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公开(公告)号：US20180182926A1
公开(公告)日：2018-06-28
申请号：US15738427
申请日：2016-07-12
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Markus Maute , Lutz Höppel , Jürgen Moosburger , Thomas Schwarz , Matthias Sabathil , Ralph Wirth , Alexander Linkov , Johannes Baur
CPC classification number: H01L33/46 , H01L33/20 , H01L33/24 , H01L33/30 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/60 , H01L33/62 , H01L2933/0083 , H01L2933/0091
Abstract: A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.
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82.发明申请公开(公告)号：US20180145234A1
公开(公告)日：2018-05-24
申请号：US15577045
申请日：2016-05-19
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Andreas Biebersdorf , Dirk Becker , Bernd Barchmann , Björn Hoxhold , Philipp Schlosser , Andreas Waldschik
IPC: H01L33/60 , H01L33/62 , H01L33/00 , H01L25/075
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/005 , H01L33/486 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48137 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2933/0033 , H01L2933/0075 , H01L2924/00012 , H01L2224/4554
Abstract: A method of producing optoelectronic semiconductor components includes providing a carrier with a carrier underside and a carrier top, wherein the carrier has a metallic core material and at least on the carrier top a metal layer and following this a dielectric mirror are applied to the core material, forming at least two holes through the carrier, producing a ceramic layer with a thickness of at most 150 μm at least on the carrier underside and in the holes, wherein the ceramic layer includes the core material as a component, applying metallic contact layers to at least subregions of the ceramic layer on the carrier underside and in the holes so that the carrier top electrically connects to the carrier underside through the holes, and applying at least one radiation-emitting semiconductor chip to the carrier top and electrical bonding of the semiconductor chip to the contact layers.
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公开(公告)号：US20180076370A1
公开(公告)日：2018-03-15
申请号：US15565239
申请日：2016-04-07
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Martin Haushalter , Frank Singer , Thomas Schwarz , Andreas Ploessl
CPC classification number: H01L33/642 , H01L33/005 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2924/00014
Abstract: A light-emitting component includes a light-emitting chip and a housing including a plastic body and a reflector, the reflector includes an electrically conductive layer, the light-emitting chip includes a top side and an underside, the underside of the light-emitting chip is arranged on the plastic body, an electrical terminal on the top side of the light-emitting chip electrically conductively connects to the reflector by a bond wire, the underside of the light-emitting chip and the reflector are electrically insulated from one another, a conduction region is provided within the plastic body, thermal conductivity of the conduction region is greater than thermal conductivity of the plastic body, the conduction region adjoins the underside of the light-emitting chip, and the conduction region extends from the side of the plastic body facing the light-emitting chip as far as the side of the plastic body facing away from the light-emitting chip.
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公开(公告)号：US20170338384A1
公开(公告)日：2017-11-23
申请号：US15534155
申请日：2015-12-04
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Frank Singer
CPC classification number: H01L33/486 , H01L21/568 , H01L24/95 , H01L33/0079 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/01 , H01L2224/24 , H01L2224/82 , H01L2924/0002 , H01L2924/181 , H01L2933/0033 , H01L2933/005
Abstract: A semiconductor device and a method for producing a plurality of semiconductor devices are disclosed. In an embodiment an optoelectronic semiconductor device includes a semiconductor chip having a semiconductor layer sequence with an active region, a radiation exit surface arranged parallel to the active region and a plurality of side faces arranged obliquely or perpendicular to the radiation exit surface. The device further includes a contact track electrically connecting the semiconductor chip to a contact surface configured to externally contact the semiconductor device, a molding and a rear side of the semiconductor chip remote from the radiation exit surface, the rear side being free of a material of the molding, wherein one of the side faces is configured as a mounting side face for fastening of the semiconductor device, and wherein the contact track runs on one of the side faces in places.
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公开(公告)号：US09780269B2
公开(公告)日：2017-10-03
申请号：US15022535
申请日：2014-08-25
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Frank Singer , Jürgen Moosburger
CPC classification number: H01L33/54 , H01L21/568 , H01L33/0095 , H01L33/486 , H01L33/52 , H01L33/62 , H01L2224/04105 , H01L2224/19 , H01L2224/2518 , H01L2224/82 , H01L2224/96 , H01L2924/1815 , H01L2933/0033 , H01L2933/005 , H01L2933/0066
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor that is partly embedded into a shaped body, which is formed from a molding compound that at least partly covers at least two lateral faces and the rear surface of the optoelectronic semiconductor chip. A first contact layer and a second contact layer are arranged on the shaped body and are electrically connected to the optoelectronic semiconductor chip. A mounting face is arranged transversely in relation to the radiation passage face and is provided for mounting the optoelectronic semiconductor component.
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Patent Agency Ranking
公开(公告)号：US09691682B2
公开(公告)日：2017-06-27
申请号：US14413748
申请日：2013-07-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Stefan Illek , Thomas Schwarz
IPC: H01L31/0232 , H01L23/373 , H01L33/64 , H01L31/024
CPC classification number: H01L23/3731 , H01L31/024 , H01L33/56 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48464 , H01L2924/181 , H01L2933/0075 , H01L2924/00014 , H01L2924/00012
Abstract: An optoelectronic semiconductor component includes an optoelectronic thin-film chip; and a thermally conductive and electrically insulating element, wherein both the thin-film chip and the element are embedded in a molded body, a top surface of the thin-film chip and a bottom surface of the element are not covered by the molded body, the top surface of the thin-film chip is approximately flush with a top surface of the molded body, the bottom surface of the element is approximately flush with a bottom surface of the molded body, the molded body includes a first embedded conductor structure and a second embedded conductor structure, and the first conductor structure and the second conductor structure extends to the bottom surface of the molded body.
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公开(公告)号：US20170077361A1
公开(公告)日：2017-03-16
申请号：US15122680
申请日：2015-03-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Martin Brandl , Tobias Gebuhr , Thomas Schwarz
CPC classification number: H01L33/507 , H01L24/97 , H01L33/0095 , H01L33/486 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48471 , H01L2224/48479 , H01L2924/00014 , H01L2924/181 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2924/00012 , H01L2224/4554
Abstract: A method of producing optoelectronic components includes providing a carrier; arranging optoelectronic semiconductor chips on the carrier; forming a conversion layer for radiation conversion on the carrier, wherein the optoelectronic semiconductor chips are surrounded by the conversion layer; and carrying out a singulation process to form separate optoelectronic components, wherein at least the conversion layer is severed.
Abstract translation: 制造光电子部件的方法包括提供载体; 在载体上布置光电子半导体芯片; 在所述载体上形成用于辐射转换的转换层，其中所述光电半导体芯片被所述转换层包围; 并执行单一化处理以形成分离的光电子部件，其中至少转换层被切断。
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88.发明授权公开(公告)号：US09583467B2
公开(公告)日：2017-02-28
申请号：US14430215
申请日：2013-09-06
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Illek , Thomas Schwarz , Jürgen Moosburger , Walter Wegleiter
IPC: H01L25/075 , H01L33/50 , H01L33/62 , H01L33/52 , H01L33/64
CPC classification number: H01L25/0753 , H01L33/505 , H01L33/52 , H01L33/62 , H01L33/644 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2933/0075 , H01L2924/00
Abstract: An optoelectronic semiconductor component and a method for making an optoelectronic semiconductor component are disclosed. In an embodiment the component includes a carrier including at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places, as seen in plan view, electrical contact structures fitted at least indirectly to the carrier and a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the optoelectronic semiconductor chips configured to generate radiation, wherein the conversion-medium body is shaped as a plate, wherein the semiconductor chips are directly mechanically connected to the conversion-medium body, and wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structure.
Abstract translation: 公开了一种光电子半导体部件和制造光电半导体部件的方法。 在一个实施例中，部件包括载体，该载体包括至少一个转化介质体和灌封体，灌封体至少在一些地方围绕转化介质体，如平面图所示，电接触结构至少间接地安装在 载体和安装在载体的主面上的多个光电半导体芯片，所述光电子半导体芯片被配置为产生辐射，其中所述转换介质体被成形为板，其中所述半导体芯片直接机械地连接到所述转换 - 中间体，并且其中所述转换介质主体没有用于所述电接触结构的切口并且不被所述电接触结构穿透。
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89.发明申请公开(公告)号：US20160225964A1
公开(公告)日：2016-08-04
申请号：US15022535
申请日：2014-08-25
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Thomas Schwarz , Frank Singer , Jürgen Moosburger
CPC classification number: H01L33/54 , H01L21/568 , H01L33/0095 , H01L33/486 , H01L33/52 , H01L33/62 , H01L2224/04105 , H01L2224/19 , H01L2224/2518 , H01L2224/82 , H01L2224/96 , H01L2924/1815 , H01L2933/0033 , H01L2933/005 , H01L2933/0066
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor that is partly embedded into a shaped body, which is formed from a molding compound that at least partly covers at least two lateral faces and the rear surface of the optoelectronic semiconductor chip. A first contact layer and a second contact layer are arranged on the shaped body and are electrically connected to the optoelectronic semiconductor chip. A mounting face is arranged transversely in relation to the radiation passage face and is provided for mounting the optoelectronic semiconductor component.
Abstract translation: 光电子半导体部件包括部分地嵌入到成形体中的光电子半导体，其由至少部分地覆盖光电子半导体芯片的至少两个侧面和后表面的模制化合物形成。 第一接触层和第二接触层布置在成形体上并与光电子半导体芯片电连接。 安装面相对于辐射通道面横向布置，并且用于安装光电子半导体部件。
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公开(公告)号：US20160155891A1
公开(公告)日：2016-06-02
申请号：US14900243
申请日：2014-06-25
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Jürgen Moosburger , Ion Stoll , Thomas Schwarz , Markus Richter , Georg Dirscherl
CPC classification number: H01L33/005 , H01L24/24 , H01L25/167 , H01L27/15 , H01L33/44 , H01L33/502 , H01L33/505 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058 , H01L2933/0066
Abstract: An optoelectronic component includes an optoelectronic semiconductor chip embedded in a molded body such that an upper side of the optoelectronic semiconductor chip is at least partially not covered by the molded body, wherein a first metallization is arranged on an upper side of the molded body, wherein the first metallization is electrically insulated from the optoelectronic semiconductor chip, and a first material is arranged on the first metallization.
Abstract translation: 光电子部件包括嵌入到成型体中的光电半导体芯片，使得光电子半导体芯片的上侧至少部分地不被成型体覆盖，其中第一金属化被布置在成型体的上侧，其中 第一金属化与光电子半导体芯片电绝缘，并且第一材料布置在第一金属化上。
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