a Cu6Sn5 content greater than a eutectic content.

摘要翻译： 半导体器件包括半导体元件，利用第一接合材料接合到半导体元件的第一表面的支撑构件和利用第二接合材料接合到支撑在支撑构件上的半导体元件的第二表面的引线电极，以及 还包括制造半导体器件的方法。 支撑构件和引线电极的各个连接部分是镀镍的，并且第一和第二接合材料中的每一个是Cu 6 Sn 5含量大于共晶含量的Sn焊料。

公开(公告)号：US20080122050A1

公开(公告)日：2008-05-29

申请号：US11629703

申请日：2005-06-15

申请人： Osamu Ikeda ,  Masahide Okamoto ,  Ryo Haruta ,  Hidemasa Kagii ,  Hiroi Oka ,  Hiroyuki Nakamura

发明人： Osamu Ikeda ,  Masahide Okamoto ,  Ryo Haruta ,  Hidemasa Kagii ,  Hiroi Oka ,  Hiroyuki Nakamura

IPC分类号： H01L23/495

CPC分类号： H01L23/49562 ,  H01L23/49513 ,  H01L23/49524 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05111 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29123 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/32507 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01063 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/00012 ,  H01L2924/01022 ,  H01L2924/01026 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/48744 ,  H01L2924/00015 ,  H01L2224/83205

摘要： A power semiconductor device in which a semiconductor element is die-mount-connected onto a lead frame in a Pb-free manner. In a die-mount-connection with a large difference of thermal expansion coefficient between a semiconductor element 1 and a lead frame 2, the connection is made with an intermetallic compound 200 having a melting point of 260° C. or higher or a Pb-free solder having a melting point of 260° C. or higher to 400° C. or lower, at the same time, the thermal stress produced in temperature cycles is buffered by a metal layer 100 having a melting point of 260° C. or higher. A Pb-free die-mount-connection which does not melt at the time of reflowing but have no chip crack to occur according to thermal stress can be achieved.

摘要翻译： 一种功率半导体器件，其中半导体元件以无铅方式管芯安装到引线框架上。 在半导体元件1和引线框架2之间的热膨胀系数差大的管芯安装连接中，利用熔点为260℃以上的金属间化合物200或Pb- 熔点为260℃以上且400℃以下的自由焊料，同时在温度循环中产生的热应力由熔点为260℃的金属层100缓冲，或 更高。 可以实现在回流时熔融而不会根据热应力而产生芯片裂纹的无铅模具安装连接。

公开(公告)号：US20070065110A1

公开(公告)日：2007-03-22

申请号：US11602980

申请日：2006-11-22

申请人： Masahiro Juen ,  Osamu Ikeda

发明人： Masahiro Juen ,  Osamu Ikeda

IPC分类号： H04N7/00

CPC分类号： G11B27/031 ,  G11B27/034 ,  G11B27/105 ,  G11B27/34 ,  G11B27/36 ,  G11B2220/20 ,  G11B2220/2525 ,  H04N5/775 ,  H04N5/85 ,  H04N9/8205 ,  H04N9/8227

摘要： An image reproduction device reproduces image files, which may include sound information, for example, from recording media. The image reproduction device can reproduce a group of image files following various types of editing formats within the scope of the recording capacity limited by the recording media. The recording media is capable of recording multiple image files and scenario files recorded in a predefined format, which is either the reproduction order or the reproduction style of the image files. A scenario discrimination mechanism takes the scenario files from the recording media and discriminates either the reproduction order or the reproduction style based on the file formats. A reproduction mechanism reproduces the image files read in from the recording media according to either the reproduction order or the reproduction style discriminated by the scenario discrimination mechanism.

摘要翻译： 图像再现装置例如从记录介质再现可以包括声音信息的图像文件。 图像再现装置可以在由记录介质限制的记录容量的范围内再现遵循各种类型的编辑格式的一组图像文件。 记录介质能够记录以预定格式记录的多个图像文件和场景文件，其是图像文件的再现顺序或再现风格。 情景识别机制从记录介质中取得场景文件，并根据文件格式区分再现顺序或再现风格。 再现机制根据由场景识别机构识别的再现顺序或再现风格，从记录介质再现读入的图像文件。

公开(公告)号：US20050219383A1

公开(公告)日：2005-10-06

申请号：US11139603

申请日：2005-05-31

申请人： Osamu Ikeda

发明人： Osamu Ikeda

IPC分类号： G11B31/00 ,  H04N1/21 ,  H04N5/232 ,  H04N5/77 ,  H04N5/85 ,  H04N17/00 ,  H04N21/47 ,  H04N9/73

CPC分类号： G11B31/006 ,  H04N1/2112 ,  H04N5/232 ,  H04N5/23293 ,  H04N5/772 ,  H04N5/85 ,  H04N17/00 ,  H04N17/002 ,  H04N21/47 ,  H04N2101/00

摘要： An electronic camera having a plurality of functions including capturing and recording images is provided. The electronic camera includes an operation input unit for inputting external operations that designate corresponding functions of the camera to be performed, an image pickup unit for capturing the image of an object, and a recorder for recording the image captured by the image pickup unit. The electronic camera further includes a playback unit for at least playing back image information that is recorded on the recording medium and a mode selector for selecting one operation mode of the camera from a plurality of available operation modes that include an operation explanation mode. If the operation explanation mode is selected at the mode selector, the playback unit plays back an operation guide that is pre-stored in a memory, the operation guide explaining at least one of the camera operations and functions thereof.

摘要翻译： 提供具有多个功能的电子照相机，包括拍摄和记录图像。 电子照相机包括用于输入指定要执行的相机的相应功能的外部操作的操作输入单元，用于捕获对象的图像的图像拾取单元和用于记录由图像拾取单元捕获的图像的记录器。 电子照相机还包括用于至少回放记录在记录介质上的图像信息的重放单元和用于从包括操作说明模式的多个可用操作模式中选择相机的一个操作模式的模式选择器。 如果在模式选择器处选择了操作说明模式，则播放单元播放预先存储在存储器中的操作指南，该操作指南解释了相机操作及其功能中的至少一个。

公开(公告)号：US20050199815A1

公开(公告)日：2005-09-15

申请号：US11127983

申请日：2005-05-12

申请人： Masashi Murakumo ,  Hiroaki Natori ,  Osamu Ikeda ,  Yutaka Maruta ,  Kunihiro Ikeda ,  Shinji Hidaka ,  Nobumasa Sasaki ,  Tamotsu Amamoto ,  Hiroyuki Nakashima

发明人： Masashi Murakumo ,  Hiroaki Natori ,  Osamu Ikeda ,  Yutaka Maruta ,  Kunihiro Ikeda ,  Shinji Hidaka ,  Nobumasa Sasaki ,  Tamotsu Amamoto ,  Hiroyuki Nakashima

IPC分类号： G01J1/42 ,  G03B7/16 ,  G03B7/28 ,  G03B15/00 ,  G03B15/02 ,  G03B15/05 ,  G03B17/18 ,  H04N5/235 ,  H04N5/238

CPC分类号： H04N5/2354

摘要： In an irradiation control device which extends a longevity of an LED, a feedback control is performed to an irradiating portion by an output signal of a photo device provided in relation to the irradiating portion, thereby making brightness fixed. Alternatively, by performing image processing to an image taken by a camera, brightness on a screen is calculated, so that a feedback control is performed to the irradiating portion to make the brightness fixed. Alternatively, based on a recognition rate upon character recognition within the image taken by the camera, a feedback control is performed to the irradiating portion to make the brightness fixed.

摘要翻译： 在延长LED寿命的照射控制装置中，通过相对于照射部设置的照相装置的输出信号对照射部分进行反馈控制，从而使亮度固定。 或者，通过对摄像机拍摄的图像进行图像处理，计算屏幕上的亮度，对照射部分进行反馈控制，使亮度固定。 或者，基于通过照相机拍摄的图像中的字符识别的识别率，对照射部分执行反馈控制以使亮度固定。

公开(公告)号：US20050190277A1

公开(公告)日：2005-09-01

申请号：US11118430

申请日：2005-05-02

申请人： Masahiro Juen ,  Kenji Toyoda ,  Osamu Ikeda ,  Hisato Ide

发明人： Masahiro Juen ,  Kenji Toyoda ,  Osamu Ikeda ,  Hisato Ide

IPC分类号： G06F3/14 ,  G06F3/041 ,  G06F3/048 ,  G06T1/00 ,  G09G5/00 ,  G09G5/08 ,  H04N1/00 ,  H04N5/225 ,  H04N5/232 ,  H04N5/765 ,  H04N5/781 ,  G03C5/00

CPC分类号： G06F3/033 ,  G06F3/04845 ,  G06T1/00 ,  H04N1/00352 ,  H04N1/00397 ,  H04N1/00411 ,  H04N2101/00

摘要： An image processing apparatus provided with a display unit for displaying an operation picture, showing control indicia (e.g., icons) corresponding to multiple image processing functions, is operated to display the operation picture on an external display device. The operator selects one of the indicia shown on the external display device by operating an input device, such as touch screen of the apparatus or a remote control, to indicate the position of the desired one of the indicia. The operator can thereby quickly and reliably select an image processing function to be executed, without any need to view an operation picture on the display unit when making the selection.

摘要翻译： 操作具有用于显示操作画面的显示单元的图像处理设备，显示与多个图像处理功能对应的控制标记（例如，图标），以在外部显示设备上显示操作画面。 操作者通过操作诸如设备的触摸屏或遥控器的输入设备来指示所需的一个标记的位置来选择外部显示设备上所示的一个标记。 因此，操作者能够快速，可靠地选择要执行的图像处理功能，而不需要在进行选择时在显示单元上观看操作画面。

公开(公告)号：US20050093125A1

公开(公告)日：2005-05-05

申请号：US11005438

申请日：2004-12-06

申请人： Minori Kajimoto ,  Osamu Ikeda ,  Masaki Momodomi

发明人： Minori Kajimoto ,  Osamu Ikeda ,  Masaki Momodomi

IPC分类号： B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H01L23/12 ,  H01L23/498 ,  H01L23/02

CPC分类号： H01L23/49855 ,  G06K19/077 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises a substrate, an external terminal provided on the substrate, an internal wiring pattern electrically connected to the external terminal, a semiconductor chip mounted on the substrate and electrically connected to the internal wiring pattern, and an antenna pattern. The antenna pattern provided at each of adjacent two corner portions of the substrate and is grounded.

摘要翻译： 半导体器件包括衬底，设置在衬底上的外部端子，与外部端子电连接的内部布线图案，安装在衬底上并电连接到内部布线图案的半导体芯片和天线图案。 天线图案设置在基板的相邻两个角部的每一个处并接地。

公开(公告)号：US06853005B2

公开(公告)日：2005-02-08

申请号：US10771513

申请日：2004-02-05

申请人： Osamu Ikeda

发明人： Osamu Ikeda

IPC分类号： G02B7/02 ,  G02B3/00 ,  G02B5/28 ,  H04N5/225 ,  H04N5/335 ,  H04N5/372 ,  H01L29/04

CPC分类号： H04N5/2253 ,  H04N5/2254

摘要： A camera module for a mobile device is reduced in size and manufacturing cost. A filter material made of a multi-layer thin film is bonded to a surface of a lens which is bonded to a surface of an image sensor chip. The filter material is a filter to block radiation within a predetermined range of wave length in an incident radiation to the lens, for example, an IR filter to block infrared radiation. An iris material made of a film such as an acrylic film or a polyolefin film is bonded to the lens covered with the filter material.

摘要翻译： 用于移动设备的相机模块的尺寸和制造成本降低。 将由多层薄膜制成的过滤材料粘合到与图像传感器芯片的表面接合的透镜的表面上。 过滤材料是一种过滤器，用于在入射到透镜的辐射范围内阻挡预定波长范围内的辐射，例如IR滤光片以阻挡红外辐射。 由诸如丙烯酸膜或聚烯烃膜的膜制成的虹膜材料被粘合到被过滤材料覆盖的透镜上。